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公开(公告)号：EP0478320A2
公开(公告)日：1992-04-01
申请号：EP91308771.4
申请日：1991-09-26
发明人： Shimizu, Seizaburo, c/o Intellectual Property Div. , Sasaki, Osamu, c/o Intellectual Property Div. , Yoshizumi, Akira, c/o Intellectual Property Div. , Ohta, Hideo, c/o Intellectual Property Div.
CPC分类号： H05K3/10 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/041 , H05K3/20 , H05K3/4084 , H05K3/4617 , H05K3/4632 , H05K3/4635 , H05K2201/0129 , H05K2201/055 , H05K2201/09081 , H05K2203/0108 , H05K2203/0156 , H05K2203/0195 , H05K2203/085 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165 , Y10T29/49167 , Y10T29/532 , Y10T156/107 , Y10T156/109
摘要： There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns (8) are transferred onto a thermoplastic resin (7), without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate (5) having protruding patterns (4) which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil (6) used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil (6) and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns (4) of the original plate (5) against a thermoplastic resin (7) with the copper foil (6) interposed therebetween to transfer portions of the copper foil (6) in contact with the protruding patterns (4) onto the surface of the thermoplastic resin (7), thereby forming the circuit patterns (8).
摘要翻译： 公开了一种制造印刷电路板的方法，其中精细的铜电路图案（8）被转印到热塑性树脂（7）上，与减法方法不同，不会产生大量溶解有铜的废液。 用于制造印刷电路板的方法包括以下步骤：制造具有突起图案（4）的印刷电路板（5），所述突起图案（4）具有与待形成的电路图案相同的形状，并且高度至少与 所使用的铜箔（6）由平坦或凸出的弯曲表面构成，以与铜箔（6）接触并且与平坦或突出的弯曲表面不同的侧表面构成，并且在压力下加热突出图案 （5）的表面与热塑性树脂（7）之间插入铜箔（6），以将铜箔（6）的与突出图案（4）接触的部分转印到 热塑性树脂（7），从而形成电路图案（8）。
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公开(公告)号：EP0478320A3
公开(公告)日：1993-06-30
申请号：EP91308771.4
申请日：1991-09-26
发明人： Shimizu, Seizaburo, c/o Intellectual Property Div. , Sasaki, Osamu, c/o Intellectual Property Div. , Yoshizumi, Akira, c/o Intellectual Property Div. , Ohta, Hideo, c/o Intellectual Property Div.
CPC分类号： H05K3/10 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/041 , H05K3/20 , H05K3/4084 , H05K3/4617 , H05K3/4632 , H05K3/4635 , H05K2201/0129 , H05K2201/055 , H05K2201/09081 , H05K2203/0108 , H05K2203/0156 , H05K2203/0195 , H05K2203/085 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165 , Y10T29/49167 , Y10T29/532 , Y10T156/107 , Y10T156/109
摘要： There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns (8) are transferred onto a thermoplastic resin (7), without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate (5) having protruding patterns (4) which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil (6) used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil (6) and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns (4) of the original plate (5) against a thermoplastic resin (7) with the copper foil (6) interposed therebetween to transfer portions of the copper foil (6) in contact with the protruding patterns (4) onto the surface of the thermoplastic resin (7), thereby forming the circuit patterns (8).
摘要翻译： 公开了一种制造印刷电路板的方法，其中精细的铜电路图案（8）被转印到热塑性树脂（7）上，而不会像减法那样产生大量的铜溶解的废液。 制造印刷电路板的方法包括以下步骤：制造具有与要形成的电路图案相同形状的突出图案（4）的印刷电路原版（5），其厚度至少等于 使用的铜箔（6），其均由与铜箔（6）接触的平坦或突出的弯曲表面和与平坦或突出的弯曲表面不同的侧表面构成，并且在压力下加热突出图案 （5）的热塑性树脂（7）与铜箔（6）之间插入其中以将与突出图案（4）接触的铜箔（6）的部分转印到 热塑性树脂（7），从而形成电路图案（8）。
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