专利检索 ap:("Intel Corporation") AND inv:"ZHOU, Zheng" 第 1 页

1.

发明授权
PACKAGE WITH BI-LAYERED DIELECTRIC STRUCTURE 有权

公开(公告)号：EP3295482B1

公开(公告)日：2020-10-28

申请号：EP15892028.0

申请日：2015-05-13

申请人： Intel Corporation

发明人： ZHOU, Zheng , ROY, Mihir K. , ZHANG, Chong , LEE, Kyu-oh , SCHUCKMAN, Amanda E.

IPC分类号： H01L23/498 , H01L21/48 , H01L23/14

2.

发明公开
METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY 审中-公开
标题翻译：形成传感器集成包和由其形成的结构的方法

公开(公告)号：EP3274292A1

公开(公告)日：2018-01-31

申请号：EP16773659.4

申请日：2016-02-25

申请人： Intel Corporation

发明人： LEE, Kyu Oh , ZHOU, Zheng , SALAMA, Islam A. , EID, Feras , OSTER, Sasha N. , KONG, Lay Wai , SOTO GONZALEZ, Javier

IPC分类号： B81B7/02

CPC分类号： B81B7/0077 , B81B2201/0235 , B81B2201/0242 , B81C2203/0109 , G01C19/56 , G01P15/0802 , G01P15/097

摘要： Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.