公开(公告)号：EP2169717B1

公开(公告)日：2017-06-28

申请号：EP08162730.9

申请日：2005-08-16

申请人： Mitsubishi Materials Corporation

发明人： Negishi, Takeshi ,  Nagase, Toshiyuki

IPC分类号： H01L23/00 ,  H05K1/03 ,  H05K3/04 ,  H05K3/20 ,  H05K3/38 ,  H01L23/373 ,  H01L21/48

CPC分类号： H01L23/3735 ,  H01L21/4846 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/041 ,  H05K3/202 ,  H05K3/386 ,  H05K2203/0597 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53174 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

公开(公告)号：EP1722613B1

公开(公告)日：2011-11-23

申请号：EP05710333.5

申请日：2005-02-17

申请人： SANKYO KASEI CO., LTD.

发明人： YUMOTO, Tetsuo c/o Sankyo Kasei Co., Ltd.

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： G01R31/28 ,  H05K1/0284 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49176

摘要： A molding pin for a metal die is prevented from breaking, solder is surely deposited, and thus, a circuit pitch can be reduced to the limit. On the front plane of a circuit board (2), prescribed circuit patterns (3) made of a conductive material are formed, and on the rear plane, the prescribed circuit patterns are also formed. On the circuit board (2), a through hole (5) is formed to carry electricity between the circuit patterns on the both planes. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns (3) and wide in a circuit extending direction.

公开(公告)号：EP1107654A4

公开(公告)日：2006-05-24

申请号：EP00922937

申请日：2000-05-01

申请人： MITSUI MINING & SMELTING CO ,  SUZUKI CO LTD

发明人： NAKAMURA TOSHIYUKI ,  TANAKA HIDETO ,  ICHIRYU AKIRA ,  TAKAHASHI M ,  ISHII MASATO ,  ARAI DAISUKE

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H01L21/60 ,  H01L23/12

CPC分类号： H05K3/4614 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0385 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

摘要： A sheet for forming a printed wiring board which comprises a resin sheet (18) having a through-hole in the thickness direction and a metallic chip (46) inserted into the through-hole, and a method of manufacturing this sheet. The resin sheet (18) and a conductive metallic sheet (44) are placed in this order on a die base (16) having a die hole (14), then a hole is formed in the conductive metal sheet (44) with a punch (10) from the conductive metal sheet (44) side. At the same time, a hole (20) is also formed in the resin sheet, the conductive metal chip (46) formed by the punching from the conductive metal sheet (44) is inserted into the through-hole formed in the resin sheet (18). Thus, the sheet is manufactured. The front and rear surfaces of the sheet can be electrically interconnected by inserting this conductive metal chip (46) into the through-hole, and many substrates are stacked and by protruding and inserting the conductive metal chip (46). Thereby, the sheets can be electrically connected in the thickness direction by this protruded conductive metal chip (46) and a multilayer laminated board can be easily manufactured.

公开(公告)号：EP1150318A1

公开(公告)日：2001-10-31

申请号：EP99959858.4

申请日：1999-12-16

申请人： NEC Corporation

发明人： SUZUKI, Kenichiro ,  ARA, Youichi ,  CHEN, Shuguang

IPC分类号： H01H59/00 ,  B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0072 ,  B81B2203/0118 ,  H01H1/20 ,  H01H59/0009 ,  Y10T29/4916

摘要： To realize a micro switch which can be mass-produced, is low-cost, and is high-performance.
The micro switch includes: a supporting member 7 provided on a substrate 1 in such a manner as to be adjacent to the gap between two signal lines and to have a predetermined height with respect to the substrate 1; a flexible beam member (cantilever arm 8) provided in such a manner as to project from the supporting member almost horizontally to the above substrate surface and to extend so far that its part faces the above gap; a contact electrode 5 provided on the substrate 1 side of the beam member at least in such a position so as to face the gap, and a lower electrode 4 provided on the substrate 1 in such a manner as to face part of the beam member. A part of the beam member, ranging from the portion at which it is connected to the above supporting member 7 to the portion facing the above lower electrode 4, is allowed to be conductive to function as an upper electrode 9. And the thermal expansion coefficients of the beam member are allowed to be almost symmetric in the thickness direction perpendicular to the above substrate 1 surface, at least in a region ranging from the portion at which it is connected to the above supporting member 7 to the vicinity of the portion facing the above lower electrode 4.

摘要翻译： 实现可批量生产的微型开关，成本低，性能高。 微型开关包括：支撑构件7，其设置在与两个信号线之间的间隙相邻并且相对于基板1具有预定高度的方式设置在基板1上; 柔性梁构件（悬臂8），其以从支撑构件几乎水平地突出到上述基板表面的方式设置并延伸到其部分面向上述间隙; 设置在梁构件的基板1侧的接触电极5至少在与该间隙相对的这样的位置上;以及下部电极4，其以与梁构件的一部分相对的方式设置在基板1上。 梁构件的从连接到上述支撑构件7的部分到面向上述下部电极4的部分的一部分被允许导电以用作上部电极9.并且热膨胀系数 至少在从连接到上述支撑构件7的部分到面向上述基板1表面的部分附近的区域中，至少在与该基板1表面垂直的厚度方向上几乎对称。 在下电极4上方

公开(公告)号：EP1107654A1

公开(公告)日：2001-06-13

申请号：EP00922937.8

申请日：2000-05-01

申请人： Mitsui Mining & Smelting Co., Ltd. ,  Suzuki Co., Ltd

发明人： NAKAMURA, Toshiyuki, Suzuki Co., Ltd ,  TANAKA, Hideto, Suzuki Co., Ltd. ,  ICHIRYU, Akira, Mitsui Mining & Smelting Co., Ltd ,  TAKAHASHI, M., Mitsui Min. & Smelt. Co., Ltd ,  ISHII, Masato ,  ARAI, Daisuke, Mitsui Mining & Smelting Co., Ltd

IPC分类号： H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01L23/12 ,  H01L21/60

CPC分类号： H05K3/4614 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0385 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

摘要： The present invention provides a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole, and a process for producing the sheet. The sheet is produced by placing a resin sheet and a conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole also in the resin sheet, and inserting the punched conductive metal chip in the through hole of the resin sheet. By the insertion of the conductive metal chip in the through hole, the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet and if a large number of such substrates are laminated, electrical connection in the thickness direction can be readily made by virtue of the protruded conductive metal chips, and a multi-layer board can be readily produced.

摘要翻译： 本发明提供一种印刷电路板，形成片，其包括具有在厚度方向上的通孔并插入所述通孔的金属片，及其制造片材的方法的树脂片材。 片材是通过将树脂片和导电金属薄片在此订单中的具有基产生的孔中，从该导电性金属片侧进行冲孔以形成在导电金属片冲孔和以形成冲孔 所以在树脂片，和插入在所述树脂片的通孔中的导电冲压金属芯片。 通过在通孔内的导电金属片的插入，前，片材的后表面可以电连接到海誓山盟。 如果导电金属片被如此插入做它的尖端从片材的表面突出，并且如果大量搜索基板的层叠时，在厚度方向的电连接可以容易地借助于突出导电金属片制成，并且 多层板可以容易地制造。

公开(公告)号：EP0969707A3

公开(公告)日：2000-11-22

申请号：EP99201699.8

申请日：1999-05-28

申请人： Matsushita Electric Works, Ltd.

发明人： Yoshioka, Hirokazu ,  Yoshida, Norio ,  Tanaka, Kenichiro

IPC分类号： H05K3/46 ,  H05K3/00

CPC分类号： H05K3/4652 ,  H05K1/116 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/0055 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0969 ,  H05K2201/098 ,  H05K2201/09863 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165

摘要： A multilayer printed wiring board (11) is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole (3) provided in the insulating layer (2) as bottomed by the conductor layer (1a) exposed, a plated layer (4) provided inside the via hole (3) for electric connection between the conductor layers (1a,1b), the via hole (3) being formed to be of a concave curved surface of a radius in a range of 20 to 100 µm in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole (3), whereby the equipotential surfaces occurring upon plating the plated layer (4) are curved along the continuing zone to unify the density of current for rendering the plated layer (4) uniform in the thickness without being thinned at the continuing zone.

公开(公告)号：EP0966758A2

公开(公告)日：1999-12-29

申请号：EP98932465.0

申请日：1998-07-27

申请人： Koninklijke Philips Electronics N.V.

发明人： DRURY, Christopher, John ,  MUTSAERS, Cornelis, Marcus, Johannes ,  HART, Cornelis, Maria ,  DE LEEUW, Dagobert, Michel

IPC分类号： H01L21 ,  H01L23 ,  H01L51

CPC分类号： H01L21/486 ,  H01L21/76877 ,  H01L23/49827 ,  H01L23/49883 ,  H01L23/5328 ,  H01L23/535 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T29/4916 ,  H01L2924/00

摘要： A simple and reliable method of providing a vertical interconnect between thin-film microelectronic devices is provided. In said method, a tool tip (20) is used to make a notch (104) in a vertical interconnect area (100) of two organic electrically conducting areas (3, 6) separated from each other by an organic electrically insulating area (5). The method is used in the manufacture of integrated circuits consisting substantially of organic materials.

公开(公告)号：EP0820115A2

公开(公告)日：1998-01-21

申请号：EP97111968.0

申请日：1997-07-14

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Nakakubo, Hideaki ,  Ishizaki, Toshio ,  Yamada, Toru ,  Kagata, Hiroshi ,  Inoue, Tatsuya ,  Kitazawa, Shoichi

IPC分类号： H01P1/203 ,  H01P7/08 ,  H01P11/00

CPC分类号： H01P7/084 ,  H01P1/203 ,  H01P1/20345 ,  H01P11/008 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/4916

摘要： By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.

公开(公告)号：EP0478320A2

公开(公告)日：1992-04-01

申请号：EP91308771.4

申请日：1991-09-26

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Shimizu, Seizaburo, c/o Intellectual Property Div. ,  Sasaki, Osamu, c/o Intellectual Property Div. ,  Yoshizumi, Akira, c/o Intellectual Property Div. ,  Ohta, Hideo, c/o Intellectual Property Div.

IPC分类号： H05K3/04 ,  H05K3/20 ,  H05K3/42

CPC分类号： H05K3/10 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/041 ,  H05K3/20 ,  H05K3/4084 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2203/0108 ,  H05K2203/0156 ,  H05K2203/0195 ,  H05K2203/085 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T29/532 ,  Y10T156/107 ,  Y10T156/109

摘要： There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns (8) are transferred onto a thermoplastic resin (7), without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate (5) having protruding patterns (4) which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil (6) used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil (6) and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns (4) of the original plate (5) against a thermoplastic resin (7) with the copper foil (6) interposed therebetween to transfer portions of the copper foil (6) in contact with the protruding patterns (4) onto the surface of the thermoplastic resin (7), thereby forming the circuit patterns (8).

摘要翻译： 公开了一种制造印刷电路板的方法，其中精细的铜电路图案（8）被转印到热塑性树脂（7）上，与减法方法不同，不会产生大量溶解有铜的废液。 用于制造印刷电路板的方法包括以下步骤：制造具有突起图案（4）的印刷电路板（5），所述突起图案（4）具有与待形成的电路图案相同的形状，并且高度至少与 所使用的铜箔（6）由平坦或凸出的弯曲表面构成，以与铜箔（6）接触并且与平坦或突出的弯曲表面不同的侧表面构成，并且在压力下加热突出图案 （5）的表面与热塑性树脂（7）之间插入铜箔（6），以将铜箔（6）的与突出图案（4）接触的部分转印到 热塑性树脂（7），从而形成电路图案（8）。

公开(公告)号：EP0416518A2

公开(公告)日：1991-03-13

申请号：EP90116931.8

申请日：1990-09-04

申请人： IDEMITSU KOSAN COMPANY LIMITED

发明人： Nakano, Akikazu

IPC分类号： H05K1/03

CPC分类号： H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10T29/4916

摘要： A process for producing a printed circuit board is disclosed, in which the following steps are sequentially conducted:

(1) a step for dispersing in at least one of the mediums of water and an organic solvent

(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure,
(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and
(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of said components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l,

(2) a sedimentation step of the dispersed solids in said slurry,
(3) a step for removing at least one of the mediums of water and an organic solvent in the slurry by filtration and drying and molding the residue,
(4) a step for melting with heating and pressure forming the molded product, and
(5) a step for providing a metal layer on the molded article.

The printed circuit board obtained by the process is excellent in impact resistance, heat resistance, mechanical strength and size stability as well as dielectric properties.

摘要翻译： 公开了一种制造印刷电路板的方法，其中依次进行以下步骤：（1）将水和有机溶剂（A）的至少一种介质分散在95〜20重量％的 具有间同立构结构的苯乙烯聚合物，（B）5-80重量％的纤维长度为1-50毫米的纤维填料，和（C）0.1-30重量份至少一种粘合剂和 与所述组分（A）和（B）的总量的100重量份成比例的粘合纤维，以制备浓度为0.5-100g / l的浆料，（2）分散固体的沉降步骤 所述浆料，（3）通过过滤并干燥和成型残渣来除去浆料中的至少一种水和有机溶剂的步骤，（4）通过加热和加压成型模制物进行熔融的步骤， 和（5）在模制品上提供金属层的步骤。 通过该方法获得的印刷电路板具有优异的耐冲击性，耐热性，机械强度和尺寸稳定性以及介电性能。