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    Composite particles and production process thereof, aqueous dispersion composition for chemical polishing, and process for manufacture of semiconductor device
    2.
    发明公开
    Composite particles and production process thereof, aqueous dispersion composition for chemical polishing, and process for manufacture of semiconductor device 有权
    复合颗粒和它们的制备方法，用于化学机械抛光和处理含水分散体用于生产半导体器件

    公开(公告)号：EP1683821A1

    公开(公告)日：2006-07-26

    申请号：EP06110066.5

    申请日：2000-01-18

    申请人： JSR Corporation

    发明人： Yano, Hiroyuki Kabushiki Kaisha Toshiba ,  Minamihaba, Gaku Kabushiki Kaisha Toshiba ,  Matsui, Yukiteru Kabushiki Kaisha Toshiba ,  Okumura, Katsuya Kabushiki Kaisha Toshiba ,  Motonari, Masayuki ,  Hattori, Masayuki ,  Iio, Akira

    IPC分类号： C08G83/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/02 ,  C08K3/34

    CPC分类号： C09K3/1463 ,  C08G83/001 ,  C08J3/128 ,  C08K3/36 ,  C08K5/057 ,  C08K2201/013 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/02024 ,  H01L21/31053 ,  H01L21/3212

    摘要： The present invention provides composite particles with sufficient strength and hardness and excellent heat resistance, a production process thereof, an aqueous dispersion containing the composite particles, a CMP slurry which is suitable for manufacture of semiconductor devices, and a process for manufacture of semiconductor devices that employs it. The composite particles are prepared by bonding a silane coupling agent and the like, to divinylbenzene polymer particles and then reacting a specific metal alkoxide, colloidal metal oxide and colloidal silica therewith to form a metal compound section and the like, consisting of a metalloxane bond-containing section or metal oxide particle section on at least one of the interior and surface of the polymer particles. The metal compound section, and the like. can also be formed without using a silane coupling agent. The metalloxane bond-containing section, metal oxide particle section and the like, are preferably bonded by chemical bonding and/or non-chemical bonding to the polymer particles via a silane coupling agent and the like, or directly, but they may also be sequestered without bonding. CMP slurries containing these particles can be advantageously utilized for manufacture of various semiconductor devices, and particularly for polishing of wafer surfaces.

    摘要翻译： 本发明提供具有足够强度和硬度和优异的耐热性，其制造方法，水性分散体含有复合粒子，CMP浆料的所有其适合于制造半导体器件，以及用于制造半导体器件的过程中复合粒子做 采用它。 所述复合粒子是通过结合硅烷偶联剂等，以二乙烯基苯聚合物颗粒，然后反应的特定的金属醇盐，胶态金属氧化物和胶体二氧化硅那里与以形成金属化合物部等，其由金属氧成键的制备 包含在聚合物颗粒的内部和表面的至少一个部分或金属氧化物颗粒部分。 金属化合物部分，和类似物。 因此，可以在不使用硅烷偶联剂而形成。 部，金属氧化物粒子部等的金属氧烷键的，优选通过化学键合和/或非化学结合到聚合物颗粒通过硅烷偶联剂等中，或直接键合，但是，因此，它们可以被隔离 不粘合。 CMP浆料含论文颗粒可有利地用于制造各种半导体器件，并且特别是对于晶片表面的抛光。