公开(公告)号：EP4435831A1

公开(公告)日：2024-09-25

申请号：EP22895892.2

申请日：2022-10-28

申请人： PSK Inc.

发明人： YOON, Sung Jin ,  SEO, Hyung Seok ,  PARK, Jong Woo ,  SEO, Hyo Jeong ,  KIM, Beom Seok

IPC分类号： H01J37/32 ,  H01L21/67

CPC分类号： H01L21/67 ,  H01J37/32

摘要： The present invention provides an apparatus for treating a substrate. The apparatus for treating a substrate may comprise: a process treatment part which provides a treatment space where a substrate is treated; and a plasma source which generates plasma from process gas, wherein: the plasma source includes an antenna which has a coil wound in multiple turns, and a power application unit which applies high-frequency power to the coil; a first ground line is connected to one end of the coil and a second ground line is connected to the other end of the coil; and the power application unit is connected to the coil so as to apply high-frequency power directly to the coil at a position between one end and the other end of the coil.

公开(公告)号：EP4428908A1

公开(公告)日：2024-09-11

申请号：EP21963425.0

申请日：2021-12-02

申请人： PSK Inc.

发明人： YOO, Kwang Sung ,  YOUN, Tae Hwan ,  KIM, Geon Jong

IPC分类号： H01L21/687 ,  H01L21/67 ,  H01J37/32

CPC分类号： H01L21/687 ,  H01L21/67 ,  H01J37/32

摘要： The present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate may comprise: a chuck which supports a substrate; a gas supply unit which supplies process gas to the edge region of the substrate supported by the chuck; and an edge electrode which is provided to surround the substrate supported by the chuck as viewed from above and generates plasma from the gas, wherein the edge electrode has a ring shape, and the edge electrode has a groove formed to be indented in a direction from the inner circumference toward the outer circumference of the edge electrode as viewed from above.

公开(公告)号：EP2623437B1

公开(公告)日：2018-08-15

申请号：EP11828671.5

申请日：2011-08-29

申请人： Murata Machinery, Ltd.

发明人： TSUBAKI, Tatsuo ,  FUJIWARA, Yusuke

IPC分类号： B65G1/00 ,  B65G49/07 ,  B66C13/22 ,  H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67 ,  H01L21/67259 ,  H01L21/6773 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/68707

摘要： For transferring an article to a desired position, even in a lateral transfer, a transfer system (100) allows transfer of an article (3) between a transport vehicle (2), which conveys the article (3) while travelling along a rail (1) provided on a ceiling, and a placement portion provided below the rail, in a lateral transfer manner. The transfer system includes a memory unit (101) and a controller (102). The memory unit stores (i) placement position information indicating a transfer position of the article when a transfer unit is to place the article onto the placement portion, and (ii) holding position information indicating a transfer position of the article when the transfer unit is to hold the article on the placement portion. The controller controls the transfer unit such that, when the transfer unit is to place the article, the article is transferred at a transfer position indicated in the placement position information and, when the transfer unit is to hold the article, the article is transferred to a transfer position indicated in the holding position information.

公开(公告)号：EP3331002A1

公开(公告)日：2018-06-06

申请号：EP17205235.9

申请日：2017-12-04

申请人： Senju Metal Industry Co., Ltd

发明人： SAITO, Yuta

IPC分类号： H01L21/67 ,  H01L21/677

CPC分类号： B65G47/5127 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K1/203 ,  B23K3/087 ,  B23K2101/42 ,  B65G15/20 ,  B65G25/10 ,  B65G47/49 ,  B65G47/82 ,  B65G2203/0233 ,  H01L21/67 ,  H01L21/67028 ,  H01L21/6704 ,  H01L21/67138 ,  H01L21/67144 ,  H01L21/67276 ,  H01L21/67294 ,  H01L21/677 ,  H01L21/67766 ,  H01L21/67778 ,  H05K3/3494

摘要： A soldering apparatus (100) as a conveyance apparatus (1) includes a substrate loading portion (14) to load a substrate (P(n)) on the soldering apparatus, an intermittent feeding unit (15) to intermittently feed the substrate loaded on the soldering apparatus, a substrate discharge portion (16) to discharge the intermittently fed substrate to the outside of the soldering apparatus and a controller (70) to control conveyance of the substrate. The substrate loading portion includes a first conveyance path (13A) to convey the substrate, a first sensor (20A) provided in the vicinity of a substrate loading inlet (11) of the substrate loading portion, and a second sensor (20B) arranged in a downstream side of the first sensor along the substrate conveyance direction. The intermittent feeding unit includes a second conveyance path (23B) for conveying the substrate, and a third sensor (20C) placed in the vicinity of an upstream end of the intermittent feeding unit along the substrate conveyance direction.

公开(公告)号：EP3291287A1

公开(公告)日：2018-03-07

申请号：EP16785903.2

申请日：2016-04-22

申请人： Beijing Solarray Technoiogy Co., Ltd.

发明人： YUAN, Xiangdong ,  XU, Ying ,  YUAN, Xi

IPC分类号： H01L21/67 ,  H01L31/18 ,  F27B9/02 ,  F27B9/06 ,  F27B9/24 ,  F27B9/36

CPC分类号： F27B9/02 ,  F27B9/06 ,  F27B9/24 ,  F27B9/36 ,  H01L21/67 ,  H01L31/18 ,  Y02E10/50 ,  Y02P70/521

摘要： The present invention relates to a roller type solar cell sintering and irradiation annealing integrated continuous furnace which can be used for sintering and irradiation annealing treatment of solar cells. The roller type solar cell sintering and irradiation annealing integrated continuous furnace is composed of a loading region (1), a sintering region (2), a sintering and cooling region (3), an irradiation annealing region (5), a cooling region (6) and an unloading region (7). Cells (8) are transmitted on a group of horizontally arranged rollers (9) and sequentially pass through the above regions to complete the sintering and irradiation annealing processes of the solar cells at the same time. The present invention radically solves a problem of mass production in an irradiation annealing process, and a problem of degradation of the solar cells.

摘要翻译： 本发明涉及一种可用于太阳能电池的烧结和辐照退火处理的滚筒式太阳能电池烧结和辐照退火一体式连续炉。 （1），烧结区域（2），烧结冷却区域（3），照射退火区域（5），冷却区域（3），冷却区域 6）和卸载区域（7）。 在一组水平排列的辊子（9）上传送单元（8），并依次通过上述区域同时完成太阳能电池的烧结和辐照退火过程。 本发明从根本上解决了照射退火工艺中的大量生产问题以及太阳能电池退化的问题。

公开(公告)号：EP3108030A1

公开(公告)日：2016-12-28

申请号：EP15751417.5

申请日：2015-02-20

申请人： Intevac, Inc. ,  Bluck, Terry ,  Shah, Vinay ,  Latchford, Ian ,  Riposan, Alex

发明人： BLUCK, Terry ,  SHAH, Vinay ,  LATCHFORD, Ian ,  RIPOSAN, Alexandru

IPC分类号： C23C14/50 ,  H01L21/677

CPC分类号： C23C14/50 ,  C23C14/56 ,  C23C14/568 ,  H01L21/67 ,  H01L21/67173 ,  H01L21/67271 ,  H01L21/677 ,  H01L21/67709 ,  H01L21/67718 ,  H01L21/67748 ,  H01L21/6776

摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed.

公开(公告)号：EP0663685A1

公开(公告)日：1995-07-19

申请号：EP94309602.4

申请日：1994-12-21

申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED

发明人： Uchiyama, Isao ,  Kudo, Hideo

IPC分类号： H01L21/00

CPC分类号： H01L21/67017 ,  H01L21/67

摘要： A wafer holder 24 suitable for handling wafers of any of selected different diameters at a time in vapor-drying wafers and an apparatus for vapor-drying wafers 2 using the wafer holder 24 is presented.
The wafer holder 24 is secured onto the fore end of the robot arm for drying 16 and has a plurality of wafer holding means in united one body each of which is capable of holding one or more wafers of one of selected different diameters and which is interchangeable with another wafer holding means by rotating the wafer holding means united in one body in accordance with selection of wafers of another diameter to be vapor-dried.

摘要翻译： 本发明提供一种适合于在蒸气干燥晶片中一次处理选定的不同直径的晶片的晶片保持器24和使用该晶片保持器24的晶片2的气相干燥装置。 晶片保持器24被固定在机器人手臂的前端以进行干燥16，并且具有多个晶片保持装置，每个晶片保持装置能够保持一个或多个选定的不同直径之一的晶片，并且可互换 与另一个晶片保持装置通过根据要蒸汽干燥的另一直径的晶片的选择旋转将晶片保持装置联合在一体内。

公开(公告)号：EP0635873A1

公开(公告)日：1995-01-25

申请号：EP94305332.2

申请日：1994-07-20

申请人： CANON KABUSHIKI KAISHA

发明人： Hasegawa, Takayuki, c/o Canon Kabushiki Kaisha ,  Tanaka, Yutaka, c/o Canon Kabushiki Kaisha ,  Fujioka, Hidehiko, c/o Canon Kabushiki Kaisha

IPC分类号： H01L21/00

CPC分类号： H01L21/67011 ,  G03F7/70808 ,  G03F7/70858 ,  H01L21/67 ,  H01L21/67126

摘要： A processing system is disclosed which includes first and second chambers, each for accommodating a processing apparatus therein, each chamber being able to be kept gas tight, a coupling member for coupling the processing apparatuses accommodated in the first and second chambers with each other, and an elastic gas tightness holding member for gas tightly sealing portions between the coupling member and the first and second chambers.

摘要翻译： 公开了一种处理系统，其包括第一和第二室，每个室用于容纳其中的处理装置，每个室能够保持气密性，用于将容纳在第一和第二室中的处理装置彼此连接的联接构件，以及 弹性气密性保持构件，用于气密地密封连接构件与第一和第二腔室之间的部分。

公开(公告)号：EP0490299A3

公开(公告)日：1993-06-09

申请号：EP91120997.1

申请日：1991-12-06

申请人： Bridgestone Corporation

发明人： Takano, Kazuya ,  Onai, Seiji

IPC分类号： F16F9/53 ,  B60G13/00 ,  F16F9/36

CPC分类号： F16F9/38 ,  B23Q11/0032 ,  F16F9/532 ,  F16F2230/10 ,  H01L21/67

摘要： The present invention relates to a damper device which comprises a fixed member and a movable member that are positioned relative to each other, one being inside of the other, electroviscous fluid sealed in between said two members, and electrodes opposingly arranged at respective positions of the two members to allow relative flow of the electroviscous fluid. The portions of the movable and fixed members where they are in sliding contact are shielded against said electroviscous fluid by a flexible member provided between these two members. When the damper device of such construction is used as a position control means, a voltage is applied to the electrodes to stop and position the movable member while the voltage application is suspended to cause the movable member to move. The apparatus for manufacturing semiconductors according to the present invention is characterized in that an arm (41) is provided on the movable member (40) to move along the axial direction of the guide bar (42) when the movable member moves, a flexible member (45) is provided between respective ends of the fixed guide bar and respective ends of the arm to maintain the internal space liquid-tight, and an electroviscous fluid is sealed inside the flexible member and in between the arm and the guide bar. A positive and a negative electrodes are formed by utilizing two opposing members such as the arm and the guide bar, to which a voltage power source (48) is connected. When the movable member is to be stopped and positioned, a voltage is applied to the electrodes while said voltage application is suspended when the movable member is to be moved.

公开(公告)号：EP0261346A3

公开(公告)日：1990-05-23

申请号：EP87110913.8

申请日：1987-07-28

申请人： International Business Machines Corporation

发明人： Christensen, Richard Gilbert ,  Mack, Alfred

IPC分类号： H01L21/68

CPC分类号： H01L21/67

摘要： A wafer transfer apparatus having at least three wafer supporting arms each having an inwardly projecting flange. The transfer apparatus positions the arms so that the flanges are disposed in a plane below the plane of the support on which a wafer rests. An actuator mechanism disposed above the active surface of the wafer moves the arms inwardly until the flange on each arm underlies the back surface of the wafer but the arms are not in contact with the wafer edge. Then, the arms are moved upwardly... The transfer device positions the arms so that the flanges are disposed in a plane below the plane of the support on which a wafer rests. An actuator mechanism disposed above the active surface of the wafer moves the arms inwardly until the flange on each arm underlies the back surface of the wafer but the arms are not in contact with the wafer edge. Then, the arms are moved upwardly. When the flanges contact the back surface of the wafer, the wafer is lifted off the support. Once the arms are above the support surface, the transfer device can be moved to carry the wafer to another position. The actuator mechanism disposed above the active surface of the wafer is designed without any movable element thereof having any sliding contact with any other element thereof. Because, there are no parts of the transfer device which are in sliding contact with other elements thereof, no small particles can be produced that might fall on the active surface of a wafer and cause a defect thereon.