公开(公告)号：EP4441654A1

公开(公告)日：2024-10-09

申请号：EP22823043.9

申请日：2022-11-29

Applicant: Zwipe AS

Inventor： MUELLER, Robert

IPC: G06K19/07 ,  G06K19/077

CPC classification number: G06K19/0718 ,  G06K19/07754 ,  G06K19/07756

公开(公告)号：EP2183705B1

公开(公告)日：2016-11-23

申请号：EP08801804.9

申请日：2008-09-03

Applicant: bielomatik Leuze GmbH + Co. KG

Inventor： BOHN, Martin

IPC: G06K19/077

CPC classification number: G06K19/07749 ,  G06K19/07756 ,  Y10T156/1082

公开(公告)号：EP2562691B1

公开(公告)日：2016-08-24

申请号：EP12181703.5

申请日：2012-08-24

Applicant: KaWe Engineering GmbH

Inventor： Wendisch, Jan

IPC: G06K19/07 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/24 ,  H01Q9/28

CPC classification number: H01Q1/22 ,  G06K19/0724 ,  G06K19/07756 ,  H01Q7/00 ,  H01Q9/24 ,  H01Q9/285

公开(公告)号：EP2183708B1

公开(公告)日：2016-06-29

申请号：EP08787279.2

申请日：2008-08-15

Applicant: Nokia Technologies Oy

Inventor： HALLIVUORI, Juha ,  ARKKO, Aimo

IPC: G06K19/077 ,  H01Q1/22

CPC classification number: H01Q1/22 ,  G06K19/07749 ,  G06K19/07756

公开(公告)号：EP2998907A1

公开(公告)日：2016-03-23

申请号：EP15190084.2

申请日：2011-07-11

Applicant: OBERTHUR TECHNOLOGIES

Inventor： DUVAL, Agnès ,  LE GARREC, Loïc

IPC: G06K19/077

CPC classification number: G06K19/07749 ,  G06K19/07756 ,  G06K19/07775 ,  G06K19/07779 ,  G06K19/07783

Abstract: Le dispositif électronique (10) comprenant un module (20) à microcircuit (18), une antenne (36) de communication en champ proche raccordée électriquement au microcircuit (18) du module (20), délimitant une surface d'antenne (S), et un corps (12) incorporant le module (20). Plus précisément, l'antenne (36) est agencée sur un support du module (20) et le corps (12) incorpore des moyens (40) d'amplification du gain de l'antenne (36) comprenant un organe (42), électriquement conducteur et isolé électriquement du microcircuit (18) et de l'antenne (36), de forme générale annulaire agencé autour d'une région (R) du corps (12) formant un volume généré par la projection de la surface d'antenne (S) le long d'une direction sensiblement orthogonale (Z) à la surface (S).

Abstract translation: 该装置即微电路装置（10）具有电连接到模块的微电路并限定天线表面（S）的近场通信天线（36）。 天线布置在模块的支撑上。 本体（12）包括天线增益放大单元，该天线增益放大单元包括导电并与微电路和天线绝缘的环形环。 所述环围绕由所述表面沿与所述表面正交的方向的投影产生的身体形成体积的区域周围布置。 对于电子设备的制造方法，还包括独立权利要求。

公开(公告)号：EP2946343A1

公开(公告)日：2015-11-25

申请号：EP14705810.1

申请日：2014-01-15

Applicant: Inside Secure

Inventor： BOIRON, Ghislain ,  ENGUENT, Jean-Pierre ,  PIC, Pierre

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07756 ,  G06K19/07769 ,  Y10T29/49018

Abstract: The invention relates to a method for the production of an object incorporating a contactless microcircuit, said method comprising steps consisting in: forming an antenna coil (AT1) in the form of a spiral on a first face of a substrate (TG4); securing the microcircuit to the substrate; on the substrate, forming first and second conductive pads (E2, E4) connected to inner and outer ends respectively of the spiral of the antenna coil; connecting the connection terminals of the microcircuit to third and fourth conductive pads (E2', E4'); and securing the microcircuit to the substrate, with the first and third conductive pads being positioned to face one another and the second and fourth conductive pads facing one another, such as to form two capacitors mounted in series with the antenna coil, the first or second conductive pad comprising a non-conductive window (1) which the microcircuit is positioned to face.

Abstract translation: 本发明涉及一种用于制造包含非接触微电路的物体的方法，所述方法包括以下步骤：在基板（TG4）的第一面上以螺旋形式形成天线线圈（AT1）; 将微电路固定在基板上; 在衬底上形成分别连接到天线线圈的螺旋的内端和外端的第一和第二导电垫（E2，E4） 将微电路的连接端子连接到第三和第四导电焊盘（E2'，E4'）; 以及将微电路固定到衬底，其中第一和第三导电焊盘被定位成彼此面对并且第二和第四导电焊盘彼此面对，以便形成与天线线圈串联安装的两个电容器，第一或第二 导电垫包括微电路定位为面对的非导电窗口（1）。

公开(公告)号：EP2836878A4

公开(公告)日：2015-11-18

申请号：EP12874288

申请日：2012-09-10

Applicant: IMPINJ INC

Inventor： DIORIO CHRISTOPHER J ,  KOEPP RONALD L ,  HEINRICH HARLEY K ,  STANFORD THERON ,  SRINIVAS SHAILENDRA ,  OLIVER RONALD A

IPC: G06K19/077 ,  G05B11/01

CPC classification number: G06K19/07756 ,  G06K19/07745 ,  G06K19/0775 ,  G06K19/07752 ,  G06K19/07754 ,  G06K19/07775 ,  H01L2924/0002 ,  Y10T29/49018 ,  H01L2924/00

Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.

Abstract translation: 实施例涉及具有电耦合到第一和第二天线触点的第一电路块的射频识别（RFID）集成电路（IC）。 第一天线触点设置在IC的第一表面上，第二天线触点设置在与第一表面不同的IC的第二表面上。 第一和第二天线触点彼此电断开。

公开(公告)号：EP2867832A1

公开(公告)日：2015-05-06

申请号：EP13744631.6

申请日：2013-06-26

Applicant: Inside Secure

Inventor： CHARRAT, Bruno ,  PIC, Pierre

IPC: G06K19/077

CPC classification number: G06K19/07783 ,  G06K19/07745 ,  G06K19/07756 ,  G06K19/07775 ,  G06K19/07794 ,  H01Q7/005 ,  Y10T29/49018

Abstract: The invention relates to a method of fabricating a microcircuit card, comprising steps consisting in: forming a first antenna coil (CC2) in a card (C2), the first antenna coil comprising a part (CL21) following the edge of the card, forming a module comprising a microcircuit (M1) and a second antenna coil (MC1) around and connected to the microcircuit, and implanting the module in the card at a precise position with respect to the edge of the card, the first antenna coil being coupled by induction to the second antenna coil, the first antenna coil being shaped in such a way that only a part of the second antenna coil is at a distance from the first antenna coil of less than 5% of the width of the second antenna coil.

公开(公告)号：EP2804133A1

公开(公告)日：2014-11-19

申请号：EP14168172.6

申请日：2014-05-13

Applicant: Ricoh Company Ltd.

Inventor： Kawase, Tsutomu ,  Okamoto, Yoichi

IPC: G06K19/077 ,  G06K19/073

CPC classification number: G06K7/10009 ,  G06K19/0739 ,  G06K19/07749 ,  G06K19/07756 ,  G06K19/07798

Abstract: A package includes a package structure and a radio frequency identification tag. The package structure includes a metal film and a resin film, and the metal film includes a slit. The tag includes a first conductor to be attached at one side of the slit in a width direction of the slit, a second conductor to be attached at another side of the slit in the width direction of the slit, and an IC chip to receive power through the first conductor and the second conductor. The package structure includes a cutting line and the tag generates a communication failure when the package structure is cut along the cutting line. A radio frequency identification system includes the package and a communication management device configured to perform at least one of reading out information from the tag through wireless communication and writing information into the tag through the wireless communication.

Abstract translation: 包装包括封装结构和射频识别标签。 封装结构包括金属膜和树脂膜，并且金属膜包括狭缝。 标签包括：在狭缝的宽度方向上在狭缝的一侧附着的第一导体，在狭缝的宽度方向上的狭缝的另一侧附着的第二导体和接收电力的IC芯片 通过第一导体和第二导体。 包装结构包括切割线，并且当包装结构沿着切割线切割时，标签产生通信故障。 一种射频识别系统，包括：包和通信管理装置，被配置为执行通过无线通信从标签读出信息和通过无线通信将信息写入标签中的至少一个。

公开(公告)号：EP2680193A1

公开(公告)日：2014-01-01

申请号：EP13186179.1

申请日：2008-07-18

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kato, Noboru ,  Ishino, Satoshi ,  Kataya, Takeshi ,  Kimura, Ikuhei ,  Ikemoto, Nobuo ,  Dokai, Yuya

IPC: G06K19/077 ,  H01Q1/44 ,  H01Q1/24 ,  H01Q1/50 ,  H01Q7/00 ,  H01Q9/30 ,  H04B5/02 ,  H05K1/14 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q9/16 ,  H01Q13/10 ,  H05K1/02 ,  H05K1/16

CPC classification number: G06K19/07749 ,  G06K19/06187 ,  G06K19/0723 ,  G06K19/07756 ,  G06K19/07773 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a radio IC device miniaturized without degrading the radiation characteristics.
A radio IC device includes an electromagnetic coupling module (1) including a radio IC chip (5) processing transmitted and received signals and a feed circuit board (10) having an inductance element. The feed circuit board (10) has an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case (28) or a wiring cable. The shielding case (28) or the wiring cable functions as a radiation plate. The radio IC chip (5) is operated by a signal received by the shielding case (28) or the wiring, and the answer signal from the radio IC chip (5) is radiated from the shielding case (28) or the wiring cable to the outside. A metal component may function as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board (20).

Abstract translation: 提供小型化的无线电IC装置，而不降低辐射特性。 无线IC器件包括：电磁耦合模块（1），包括处理发送和接收信号的无线IC芯片（5）和具有电感元件的馈电电路板（10）。 馈电电路板（10）具有与馈电电路电磁耦合的外部电极，外部电极电连接到屏蔽壳（28）或布线电缆。 屏蔽壳（28）或布线电缆用作辐射板。 无线IC芯片（5）由屏蔽壳（28）或布线接收的信号进行操作，来自无线IC芯片（5）的应答信号从屏蔽壳（28）或布线电缆辐射到 外。 金属部件可以用作辐射板，并且金属部件可以是布置在印刷线路板（20）上的接地电极。