公开(公告)号：EP2871645A4

公开(公告)日：2016-06-29

申请号：EP13813704

申请日：2013-02-28

申请人： ISHIHARA CHEMICAL CO LTD

发明人： KAWATO YUICHI ,  MIYAMOTO KAZUSHIGE ,  MAEDA YUSUKE ,  KUDO TOMIO

IPC分类号： H01B13/00 ,  B22F3/22 ,  B22F7/04 ,  B22F9/00 ,  C09D11/322 ,  C09D11/52 ,  H01B1/02 ,  H05K3/10 ,  H05K3/12

CPC分类号： H01B13/003 ,  C09D11/322 ,  C09D11/52 ,  C23C18/1216 ,  C23C18/1295 ,  C23C18/14 ,  H01B1/026 ,  H01B13/322 ,  H05K3/105 ,  H05K3/1283 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/1476

摘要： In a conductive film forming method using photo sintering, a conductive film having low electric resistance is easily formed. Disclosed is a conductive film forming method in which a conductive film is formed using a photo sintering, which includes the steps of: forming a liquid film 2 made of a copper particulate dispersion on a substrate 1, drying the liquid film 2 to form a copper particulate layer 3, subjecting the copper particulate layer 3 to photo sintering to form a conductive film 4, attaching a sintering promoter 5 to the conductive film 4, and further subjecting the conductive film 4 having the sintering promoter 5 attached to photo sintering. The sintering promoter 5 is a compound which removes copper oxide from metallic copper. Thereby, the sintering promoter 5 removes a surface oxide film of copper particulates 21 in the conductive film 4.