公开(公告)号：EP3192111B1

公开(公告)日：2018-12-26

申请号：EP15840309.7

申请日：2015-08-31

Applicant: CELLINK CORPORATION

Inventor： COAKLEY, Kevin Michael ,  BROWN, Malcolm

IPC: H01M2/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H01M10/42

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

公开(公告)号：EP3283814A1

公开(公告)日：2018-02-21

申请号：EP16705919.5

申请日：2016-02-17

Applicant: OSRAM GmbH

Inventor： SCHLOSSER, Philipp

IPC: F21K99/00 ,  F21V7/00 ,  H05K1/18 ,  F21V3/04 ,  F21V7/22 ,  F21Y115/10 ,  F21Y105/00

CPC classification number: F21K9/90 ,  F21K9/00 ,  F21V3/049 ,  F21V7/0008 ,  F21V7/0016 ,  F21V7/22 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/0145 ,  H05K2201/09081 ,  H05K2201/10106

Abstract: The present invention relates to an illumination unit (2) comprising a planar substrate (7) and LEDs (8) thereon, wherein each of a plurality of portions (7a) of the substrate (7) is partially separated from the remaining substrate (7b) by means of an open joint gap (23), so each of the portions (7a) is still connected to the remaining substrate (7b) via a bridge region (24), on each of which portions (7a) at least one of the LEDs (8) is mounted and each of which portions (7a) is further folded out from the remaining substrate (7b) at the bridge region (24) and so positioned obliquely thereto.

公开(公告)号：EP3281497A1

公开(公告)日：2018-02-14

申请号：EP16714938.4

申请日：2016-04-08

Applicant: Marquardt GmbH

Inventor： HAMMA, Andreas ,  EBNER, Günther

IPC: H05K1/02 ,  H05K3/32 ,  H01H1/58 ,  H01H50/04 ,  H01H85/046

CPC classification number: H05K3/301 ,  G01R1/203 ,  H01H1/5805 ,  H01H50/047 ,  H01H85/046 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/167 ,  H05K3/326 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10022 ,  H05K2201/10053 ,  H05K2201/10181 ,  H05K2201/10409 ,  H05K2201/10962

Abstract: The invention relates to an electric assembly (1) comprising a printed circuit board (2) and a component (3). In particular, the component (3) can be an electromechanical component, such as an electric switch contact, an electric switch, a relay, or the like. The component (3) is electrically and/or mechanically connected to connection points (4) which can be found on and/or in the printed circuit board (2). The connection point (4) has at least one recess (5) in the printed circuit board (2) and is integrally formed on the printed circuit board (2) by means of at least one web (6) such that the connection point (4) can be deformed in at least one spatial direction.

公开(公告)号：EP3192111A4

公开(公告)日：2017-11-22

申请号：EP15840309

申请日：2015-08-31

Applicant: CELLINK CORP

Inventor： COAKLEY KEVIN MICHAEL ,  BROWN MALCOLM

IPC: H01M2/20 ,  H01M2/10 ,  H01M2/26 ,  H01M10/42 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

公开(公告)号：EP2054269B1

公开(公告)日：2016-10-12

申请号：EP07836836.2

申请日：2007-08-16

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SNIDER, Chris, R. ,  GUPTA, Vineet ,  COADY, Michael, G. ,  STAPERT, Curtis, Allen ,  MOESCHBERGER, Donald, G. ,  OBERLIN, Allen, E.

IPC: B60R5/00 ,  H04B1/08

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

公开(公告)号：EP2688101A1

公开(公告)日：2014-01-22

申请号：EP12177216.4

申请日：2012-07-20

Applicant: ABB Technology AG

Inventor： Pâques, Gontran ,  Trüssel, Dominik ,  Groot, Waldemar ,  Ellenbroek, Stefan ,  Hajas, David

IPC: H01L25/07

CPC classification number: H01L24/83 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/32 ,  H01L25/071 ,  H01L25/074 ,  H01L25/162 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H05K1/0254 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/09163 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2045 ,  H01L2924/00

Abstract: The present invention provides a method for electrically connecting a contact (7) of a first substrate (3) to a contact (11) of a second substrate (5), whereby the first substrate (3) is positioned below the second substrate (5), comprising the steps of providing the first substrate (3) with its contact (7) facing towards the second substrate (5), providing the second substrate (5) with its contact (11) facing away from the first substrate (3), bonding a bonding means (15) to the contact (7) of the first substrate (3), bonding the bonding means (15) to the first substrate (3) thereby forming a loop (17), and electrically connecting the contact (11) of the second substrate (5) to the bonding means (15). The present invention also provides an arrangement (1) of a first and a second substrate (3, 5), whereby the first substrate (3) is positioned below the second substrate (5), wherein a contact (7) of the first substrate (3) is connected to a contact (11) of the second substrate (5) according to the above method and a power semiconductor module comprising the above arrangement (1).

Abstract translation: 本发明提供一种将第一基板（3）的触点（7）与第二基板（5）的触点（11）电连接的方法，由此第一基板（3）位于第二基板（5）的下方 ），包括以下步骤：使其第一衬底（3）具有面向第二衬底（5）的触点（7），使第二衬底（5）的接触面（11）背离第一衬底（3） 将接合装置（15）接合到第一基板（3）的接触件（7）上，将接合装置（15）接合到第一基板（3），从而形成环（17），并将接触件 第二基板（5）的端部（11）与接合装置（15）的连接。 本发明还提供了第一和第二基板（3,5）的布置（1），由此第一基板（3）位于第二基板（5）的下方，其中第一基板（7）的接触件 （3）根据上述方法连接到第二基板（5）的触点（11），以及包括上述布置（1）的功率半导体模块。

公开(公告)号：EP2654105A1

公开(公告)日：2013-10-23

申请号：EP13164038.5

申请日：2013-04-17

Applicant: SAFT

Inventor： Guidal, Laurent ,  Susset, Pascal ,  Vigier, Nicolas

IPC: H01M2/12 ,  H01M10/48 ,  H01M2/34 ,  H05K1/02 ,  H01M2/02 ,  H01M10/0525 ,  H01M10/34 ,  H01M10/42 ,  H01M2/10

CPC classification number: H01M10/48 ,  H01M2/105 ,  H01M2/12 ,  H01M2/1241 ,  H01M2/1276 ,  H01M2/345 ,  H01M10/0525 ,  H01M10/34 ,  H01M10/425 ,  H01M10/482 ,  H01M10/488 ,  H01M2200/20 ,  H05K1/0268 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/10037 ,  H05K2203/175

Abstract: L'invention concerne un système et un procédé de détection de désoperculation pour un accumulateur étanche (1). L'accumulateur étanche comporte un conteneur (2) comprenant un opercule (3c) adapté pour se désolidariser du reste du conteneur et pour se déplacer lors d'une surpression de gaz à l'intérieur du conteneur (2) pour permettre la désoperculation de l'accumulateur étanche (1). Le système de détection (24) comprend une plaque de circuit imprimé (30) comprenant :
- une portion centrale (32) destinée à être située en regard de l'opercule (3c),
- une portion périphérique (34) entourant la portion centrale (32), et reliée à ladite portion centrale par des moyens de liaison consistant en :
◆ une charnière (40) adaptée pour se plier lors du déplacement de l'opercule (3c), et
◆ au moins une partie sécable (42) adaptée pour se rompre lors du déplacement de l'opercule (3c),

- une piste électrique (36) reliant la portion périphérique (34) à la portion centrale (32) en passant par la charnière (40) et par au moins une partie sécable (42), la piste électrique étant adaptée à son rompre lors de la rupture de la partie sécable lors du déplacement de l'opercule (3c).

Abstract translation: 该系统（24）具有一个印刷电路板（30）包括由面向密封盖（3C）的圆周限定的中央部分（32），并通过铰链连接到所述中央部分的外围部分（34）（40） 意的密封帽的运动过程中弯曲。 易碎部分（42）中断在所述密封盖的移动。 电轨道（36）连接所述外围部分通过铰链与中央部的易碎部分，其中，所述轨道是为了通过在所述密封盖的移动易碎部分的断裂破碎。 因此独立claimsoft包括用于检测在密封蓄电池的排气的方法。

公开(公告)号：EP2135839A3

公开(公告)日：2013-10-16

申请号：EP09006279.5

申请日：2009-05-08

Applicant: Garmin Switzerland GmbH

Inventor： Kulach, Christopher J. ,  MacDonald, Paul R.

IPC: B81B7/00

CPC classification number: B81B7/0054 ,  B81B2201/0235 ,  B81B2207/096 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/09081 ,  H05K2201/10151

Abstract: A system for improving the performance of a microelectromechanical systems (MEMS) device that is housed in a package and implemented on a printed circuit board (PCB) comprises a footprint, an isolation channel, and a bridge. A portion of the isolation channel is removed to mechanically isolate the MEMS device.

公开(公告)号：EP2055161B1

公开(公告)日：2013-10-16

申请号：EP07836856.0

申请日：2007-08-16

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SNIDER, Chris, R. ,  GUPTA, Vineet ,  HUNTZINGER, Joseph, K. ,  COADY, Michael, G. ,  STAPERT, Curtis, A. ,  MEYER, Kevin, E. ,  GARNER, Timothy, D. ,  BELL, Jeffrey, T. ,  VADAS, Robert, L. ,  MOESCHBERGER, Donald, G. ,  OBERLIN, Allen, E. ,  BURTON, Paul, C.

IPC: H05K7/14 ,  H05K5/02 ,  H05K13/00 ,  H05K1/14

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting "slide lock" and "snap lock" self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

公开(公告)号：EP2365740A3

公开(公告)日：2013-08-21

申请号：EP11157584.1

申请日：2011-03-10

Applicant: Omron Corporation

Inventor： Oba, Hitoshi ,  Nishimori, Naoki ,  Matsui, Akira ,  Ishikawa, Nobuharu ,  Yamashita, Yoshihiro ,  Suga, Takahiro ,  Sugiyama, Kosuke

IPC: H05K1/18 ,  H05K1/02 ,  F21Y101/02 ,  G03B15/05

CPC classification number: H05K1/189 ,  F21K9/00 ,  F21K9/90 ,  F21Y2115/10 ,  G01N21/8806 ,  G03B15/05 ,  G03B2215/0539 ,  G03B2215/0575 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0293 ,  H05K3/0052 ,  H05K3/0058 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2203/0228 ,  H05K2203/175 ,  H05K2203/302

Abstract: To provide a manufacturing method for manufacturing a plurality of types of illuminating devices having different specifications while suppressing cost. A substrate includes a common portion having flexibility and a plurality of units bendable with respect to the common portion, where the common portion includes a pad that is extended in the horizontal direction in the plane of drawing and that is arranged for every predefined interval In the present manufacturing method, a substrate piece is created by cutting the substrate mounted with the light emitting element in a first direction, the common portion in the substrate piece is formed according to the illuminating device to be manufactured, the relative position of the individual portion with respect to the formed common portion is respectively positioned, and the wiring for supplying power to the pad in the substrate piece is formed.

Abstract translation: 提供制造具有不同规格的多种类型的照明装置的制造方法，同时抑制成本。 衬底包括具有柔性的公共部分和相对于公共部分可弯曲的多个单元，其中公共部分包括在绘图平面中沿水平方向延伸并且每隔预定间隔布置的衬垫 通过本发明的制造方法，通过沿第一方向切割安装有发光元件的基板来产生基板片，根据要制造的照明装置形成基片的公共部分，将各个部分的相对位置与 相对于形成的公共部分分别定位，并且形成用于向衬底中的焊盘供电的布线。