利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

2 条记录 (耗时 0.008 秒)

    COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
    2.
    发明公开
    COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP 审中-公开
    组合物及其与无机颗粒和具有烷氧基甲硅烷基的环氧化合物硬化物体，它们的用途及其制备方法具有烷氧基硅烷A型环氧化合物

    公开(公告)号：EP2873672A4

    公开(公告)日：2016-01-06

    申请号：EP13796871

    申请日：2013-02-15

    申请人： KOREA IND TECH INST

    发明人： CHUN HYUN-AEE ,  PARK SU-JIN ,  PARK SOOK-YEON ,  KIM YUN-JU ,  TAK SANG-YONG ,  PARK SUNG-HWAN ,  KANG KYUNG-NAM

    IPC分类号： C08G59/30 ,  C07F7/18 ,  C08L63/02

    CPC分类号： C08K5/549 ,  C07C37/48 ,  C07C41/06 ,  C07D301/00 ,  C07D303/12 ,  C07D303/30 ,  C07D407/12 ,  C07F7/1836 ,  C07F7/1876 ,  C08K3/22 ,  C08K3/28 ,  C08K3/36 ,  C08K2003/2241 ,  C08K2003/2244

    摘要： The present invention relates to: a composition and a cured article comprising inorganic particles together with an alkoxysilyl-based epoxy compound which does not require a separate silane coupling agent and exhibits outstanding heat resistance, and more specifically a low coefficient of thermal expansion (CTE) and a high glass transition temperature or no Tg in a composite material; and a use for same. The present invention provides: inorganic particles and an alkoxysilyl-based epoxy compound; and an epoxy composition comprising an epoxy compound, inorganic particles and a curing agent; and a cured article of same and a use for same. A composite article of the composition comprising the inorganic particles and the alkoxysilyl-based epoxy compound of the present invention exhibits outstanding heat resistance, which is to say a low CTE and high glass transition temperature or no Tg, as the chemical bonding efficiency is improved during epoxy composite formation, not only due to chemical bonding of a filler material and the alkoxysilyl groups in the alkoxysilyl-based epoxy compound but also due to chemical bonding between the alkoxysilyl groups of the alkoxysilyl-based epoxy compound.

    摘要翻译： 本发明涉及：一种组合物和固化物与在烷氧基甲硅烷基的环氧化合物，其包含无机颗粒一起，它不需要单独的硅烷偶联剂和具有杰出的耐热性和热膨胀的更具体的低系数（CTE） 和高玻璃化转变温度Tg或没有在复合材料; 和相同的用途。 本发明提供：基于烷氧基甲硅烷的无机颗粒和环氧化合物; 和环氧组合物，包括环氧化合物，无机粒子和固化剂; 和相同的固化物和相同的用途。 该组合物包含无机颗粒和本发明的基于烷氧基甲硅烷的环氧化合物的复合制品显示出优秀的耐热性，所有这就是说低CTE和高玻璃化转变温度或无Tg时，作为化学键合效率期间提高 环氧树脂复合材料形成，这不仅是由于填充材料的化学键合和在基于烷氧基甲硅烷的环氧化合物的烷氧基甲硅烷基团，但这样由于烷氧基甲硅烷基的环氧化合物的烷氧基甲硅烷基团之间的化学键合。