公开(公告)号：EP2648496B1

公开(公告)日：2019-05-01

申请号：EP13173395.8

申请日：2011-06-23

申请人： Inertech IP LLC

发明人： Keisling, Earl ,  Costakis, John ,  McDonnell, Gerald

IPC分类号： H05K7/20

公开(公告)号：EP2648496A2

公开(公告)日：2013-10-09

申请号：EP13173395.8

申请日：2011-06-23

申请人： Inertech IP LLC

发明人： Keisling, Earl ,  Costakis, John ,  McDonnell, Gerald

IPC分类号： H05K7/20

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒系统和节能冷却系统。 模块化数据盒系统包括中央自由冷却系统和多个模块化数据盒，每个模块化数据盒包括耦合到中央自由冷却系统的热交换组件和耦合到热交换组件的分布式机械冷却系统。 模块化数据盒包括具有布置成多边形形状的至少五个墙壁的数据外壳，以圆形或U形图案布置的多个计算机机架和用于产生热和冷通道的盖子，以及空气循环器 被配置为在热通道和冷通道之间连续地循环空气。 每个模块化数据盒还包括包含共享流体和电路部分的辅助外壳，其配置成连接到相邻的共享流体和电路部分，以形成连接到中央自由冷却系统的共用流体和电路。 辅助外壳包含分布式机械冷却系统的至少一部分，其被配置为修剪由中央自由冷却系统执行的冷却。

公开(公告)号：EP4177543A1

公开(公告)日：2023-05-10

申请号：EP22208708.2

申请日：2013-10-09

申请人： Inertech IP LLC

发明人： McDonnell, Gerald ,  Keisling, Earl

IPC分类号： F25B41/00 ,  F25B25/00 ,  F25B5/04 ,  F25D17/02 ,  F25B23/00

摘要： The cooling systems and methods of the present disclosure relate to a plural in-series pumped liquid refrigerant trim evaporator cycle that may be incorporated into an existing cooling system to increase the efficiency of the existing cooling system. The cooling systems of the present disclosure include a first evaporator coil in thermal communication with an air intake flow to a heat load, such as a heat load being cooled by the existing cooling system, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further includes a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil. A trim compression cycle of the second liquid refrigerant distribution unit is configured to incrementally further cool the air intake flow through the second evaporator coil when the temperature of the free-cooled first fluid flowing out of the main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.

公开(公告)号：EP2648496A3

公开(公告)日：2017-11-01

申请号：EP13173395.8

申请日：2011-06-23

申请人： Inertech IP LLC

发明人： Keisling, Earl ,  Costakis, John ,  McDonnell, Gerald

IPC分类号： H05K7/20

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒系统和高能效冷却系统。 模块化数据盒系统包括中央自由冷却系统和多个模块化数据盒，每个模块化数据盒包括耦合到中央自由冷却系统的热交换组件和耦合到热交换组件的分布式机械冷却系统。 模块化数据盒包括数据机箱，该数据机箱具有布置成多边形形状的至少五个壁，布置成圆形或U形图案的多个计算机机架以及用于形成冷热通道的盖，以及空气循环器 配置为在热通道和冷通道之间连续循环空气。 每个模块化数据盒还包括包含共享流体和电路部分的辅助外壳，该辅助外壳被配置为连接到相邻的共享流体和电路部分以形成连接到中央自由冷却系统的共享流体和电路。 辅助外壳包含分布式机械冷却系统的至少一部分，其被配置为修整由中央自由冷却系统执行的冷却。