公开(公告)号：EP2946344A1

公开(公告)日：2015-11-25

申请号：EP14705811.9

申请日：2014-01-15

申请人： Inside Secure

发明人： BOIRON, Ghislain ,  ENGUENT, Jean-Pierre ,  PIC, Pierre

IPC分类号： G06K19/077

CPC分类号： G06K19/07754 ,  G06K19/07756 ,  G06K19/07769 ,  Y10T29/49018

摘要： The invention relates to a method for the production of an object incorporating a contactless microcircuit, said method comprising steps consisting in: forming an antenna coil (AT4) in the form of a spiral from a first face of a substrate (TG4); on the substrate, forming first and second conductive pads (E16, E17) connected to inner and outer ends respectively of the spiral of the antenna coil; connecting the connection terminals of the microcircuit to third and fourth conductive pads (EM1, EM1'); and securing the microcircuit to the substrate, with the first and third conductive pads being positioned to face one another and the second and fourth conductive pads facing one another, the first to fourth conductive pads forming two capacitors mounted in series with the antenna coil, the antenna coil and the first and second conductive pads being formed by insertion of a conductive wire into the substrate.

公开(公告)号：EP2867832B1

公开(公告)日：2016-08-17

申请号：EP13744631.6

申请日：2013-06-26

申请人： Inside Secure

发明人： CHARRAT, Bruno ,  PIC, Pierre

IPC分类号： H01Q7/00 ,  G06K19/077

CPC分类号： G06K19/07783 ,  G06K19/07745 ,  G06K19/07756 ,  G06K19/07775 ,  G06K19/07794 ,  H01Q7/005 ,  Y10T29/49018

公开(公告)号：EP2946343A1

公开(公告)日：2015-11-25

申请号：EP14705810.1

申请日：2014-01-15

申请人： Inside Secure

发明人： BOIRON, Ghislain ,  ENGUENT, Jean-Pierre ,  PIC, Pierre

IPC分类号： G06K19/077

CPC分类号： G06K19/07754 ,  G06K19/07756 ,  G06K19/07769 ,  Y10T29/49018

摘要： The invention relates to a method for the production of an object incorporating a contactless microcircuit, said method comprising steps consisting in: forming an antenna coil (AT1) in the form of a spiral on a first face of a substrate (TG4); securing the microcircuit to the substrate; on the substrate, forming first and second conductive pads (E2, E4) connected to inner and outer ends respectively of the spiral of the antenna coil; connecting the connection terminals of the microcircuit to third and fourth conductive pads (E2', E4'); and securing the microcircuit to the substrate, with the first and third conductive pads being positioned to face one another and the second and fourth conductive pads facing one another, such as to form two capacitors mounted in series with the antenna coil, the first or second conductive pad comprising a non-conductive window (1) which the microcircuit is positioned to face.

摘要翻译： 本发明涉及一种用于制造包含非接触微电路的物体的方法，所述方法包括以下步骤：在基板（TG4）的第一面上以螺旋形式形成天线线圈（AT1）; 将微电路固定在基板上; 在衬底上形成分别连接到天线线圈的螺旋的内端和外端的第一和第二导电垫（E2，E4） 将微电路的连接端子连接到第三和第四导电焊盘（E2'，E4'）; 以及将微电路固定到衬底，其中第一和第三导电焊盘被定位成彼此面对并且第二和第四导电焊盘彼此面对，以便形成与天线线圈串联安装的两个电容器，第一或第二 导电垫包括微电路定位为面对的非导电窗口（1）。

公开(公告)号：EP2867832A1

公开(公告)日：2015-05-06

申请号：EP13744631.6

申请日：2013-06-26

申请人： Inside Secure

发明人： CHARRAT, Bruno ,  PIC, Pierre

IPC分类号： G06K19/077

CPC分类号： G06K19/07783 ,  G06K19/07745 ,  G06K19/07756 ,  G06K19/07775 ,  G06K19/07794 ,  H01Q7/005 ,  Y10T29/49018

摘要： The invention relates to a method of fabricating a microcircuit card, comprising steps consisting in: forming a first antenna coil (CC2) in a card (C2), the first antenna coil comprising a part (CL21) following the edge of the card, forming a module comprising a microcircuit (M1) and a second antenna coil (MC1) around and connected to the microcircuit, and implanting the module in the card at a precise position with respect to the edge of the card, the first antenna coil being coupled by induction to the second antenna coil, the first antenna coil being shaped in such a way that only a part of the second antenna coil is at a distance from the first antenna coil of less than 5% of the width of the second antenna coil.

公开(公告)号：EP2867831A1

公开(公告)日：2015-05-06

申请号：EP13725722.6

申请日：2013-05-03

申请人： Inside Secure

发明人： BOIRON, Ghislain ,  PIC, Pierre

IPC分类号： G06K19/077

摘要： The invention relates to a method for the production of a contactless microcircuit antenna coil, comprising steps consisting in: depositing a first electrically conductive layer (AL) on a first face of a card, and forming a spiral antenna coil (MA1) in the first layer, said coil comprising multiple turns including an inner turn (IS) connected to an inner connection pad (ACT2) and an outer turn (ES) connected to an outer connection pad (ACT1). The outer turn (ES) extends along the entire contour of the antenna coil except in one area in order to allow the passage of a conductive track connecting the outer connection pad (ACT1) to the outer turn. The outer and inner connection pads (ACT1, ACT2) of the antenna coil (MA1) are formed in a central zone (CZ) of the outer turn. The antenna coil comprises a bypass zone (CST1) in which each turn bypasses the outer connection pad.