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1.发明公开
公开(公告)号：EP4350748A1
公开(公告)日：2024-04-10
申请号：EP21943134.3
申请日：2021-06-15
IPC分类号： H01L21/60
摘要： A structure including a solder layer of the present invention includes a substrate 10, a solder layer 12 formed on the substrate, and an under barrier metal 11 formed as an alloy layer containing Fe and Co between the substrate 10 and the solder layer 12, and internal stress of the under barrier metal 11 is 260 Mpa or less.
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公开(公告)号：EP3192595B1
公开(公告)日：2019-04-17
申请号：EP14901450.8
申请日：2014-09-11
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公开(公告)号：EP2281020B1
公开(公告)日：2016-09-28
申请号：EP09747709.5
申请日：2009-05-15
发明人： LI, Yunjun , ROUNDHILL, David Max , YANG, Mohshi , PAVLOVSKY, Igor , FINK, Richard Lee , YANIV, Zvi
CPC分类号： H05K3/1283 , H05K2201/0257 , H05K2203/107 , H05K2203/1131
摘要： A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.
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4.发明公开CIRCUIT BOARD, METHOD FOR FORMING CONDUCTIVE FILM, AND ADHESION IMPROVER 审中-公开LEITERPLATTE，VERFAHREN ZUR BILDUNG EINESLEITFÄHIGENFILMS UND HAFTVERBESSERER
公开(公告)号：EP2869677A1
公开(公告)日：2015-05-06
申请号：EP13808900.8
申请日：2013-02-28
发明人： KAWATO, Yuichi , MITA, Tomohiro , MAEDA, Yusuke , KUDO, Tomio
CPC分类号： H05K3/38 , H05K1/0296 , H05K1/0313 , H05K1/097 , H05K3/245 , H05K3/246 , H05K3/386 , H05K2201/0129 , H05K2201/0137 , H05K2201/0154 , H05K2201/032 , H05K2203/1126 , H05K2203/1131 , Y10T29/49163
摘要： In a conductive film formed by photo sintering of a film composed of copper particulates, adhesiveness to a base material of the conductive film is improved.
A circuit board 1 includes a circuit including a conductive film 2, and a substrate 3. The circuit board 1 further includes a resin layer 4 between the substrate 3 and the conductive film 2. The substrate 3 is made of a non-thermoplastic base material 31. The resin layer 4 contains a thermoplastic resin. The conductive film 2 is formed by photo sintering of a film composed of copper particulates 21, and thus improving adhesiveness of the conductive film 2 to the base material 31 through the resin layer 4.摘要翻译： 在通过由铜微粒构成的膜的光烧结而形成的导电膜中，与导电膜的基材的粘合性提高。 电路板1包括具有导电膜2和基板3的电路。电路板1还包括在基板3和导电膜2之间的树脂层4.基板3由非热塑性基材 树脂层4含有热塑性树脂。 导电膜2通过由铜微粒21构成的膜进行光烧结而形成，从而提高导电膜2通过树脂层4与基材31的密合性。
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5.发明公开COPPER PARTICLE DISPERSION, CONDUCTIVE FILM FORMATION METHOD, AND CIRCUIT SUBSTRATE 审中-公开铜粒子分散体，导电膜和开关衬底的制造方法
公开(公告)号：EP2738773A4
公开(公告)日：2015-04-08
申请号：EP12849820
申请日：2012-01-04
发明人： KAWATO YUICHI , MAEDA YUSUKE , KUDO TOMIO
CPC分类号： C09D11/52 , C09D11/03 , C09D11/38 , H01B1/026 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H05K1/092 , H05K1/095 , H05K1/097 , H05K2203/0514 , H01L2924/00
摘要： An object is to provide a copper particulate dispersion which is suited to discharge in the form of droplets. The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle having a boiling point within a range from 150°C to 250°C. Whereby, when the copper particulate dispersion is discharged in the form of droplets, clogging at the discharge portion caused by drying of the dispersion vehicle is prevented and the viscosity is low for its high boiling point, and thus the copper particulate dispersion is suited to discharge in the form of droplets.
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6.发明授权Colored, transparent film-forming composition, its coating method and removing method of a film thereof 有权有色的，透明的膜形成组合物，用于涂覆和工艺用于从它们产生的去除膜的方法
公开(公告)号：EP1134262B1
公开(公告)日：2006-05-03
申请号：EP01102221.7
申请日：2001-01-31
发明人： Arimoto, Kunio, c/o Ishihara Chemical Co., Ltd. , Tago, Chihito, c/o Ishihara Chemical Co., Ltd. , Nishida, Hideo, c/o Ishihara Chemical Co., Ltd. , Maehara, Yasuhiro, c/o Ishihara Chemical Co., Ltd. , Ohta, Tatsuya , Yoshihara, Kazutoshi , Sawamura, Satoshi
IPC分类号： C09D5/00 , C09D183/08 , C09D183/14
CPC分类号： C09D183/08 , C09D183/14 , Y10T428/31663 , C08L2666/28
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7.发明公开Colored, transparent film-forming composition, its coating method and removing method of a film thereof 有权有色的，透明成膜组合物，涂覆方法和工艺用于除去的膜的
公开(公告)号：EP1134262A3
公开(公告)日：2002-12-18
申请号：EP01102221.7
申请日：2001-01-31
发明人： Arimoto, Kunio, c/o Ishihara Chemical Co., Ltd. , Tago, Chihito, c/o Ishihara Chemical Co., Ltd. , Nishida, Hideo, c/o Ishihara Chemical Co., Ltd. , Maehara, Yasuhiro, c/o Ishihara Chemical Co., Ltd. , Ohta, Tatsuya , Yoshihara, Kazutoshi , Sawamura, Satoshi
IPC分类号： C09D5/00 , C09D183/08 , C09D183/14
CPC分类号： C09D183/08 , C09D183/14 , Y10T428/31663 , C08L2666/28
摘要： A colored, transparent film-forming composition, which comprises (a) a reaction product of an epoxy group-containing alkoxysilane (a-1) and an amino group-containing alkoxysilane (a-2) having active hydrogen therein, (b) an acid catalyst, (c) an alkali-soluble UV absorber, (d) at least one solvent selected from organic solvents having a boiling point of 100 to 250° C, and (e) a dye and/or a pigment, has a good coating performance, a good room temperature curing characteristic and can provide a film having good film strength and good film removability after use. The coating method of the composition and the removing method of the film obtained from the composition are also described.
摘要翻译： 有色的，透明的膜形成组合物，其包含（a）一种含环氧基的烷氧基硅烷（A-1）的反应产物和氨基的基团的烷氧基硅烷（A-2）具有活性氢在其中，（b）中在 酸催化剂，（c）一种碱溶性紫外线吸收剂，（D）由具有100的沸点的有机溶剂中选择，以250℃的至少一种溶剂，和（e）的染料和/或颜料，具有良好的 涂层的性能，良好的室温固化特性，并且可以提供具有使用后良好的膜强度和良好的薄膜的可除去的膜。 因此所描述的组合物和从所述组合物得到的膜的制造方法的涂覆方法。
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公开(公告)号：EP0588326A2
公开(公告)日：1994-03-23
申请号：EP93114863.9
申请日：1993-09-15
IPC分类号： C09G1/14 , C09D121/00 , C09D183/04
CPC分类号： C09G1/14 , B60C13/001 , B60C13/002 , C09D183/04 , C08L2666/26 , C08L2666/04
摘要： The invention provides a tire polishing and protective composition comprising, as dissolved or dispersed in an organic solvent, 2 to 25% by weight of a silicone varnish, 0.1 to 4% by weight of a rubber type polymer and 0.1 to 10% by weight of a tackifier.
摘要翻译： 本发明提供一种轮胎抛光和保护性组合物，其包含溶解或分散在有机溶剂中的2至25重量％的硅氧烷清漆，0.1至4重量％的橡胶类聚合物和0.1至10重量％ 增粘剂
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公开(公告)号：EP0192273A1
公开(公告)日：1986-08-27
申请号：EP86102271.3
申请日：1986-02-21
发明人： Obata, Keigo , Dohi, Nobuyasu , Okuhama, Yoshiaki , Masaki, Seishi , Okada, Yukiyoshi , Yoshimoto, Masakazu
摘要： A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula
wherein R is a C 1-4 hydrocarbon radical, M 1 is a hydrogen atom or alkali metal atom, M 2 is an alkali metal atom, and X 1 and X 2 are each a hydrogen atom, OH, COON, or SO 3 N (where N represents a hydrogen atom or alkali metal atom).-
公开(公告)号：EP0172267A1
公开(公告)日：1986-02-26
申请号：EP84109981.5
申请日：1984-08-22
发明人： Obata, Keigo , Dohi, Nobuyasu , Okuhama, Yoshiaki , Masaki, Seishi , Okada, Yukiyoshi , Yoshida, Tadashi
IPC分类号： C25D3/60
CPC分类号： C25D3/60 , H05K3/3473
摘要： A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula
wherein R, and R 2 , which may be the same or different, present each a hydrogen atom, C 1-18 straight- or branched-chain alkyl radical, C 1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C 3-7 cycloalkyl radical, or R 1 and R 2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.摘要翻译： 基于包含烷烃磺酸或链烷醇磺酸的二次锡和铅盐的主镀液的锡铅合金电镀槽的特征在于加入通式为CHEM的胍胺化合物，其中R 1和R 2可以 相同或不同，各自表示氢原子，C1-18直链或支链烷基，C1-18直链或支链烷氧基 - 低级烷基或C3-7环烷基，或R1和 R2可以结合形成碳循环或杂环，A代表低级亚烷基。
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