PIPETTENVORRICHTUNG UND VERFAHREN ZU DEREN HERSTELLUNG

    公开(公告)号:EP1399262B1

    公开(公告)日:2004-10-13

    申请号:EP02754726.4

    申请日:2002-06-20

    IPC分类号: B01L3/02 B01L3/00

    摘要: The invention relates to a device, especially for patch-clamping vesicles and/or for dispensing small, defined liquid amounts onto surfaces. The device is characterized in that in a substrate (2) at least one pipette in the form of a through hole (8) with a predetermined diameter is produced, a rim (16) of the through hole (8) protruding from a neighboring surface (4) of the substrate (2) by a predetermined length. The invention further relates to a method for producing the device, comprising the following steps: producing at least one hole (8), forming at least one modified surface layer (12) on at least the inner surfaces of the hole (8), selectively removing the substrate (2), the modified surface layer (12) not being substantially affected so that it protrudes from a surface (4) of the substrate and forms a protruding rim (16), and finishing the hole (8) as a through hole in a suitable process step.

    摘要翻译: 本发明涉及一种装置,尤其是用于贴片囊泡和/或用于将少量限定的液体量分配到表面上的装置。 该装置的特征在于,在基板(2)中制造至少一个具有预定直径的通孔(8)形式的移液管,通孔(8)的边缘(16)从相邻表面 (4)的预定长度。 本发明还涉及一种用于制造该装置的方法,包括以下步骤:制造至少一个孔(8),在孔(8)的至少内表面上形成至少一个改性表面层(12),选择性地 去除基底(2),修饰的表面层(12)基本上不受影响,使得它从基底的表面(4)突出并形成突出边缘(16),并且将孔(8)作为通孔 在合适的工艺步骤中钻孔。

    PIPETTENVORRICHTUNG UND VERFAHREN ZU DEREN HERSTELLUNG
    5.
    发明公开
    PIPETTENVORRICHTUNG UND VERFAHREN ZU DEREN HERSTELLUNG 有权
    移液器装置和方法及其

    公开(公告)号:EP1399262A1

    公开(公告)日:2004-03-24

    申请号:EP02754726.4

    申请日:2002-06-20

    IPC分类号: B01L3/02 B01L3/00

    摘要: The invention relates to a device, especially for patch-clamping vesicles and/or for dispensing small, defined liquid amounts onto surfaces. The device is characterized in that in a substrate (2) at least one pipette in the form of a through hole (8) with a predetermined diameter is produced, a rim (16) of the through hole (8) protruding from a neighboring surface (4) of the substrate (2) by a predetermined length. The invention further relates to a method for producing the device, comprising the following steps: producing at least one hole (8), forming at least one modified surface layer (12) on at least the inner surfaces of the hole (8), selectively removing the substrate (2), the modified surface layer (12) not being substantially affected so that it protrudes from a surface (4) of the substrate and forms a protruding rim (16), and finishing the hole (8) as a through hole in a suitable process step.