摘要:
The present invention provides a compound which is the trichloroacetic acid salt of a compound of Formula (II) wherein R is selected from the group consisting of H, CH 3 -, (CH 3 ) 2 CH-, (CH 3 ) 2 CHCH 2 -, CH 3 CH 2 CH(CH 3 )-, and PhCH 2 -, and a process for its preparation.
Also provided is a process for its preparation based on the stereoselective epoxidation of the corresponding olefin precursor and a process for the preparation of several pharmaceutically active ingredients comprising the preparation of the compound of formula (II).
摘要:
Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.
摘要:
The present invention relates to: a composition and a cured article comprising inorganic particles together with an alkoxysilyl-based epoxy compound which does not require a separate silane coupling agent and exhibits outstanding heat resistance, and more specifically a low coefficient of thermal expansion (CTE) and a high glass transition temperature or no Tg in a composite material; and a use for same. The present invention provides: inorganic particles and an alkoxysilyl-based epoxy compound; and an epoxy composition comprising an epoxy compound, inorganic particles and a curing agent; and a cured article of same and a use for same. A composite article of the composition comprising the inorganic particles and the alkoxysilyl-based epoxy compound of the present invention exhibits outstanding heat resistance, which is to say a low CTE and high glass transition temperature or no Tg, as the chemical bonding efficiency is improved during epoxy composite formation, not only due to chemical bonding of a filler material and the alkoxysilyl groups in the alkoxysilyl-based epoxy compound but also due to chemical bonding between the alkoxysilyl groups of the alkoxysilyl-based epoxy compound.
摘要:
The present invention concerns a new process for the synthesis of aminaphtone, which makes use of non-toxic solvents and reagents, under mild reaction and temperature conditions.
摘要:
Product containing epichlorohydrin, wherein the amount of trichloropropane is of less than 0.01 g of trichloropropane per kg of product, a process for manufacturing the product and its use in various applications.
摘要:
Azolylmethylspiro-2.5-octanole der allgemeinen Formel in welcher A und B jeweils für ein Wasserstoffatom oder eine Alkylgruppe stehen; D Alkyl, Cycloalkyl, Cycloalkenyl, Biphenylyl, Naphthyl, Heteroaryl oder Phenyl bedeutet, wobei jeder dieser Reste substituiert sein kann; Z den Rest CH 2 oder O bedeutet, X den Rest CH oder N bedeutet, sowie deren pflanzenverträgliche Säureadditionssalze und Metallkomplexe und diese Verbindungen enthaltende Fungizide.
摘要:
Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.