公开(公告)号：EP3371828A1

公开(公告)日：2018-09-12

申请号：EP15907962.3

申请日：2015-11-05

申请人： Intel Corporation

发明人： CHEAH, Bok Eng ,  KONG, Jackson, Chung Peng ,  OOI, Ping Ping ,  OOI, Kooi Chi ,  PERIAMAN, Shanggar

IPC分类号： H01L25/065 ,  H01L25/07 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/568 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1816 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed toward a stacked package assembly for embedded dies and associated techniques and configurations. In one embodiment, stacked package assembly may comprise a first die package and a second die package stacked one upon the other with plural interconnections between them; and a voltage reference plane embedded in at least one of the first and second die packages in proximity and generally parallel to the other of the first and second die packages.