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公开(公告)号：EP0726698A2
公开(公告)日：1996-08-14
申请号：EP96100324.1
申请日：1996-01-11
发明人： Carey, Charles Francis , Fallon, Kenneth Michael , Markovich, Voya Rista , Powell, Douglas Oliver , Vlasak, Gary Paul , Zarr, Richard Stuart
CPC分类号： H01L24/81 , C25D5/022 , C25D5/08 , H01L21/4825 , H01L21/4853 , H01L2224/11849 , H01L2224/119 , H01L2224/81193 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/30105 , H01L2924/3841 , H05K3/241 , H05K3/3473 , H05K2203/043 , H05K2203/054 , H01L2924/00
摘要： Small, closely spaced deposits of solder materials may be formed with high volumetric accuracy and uniformity of shape by depositing a layer of conductive material (20) over surfaces of a dielectric layer (16) having apertures or recesses (e.g. blind apertures) and conductors and/or pads (14) exposed by those apertures or recesses, masking regions of the conductive material with a further patterned dielectric layer (30), electroplating solder materials (40) onto regions of the conductive material exposed by the mask, removing the mask (30) and portions of the conductive material (20) by selective etching and reflowing solder (40) away from at least a portion of the surfaces of the apertured dielectric layer (16). Uniformity of electroplating within blind apertures is enhanced by a combination of fluid jet sparging and cathode agitation. Excess conductor material in the resulting solder deposit can be avoided by replacing conductor material (20) with a constituent component of a solder material in an immersion bath prior to electroplating.
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公开(公告)号：EP0726698A3
公开(公告)日：1996-11-20
申请号：EP96100324.1
申请日：1996-01-11
发明人： Carey, Charles Francis , Fallon, Kenneth Michael , Markovich, Voya Rista , Powell, Douglas Oliver , Vlasak, Gary Paul , Zarr, Richard Stuart
CPC分类号： H01L24/81 , C25D5/022 , C25D5/08 , H01L21/4825 , H01L21/4853 , H01L2224/11849 , H01L2224/119 , H01L2224/81193 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/30105 , H01L2924/3841 , H05K3/241 , H05K3/3473 , H05K2203/043 , H05K2203/054 , H01L2924/00
摘要： Small, closely spaced deposits of solder materials may be formed with high volumetric accuracy and uniformity of shape by depositing a layer of conductive material (20) over surfaces of a dielectric layer (16) having apertures or recesses (e.g. blind apertures) and conductors and/or pads (14) exposed by those apertures or recesses, masking regions of the conductive material with a further patterned dielectric layer (30), electroplating solder materials (40) onto regions of the conductive material exposed by the mask, removing the mask (30) and portions of the conductive material (20) by selective etching and reflowing solder (40) away from at least a portion of the surfaces of the apertured dielectric layer (16). Uniformity of electroplating within blind apertures is enhanced by a combination of fluid jet sparging and cathode agitation. Excess conductor material in the resulting solder deposit can be avoided by replacing conductor material (20) with a constituent component of a solder material in an immersion bath prior to electroplating.
摘要翻译： 通过在具有孔或凹陷（例如盲孔）和导体的介电层（16）的表面上沉积一层导电材料（20），可以形成具有高体积精度和形状均匀性的小的， /或由这些孔或凹槽暴露的焊盘（14），用另外的图案化介电层（30）掩蔽导电材料的区域，将焊料材料（40）电镀到由掩模暴露的导电材料的区域上，去除掩模 通过选择性地蚀刻并回流焊料（40）远离有孔介电层（16）的至少一部分表面，导电材料（20）和部分导电材料（20）。 流体喷射鼓泡和阴极搅拌相结合可以提高盲孔内电镀的均匀性。 在电镀之前，通过用浸渍浴中的焊料材料的组成成分替换导体材料（20），可以避免所得焊料沉积物中的过量导体材料。
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