利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

2 条记录 (耗时 0.008 秒)

    POWER MANAGEMENT IN MULTI-DIE ASSEMBLIES
    1.
    发明公开
    POWER MANAGEMENT IN MULTI-DIE ASSEMBLIES 审中-公开
    绩效管理多芯片地层

    公开(公告)号：EP3014742A1

    公开(公告)日：2016-05-04

    申请号：EP14818632.3

    申请日：2014-06-18

    申请人： Intel IP Corporation

    发明人： DROEGE, Guido ,  SCHAEFER, Andre ,  ZILLMANN, Uwe

    IPC分类号： H02J50/00 ,  H02J7/00 ,  H01F38/14

    CPC分类号： H02J1/00 ,  G05F1/618 ,  G11C5/025 ,  G11C5/14 ,  G11C5/147 ,  G11C7/00 ,  H01L2924/19042 ,  H01L2924/19104 ,  H02M1/088

    摘要： An apparatus such as heterogeneous device includes at least a first die and a second die. The apparatus further includes a first inductive element, a second inductive element, and switch control circuitry. The switch control circuitry is disposed in the first die. The switch control circuitry controls current through the first inductive element to produce a first voltage. The first voltage powers the first die. The second inductive element is coupled to the first inductive element. The second inductive element produces a second voltage to power the second die. The first die and second die can be fabricated in accordance with different technologies and in which the first die and second die withstand different maximum voltages. A magnitude of the first voltage can be greater than a magnitude of the second voltage.