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    A METHOD OF MANUFACTURING A PLURALITY OF THROUGH-HOLES IN A LAYER
    1.
    发明公开
    A METHOD OF MANUFACTURING A PLURALITY OF THROUGH-HOLES IN A LAYER 审中-公开
    一种在一层中制造多个通孔的方法

    公开(公告)号：EP3210937A1

    公开(公告)日：2017-08-30

    申请号：EP17158214.1

    申请日：2017-02-27

    Applicant: SmartTip B.V.

    Inventor： SARAJLIC, Edin

    IPC: B81C1/00 ,  A61B5/15

    CPC classification number: B81C1/0015 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150396 ,  A61B5/150511 ,  A61B5/150519 ,  A61B5/150984 ,  A61B5/15142 ,  A61M37/0015 ,  B81B2201/057 ,  B81B2201/12 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00111 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0198 ,  C01B21/0687

    Abstract: A method of manufacturing a plurality of through-holes (132) in a layer of first material, for example for the manufacturing of a probe (100) comprising a tip containing a channel. To manufacture the through-holes (132) in a batch process,
    - a layer of first material is deposited on a wafer (200) comprising a plurality of pits (210)
    - a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits (210);
    - using the second layer as a shadow mask when depositing a third layer (240) at an angle, covering a part of the first material with said third material (240) at the central locations, and
    - etching the exposed parts of the first layer using the third layer (240) as a protective layer.

    Abstract translation: 一种在第一材料层中制造多个通孔（132）的方法，例如用于制造包括包含通道的尖端的探针（100）。 为了以间歇工艺制造通孔（132）， - 在包括多个凹坑（210）的晶片（200）上沉积第一材料层 - 在第一材料层上提供第二层，以及 第二层在凹坑（210）的中心位置设置有多个孔; - 当以一定角度沉积第三层（240）时，使用第二层作为阴影掩模，在中心位置处用所述第三材料（240）覆盖第一材料的一部分，以及 - 蚀刻第一层 使用第三层（240）作为保护层。

    PIPETTENVORRICHTUNG UND VERFAHREN ZU DEREN HERSTELLUNG
    3.
    发明授权
    PIPETTENVORRICHTUNG UND VERFAHREN ZU DEREN HERSTELLUNG 有权

    公开(公告)号：EP1399262B1

    公开(公告)日：2004-10-13

    申请号：EP02754726.4

    申请日：2002-06-20

    Applicant: Infineon Technologies AG

    Inventor： FRITZ, Michaela ,  DERTINGER, Stephan ,  FUCHS, Karin ,  HANEDER, Thomas ,  HANKE, Hans-Christian ,  JENKNER, Martin ,  LEHMANN, Volker ,  PAULUS, Christian

    IPC: B01L3/02 ,  B01L3/00

    CPC classification number: B81C1/00087 ,  B01L3/0241 ,  B81B2201/057

    Abstract: The invention relates to a device, especially for patch-clamping vesicles and/or for dispensing small, defined liquid amounts onto surfaces. The device is characterized in that in a substrate (2) at least one pipette in the form of a through hole (8) with a predetermined diameter is produced, a rim (16) of the through hole (8) protruding from a neighboring surface (4) of the substrate (2) by a predetermined length. The invention further relates to a method for producing the device, comprising the following steps: producing at least one hole (8), forming at least one modified surface layer (12) on at least the inner surfaces of the hole (8), selectively removing the substrate (2), the modified surface layer (12) not being substantially affected so that it protrudes from a surface (4) of the substrate and forms a protruding rim (16), and finishing the hole (8) as a through hole in a suitable process step.

    Abstract translation: 本发明涉及一种装置，尤其是用于贴片囊泡和/或用于将少量限定的液体量分配到表面上的装置。 该装置的特征在于，在基板（2）中制造至少一个具有预定直径的通孔（8）形式的移液管，通孔（8）的边缘（16）从相邻表面 （4）的预定长度。 本发明还涉及一种用于制造该装置的方法，包括以下步骤：制造至少一个孔（8），在孔（8）的至少内表面上形成至少一个改性表面层（12），选择性地 去除基底（2），修饰的表面层（12）基本上不受影响，使得它从基底的表面（4）突出并形成突出边缘（16），并且将孔（8）作为通孔 在合适的工艺步骤中钻孔。

    A METHOD OF MANUFACTURING A PLURALITY OF THROUGH-HOLES IN A LAYER OF MATERIAL
    4.
    发明公开
    A METHOD OF MANUFACTURING A PLURALITY OF THROUGH-HOLES IN A LAYER OF MATERIAL 审中-公开
    一种在材料层中制造多个通孔的方法

    公开(公告)号：EP3210935A1

    公开(公告)日：2017-08-30

    申请号：EP17158193.7

    申请日：2017-02-27

    Applicant: Universiteit Twente

    Inventor： BERENSCHOT, Johan Willem ,  TAS, Niels Roelof

    IPC: B81C1/00

    CPC classification number: B81B1/004 ,  B81B2201/057 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/0361 ,  B81B2203/0369 ,  B81C1/00087 ,  B81C1/00111 ,  B81C2201/0132

    Abstract: A method of manufacturing a plurality of through-holes (132) in a layer of material by subjecting the layer to directional dry etching to provide through-holes (132) in the layer of material; For batch-wise production, the method comprises
    - after a step of providing a layer of first material (220) on base material and before the step of directional dry etching, providing a plurality of holes at the central locations of pits (210),
    - etching base material at the central locations of the pits (210) so as to form a cavity (280) with an aperture (281),
    - depositing a second layer of material (240) on the base material in the cavity (280), and
    - subjecting the second layer of material (240) in the cavity (280) to said step of directional dry etching using the aperture (281) as the opening (141) of a shadow mask.

    Abstract translation: 一种在材料层中制造多个通孔（132）的方法，通过对该层进行定向干法蚀刻以在该材料层中提供通孔（132） 对于批量生产，该方法包括： - 在基材上提供一层第一材料（220），并在定向干法刻蚀步骤之前，在凹坑（210）的中心位置处提供多个孔， - 在凹坑（210）的中心位置蚀刻基材以形成具有孔（281）的空腔（280）; - 在空腔（280）中的基材上沉积第二材料层（240） ，以及 - 使用孔（281）作为荫罩的开口（141），使空腔（280）中的第二材料层（240）经受定向干法蚀刻的所述步骤。

    PIPETTENVORRICHTUNG UND VERFAHREN ZU DEREN HERSTELLUNG
    7.
    发明公开
    PIPETTENVORRICHTUNG UND VERFAHREN ZU DEREN HERSTELLUNG 有权
    移液器装置和方法及其

    公开(公告)号：EP1399262A1

    公开(公告)日：2004-03-24

    申请号：EP02754726.4

    申请日：2002-06-20

    Applicant: Infineon Technologies AG

    Inventor： FRITZ, Michaela ,  DERTINGER, Stephan ,  FUCHS, Karin ,  HANEDER, Thomas ,  HANKE, Hans-Christian ,  JENKNER, Martin ,  LEHMANN, Volker ,  PAULUS, Christian

    IPC: B01L3/02 ,  B01L3/00

    CPC classification number: B81C1/00087 ,  B01L3/0241 ,  B81B2201/057

    Abstract: The invention relates to a device, especially for patch-clamping vesicles and/or for dispensing small, defined liquid amounts onto surfaces. The device is characterized in that in a substrate (2) at least one pipette in the form of a through hole (8) with a predetermined diameter is produced, a rim (16) of the through hole (8) protruding from a neighboring surface (4) of the substrate (2) by a predetermined length. The invention further relates to a method for producing the device, comprising the following steps: producing at least one hole (8), forming at least one modified surface layer (12) on at least the inner surfaces of the hole (8), selectively removing the substrate (2), the modified surface layer (12) not being substantially affected so that it protrudes from a surface (4) of the substrate and forms a protruding rim (16), and finishing the hole (8) as a through hole in a suitable process step.

    A METHOD OF MANUFACTURING A PLURALITY OF THROUGH-HOLES IN A LAYER
    9.
    发明公开
    A METHOD OF MANUFACTURING A PLURALITY OF THROUGH-HOLES IN A LAYER 审中-公开
    一种在一层中制造多个通孔的方法

    公开(公告)号：EP3210936A1

    公开(公告)日：2017-08-30

    申请号：EP17158208.3

    申请日：2017-02-27

    Applicant: SmartTip B.V.

    Inventor： SARAJLIC, Edin

    IPC: B81C1/00 ,  A61B5/15

    CPC classification number: B81C1/0015 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150396 ,  A61B5/150511 ,  A61B5/150519 ,  A61B5/150984 ,  A61B5/15142 ,  A61M37/0015 ,  B81B2201/057 ,  B81B2201/12 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00111 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0198 ,  C01B21/0687

    Abstract: A method of manufacturing a plurality of through-holes (132) in a layer (250) of first material (220) by subjecting part of the layer (250) of said first material (220) to ion beam milling. For batch-wise production, the method comprises
    - after a step of providing the layer (250) of first material (220) and before the step of ion beam milling, providing a second layer (250) of a second material (230) on the layer (250) of first material (220),
    - providing the second layer (250) of the second material (230) with a plurality of holes, the holes being provided at central locations of pits (210) in the first layer (250), and
    - subjecting the second layer (250) of the second material (230) to said step of ion beam milling at an angle using said second layer (250) of the second material (230) as a shadow mask.

    Abstract translation: 一种通过使所述第一材料（220）的一部分层（250）经受离子束铣削而在第一材料（220）的层（250）中制造多个通孔（132）的方法。 对于分批式生产，该方法包括： - 在提供第一材料（220）的层（250）并且在离子束铣削步骤之前，提供第二材料（230）的第二层（250） 第一材料（220）的层（250）， - 为第二材料（230）的第二层（250）提供多个孔，所述孔设置在第一层中的凹坑（210）的中心位置处 以及 - 使用所述第二材料（230）的所述第二层（250）作为阴影掩模以一定角度使所述第二材料（230）的所述第二层（250）经受所述离子束铣削步骤。

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