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公开(公告)号:EP2721381A4
公开(公告)日:2015-04-22
申请号:EP12800456
申请日:2012-06-12
Applicant: KLA TENCOR CORP
Inventor: JENSEN EARL , SUN MEI , O'BRIEN KEVIN
CPC classification number: G01J3/0259 , G01J1/58 , G01J3/0205 , G01J3/021 , G01J3/0256 , G01J3/0262 , G01J3/36 , G01J2003/1213
Abstract: A sensor apparatus for measuring characteristics of optical radiation has a substrate and a low profile spectrally selective detection system located within the substrate at one or more spatially separated locations. The spectrally selective detection system includes a generally laminar array of wavelength selectors optically coupled to a corresponding array of optical detectors. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
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2.
公开(公告)号:EP3201942A4
公开(公告)日:2018-06-20
申请号:EP15851269
申请日:2015-10-13
Applicant: KLA TENCOR CORP
Inventor: SUN MEI , JENSEN EARL , O'BRIEN KEVIN
CPC classification number: G01J1/429 , G01J1/0204 , G01J1/0271 , G01J1/0407 , G01J1/58 , G01J5/04 , G01J5/0818 , G01J5/10 , G01K11/20 , H01L21/67248 , H01L21/67253 , H01L22/10
Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.
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