公开(公告)号：EP4386822A1

公开(公告)日：2024-06-19

申请号：EP22918427.0

申请日：2022-12-23

申请人： Jiangsu Leadmicro Nano-Technology Co., Ltd.

发明人： ZHOU, Ren ,  YANG, Dezan ,  WANG, Zhuo ,  XIE, Tian ,  ZHU, Xiaoli

IPC分类号： H01L21/67 ,  H01L21/677

CPC分类号： H01L21/677 ,  H01L21/67 ,  Y02P70/50

摘要： The present disclosure provides a wafer processing device, a wafer processing system and a control method. The wafer processing device includes a driving unit, a transfer chamber, a plurality of process chambers and a bearing assembly; the bearing assembly is arranged in the transfer chamber, the process chamber is coupled to the transfer chamber, the process chamber is used for processing wafers, the bearing assembly is used for supporting the wafer, the driving unit is used for adjusting a position of the bearing assembly in the transfer chamber, and the driving unit is further used for driving the bearing assembly to move between the transfer chamber and the process chambers. The wafer processing device of the present disclosure can directly transport the wafers to be processed to the process chambers by the driving unit for the processing treatment, and can retain or transfer the wafers to be transferred or not to be directly processed in the transfer chamber, thus reducing the time of wafers occupying the working station due to different groups of wafers waiting for process, which will speed up the processing efficiency of the wafers and provide basic conditions for synchronously processing groups of wafers by the transfer chamber and the bearing assembly.