摘要:
Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein a ratio of a plan view area of recessed portions occurring in a carbon nanotube aggregate-side surface of the mounting member to a total area of the carbon nanotube aggregate-side surface is 5% or less.
摘要:
This invention is to provide a noncontact conveying apparatus and a noncontact conveying system, which can move an object from a conveying path to a predetermined position without using another device, and can convey the object in a noncontact manner without causing the object to fall down even if the conveying path is inclined or faces downwardly. The system includes a holding device 11 for holding an object 1 in a noncontact manner and a moving device 10 for moving the holding device 11. The holding device 11 includes a levitating device 7 for levitating the object 1 and an attracting device for attracting the object. The levitating device 7 includes a conveying plate 2 made of a porous material having a large number of pores, a compressor 6 for sending gas to the pores of the conveying plate and ejecting the gas from the pores towards the object. The moving device 10 is constituted by the magnetic material 8 and the magnet 9 for moving the object in a noncontact manner while attracting the object towards the conveying plate.
摘要:
[Problem to be Solved] To automatically transport a wafer transport container between compact manufacturing devices in a production line made up of a plurality of compact manufacturing devices such as semiconductor manufacturing devices. [Solution] The production line 1 is formed by arranging three compact semiconductor manufacturing devices 2 in parallel in a straight line on a floor surface 16. The semiconductor manufacturing devices 2 each have a substantially rectangular parallelepiped housing 3, and a processing chamber 5 and a device front chamber 6 are arranged inside each housing 3. Recesses 7 are formed above the device front chambers 6 in the front portions of the housings 3. Container mounting tables 9 and temporary placement trays 8 are installed in the recesses 7, and container transport means 12 are integrally provided. This makes it possible to automatically transport a wafer transport container 10 between the three semiconductor manufacturing devices 2. As a result, it is possible to efficiently advance a series of manufacturing processes for a semiconductor wafer.
摘要:
Plant (10) and system for the automatic horizontal assembly of photovoltaic panels (30) with front-back-contact solar cells (300-1) of crystalline silicon, of the type called H-type, the contacting being carried out at a temperature lower than 150°C also with the prefixing of conductive elements onto the encapsulating layer; the present invention solves the main problems of the conventional stringing systems and provides high production capacity with a precise positioning of the components. The plant (10) is made up of single workstations (100A-I) of the modular type which are arranged sequentially in a linear series, individually equipped according to the specific working process, being adjacent and laterally open to be crossed by the conveying line (110) of the trays (109) containing the panels being worked; after the automatic assembly in said plant (10), the panels are ready to be rolled in conventional furnaces.
摘要:
An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500°C processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.
摘要:
A pitch conversion device and pitch conversion method is directed to convert the pit of a plurality of partition members (90) arranged parallel to each other along The X-direction and include a plurality of entry members (11) arranged parallel to each other in The X-direction and configured to enter between neighboring partition members (90), and a pushing member (31) to push the plurality of entry members (11) in turn and allow them to enter neighboring partition members (90) associated while moving in the X direction. The entry members (11) are biased in a exiting direction from between the neighboring partition members (90).
摘要:
A substrate processing apparatus including a transport chamber having an end and defining more than one substantially linear substrate transport zone where each transport zone extends longitudinally along the transport chamber between opposing walls of the transport chamber and at least one of the more than one substantially linear substrate transport zones is configured as a supply zone for enabling transport of substrates from the end and at least one of the more than one substantially linear substrate transport zones is configured as a return zone for enabling transport of substrates to the end, and at least one substrate transport located in and movably mounted to the transport chamber for transporting substrates along the more than one substantially linear substrate transport zone, where each substrate transport zone is configured to allow the at least one substrate transport to move from one transport zone to another transport zone.
摘要:
A substrate processing apparatus (10) is provided. The apparatus has a casing, a load port interface (I) and a carrier holding station (16) The casing has processing devices (12) within for processing substrates. The load port interface (I) is connected to the casing for loading substrates into the processing device (12). The carrier holding station (16) is connected to the casing. The carrier holding statio (16) is adapted for holding at least one substrate transport carrier (C) at the load port interface (I). The carrier holding station (16) is arranged to provide a fast swap section for replacement of the substrate transport carrier (C) from the carrier holding station (16).
摘要:
A transversing loading device, an overhead hoist vehicle, and an automatic material handling system applied in the technical field of automatic control are provided according to the present application. The transversing loading device includes a picking-up and fixing mechanism fixedly connected to the travelling base plate (6) of the overhead hoist vehicle, and a horizontal adjusting mechanism installed on a lower surface of the picking-up and fixing mechanism. The horizontal adjusting mechanism includes a synchronous adjusting mechanism and a sliding mechanism, the synchronous adjusting mechanism is arranged on a side surface of the sliding mechanism and is configured to slidably adjust the sliding mechanism to a predetermined horizontal position relative to the travelling base plate (6) along a first direction. The first direction is a horizontal direction perpendicular to the side surface, and the predetermined horizontal position is a position above a target object to be handled. With the horizontal adjusting mechanism, the components in the overhead hoist vehicle can be quickly and accurately adjusted to a position directly above the target object to be handled, which can improve the production efficiency of the product and better meet the needs of the factory.