PROCESS FOR THE PREPARATION OF AN INTERMEDIATE FOR THE SYNTHESIS OF I.A. CARFILZOMIB

    公开(公告)号:EP3330260A1

    公开(公告)日:2018-06-06

    申请号:EP16382582.1

    申请日:2016-12-01

    申请人: Enantia, S.L.

    IPC分类号: C07D303/12

    CPC分类号: C07D303/12

    摘要: The present invention provides a compound which is the trichloroacetic acid salt of a compound of Formula (II) wherein R is selected from the group consisting of H, CH 3 -, (CH 3 ) 2 CH-, (CH 3 ) 2 CHCH 2 -, CH 3 CH 2 CH(CH 3 )-, and PhCH 2 -, and a process for its preparation.

    Also provided is a process for its preparation based on the stereoselective epoxidation of the corresponding olefin precursor and a process for the preparation of several pharmaceutically active ingredients comprising the preparation of the compound of formula (II).

    EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR MANUFACTURING SAME, COMPOSITION AND CURED PRODUCT INCLUDING SAME, AND USE THEREOF
    2.
    发明公开
    EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR MANUFACTURING SAME, COMPOSITION AND CURED PRODUCT INCLUDING SAME, AND USE THEREOF 审中-公开
    具有环氧化合物的烷氧基甲硅烷基,用于生产它们的组合物的方法和硬化产物和正确使用THEREOF

    公开(公告)号:EP2960245A4

    公开(公告)日:2016-10-05

    申请号:EP14754737

    申请日:2014-02-25

    IPC分类号: C07F1/08 C07F7/10 C09J163/00

    摘要: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.

    摘要翻译: 提供的是在烷氧基甲硅烷环氧化合物,复合材料,其中显示出良好的耐热性,低的CTE并提高玻璃化转变温度,并且其固化物表现出良好的阻燃性,而不需要单独的偶联剂,制备方法相同的和的组合物和 固化的产品,包括相同。 在烷氧基甲硅烷的环氧化合物包括环氧基团和在选自式S11选择为S15或选自式S21中选择到S25 S2 S1的取代基的取代基的至少一个烷氧基硅烷基的的; 为通过开始对环氧组合物包括环氧化合物,和固化的产物和使用该组合物的材料和alkoxysilylation的环氧基开环反应来制备其的方法,提供了。 由于化学键可以烷氧基硅烷基和烷氧基甲硅烷的填料组之间和之间形成,该复合材料的化学结合效率可以提高。

    COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
    3.
    发明公开
    COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP 审中-公开
    组合物及其与无机颗粒和具有烷氧基甲硅烷基的环氧化合物硬化物体,它们的用途及其制备方法具有烷氧基硅烷A型环氧化合物

    公开(公告)号:EP2873672A4

    公开(公告)日:2016-01-06

    申请号:EP13796871

    申请日:2013-02-15

    IPC分类号: C08G59/30 C07F7/18 C08L63/02

    摘要: The present invention relates to: a composition and a cured article comprising inorganic particles together with an alkoxysilyl-based epoxy compound which does not require a separate silane coupling agent and exhibits outstanding heat resistance, and more specifically a low coefficient of thermal expansion (CTE) and a high glass transition temperature or no Tg in a composite material; and a use for same. The present invention provides: inorganic particles and an alkoxysilyl-based epoxy compound; and an epoxy composition comprising an epoxy compound, inorganic particles and a curing agent; and a cured article of same and a use for same. A composite article of the composition comprising the inorganic particles and the alkoxysilyl-based epoxy compound of the present invention exhibits outstanding heat resistance, which is to say a low CTE and high glass transition temperature or no Tg, as the chemical bonding efficiency is improved during epoxy composite formation, not only due to chemical bonding of a filler material and the alkoxysilyl groups in the alkoxysilyl-based epoxy compound but also due to chemical bonding between the alkoxysilyl groups of the alkoxysilyl-based epoxy compound.

    摘要翻译: 本发明涉及:一种组合物和固化物与在烷氧基甲硅烷基的环氧化合物,其包含无机颗粒一起,它不需要单独的硅烷偶联剂和具有杰出的耐热性和热膨胀的更具体的低系数(CTE) 和高玻璃化转变温度Tg或没有在复合材料; 和相同的用途。 本发明提供:基于烷氧基甲硅烷的无机颗粒和环氧化合物; 和环氧组合物,包括环氧化合物,无机粒子和固化剂; 和相同的固化物和相同的用途。 该组合物包含无机颗粒和本发明的基于烷氧基甲硅烷的环氧化合物的复合制品显示出优秀的耐热性,所有这就是说低CTE和高玻璃化转变温度或无Tg时,作为化学键合效率期间提高 环氧树脂复合材料形成,这不仅是由于填充材料的化学键合和在基于烷氧基甲硅烷的环氧化合物的烷氧基甲硅烷基团,但这样由于烷氧基甲硅烷基的环氧化合物的烷氧基甲硅烷基团之间的化学键合。