公开(公告)号：EP3187863A4

公开(公告)日：2018-05-02

申请号：EP15836633

申请日：2015-08-22

Applicant: KYOCERA CORP

Inventor： OTOMARU HIDEKAZU ,  KIMURA TAKASHI

IPC: G01N27/04 ,  G01N15/00 ,  G01N15/06

CPC classification number: G01N27/04 ,  G01M15/102 ,  G01N15/06 ,  G01N15/0606 ,  G01N15/0656 ,  G01N2015/0046

Abstract: A sensor board (4) includes: an insulating substrate (1) having a principal surface; and a detecting electrode (2) disposed on the principal surface of the insulating substrate (1), the detecting electrode (2) being formed mainly of a first metallic material composed of a base-metal based material which is catalytically inactive with respect to a decomposition reaction of particulates, an exposed surface (21) of the detecting electrode (2) being covered by a passivation film of the first metallic material. Since decomposition of a to-be detected substance such as soot by the detecting electrode (2) due to the catalytic reaction is suppressed and oxidation of the entirety of the detecting electrode (2) is suppressed by the passivation film, the to-be-detected substance is detected with high accuracy.

公开(公告)号：EP3030061A4

公开(公告)日：2017-03-29

申请号：EP14832561

申请日：2014-07-28

Applicant: KYOCERA CORP

Inventor： OTOMARU HIDEKAZU ,  KIMURA TAKASHI

IPC: H05K3/34 ,  H01L23/12

CPC classification number: H05K1/09 ,  H01L23/15 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H05K1/097 ,  H05K1/111 ,  H05K1/113 ,  H05K1/181 ,  H05K3/34 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0376 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/10318 ,  H05K2203/121

Abstract: A wiring board includes an insulating substrate (1) composed of a ceramic sintered compact; and a connection pad (2) disposed on a surface part of the insulating substrate. The connection pad includes a first portion (2a) disposed on the surface part of the insulating substrate and a second portion (2b) disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion (2b) of the connection pad is composed of platinum, and at least an exposed surface part of the first portion (2a) of the connection pad is composed of platinum containing a ceramic component. Since a brazing material used when a lead terminal is joined to the connection pad does not readily flow onto the second portion (2b), an outer periphery of the brazing material and the outer periphery of the connection pad are located at different positions, and fracture in the connection pad caused by thermal stress concentration on the outer periphery of the connection pad, or the like is suppressed. Further, an exposed surface of the connection pad is composed of platinum or platinum containing a ceramic component, and therefore does not readily oxidize. Thereby, an excellent heat-resistant wiring board or the like can be obtained.

Abstract translation: 布线板包括由陶瓷烧结体构成的绝缘基板（1） 以及设置在所述绝缘基板的表面部分上的连接焊盘（2）。 连接焊盘包括设置在绝缘基板的表面部分上的第一部分（2a）和设置在第一部分上的第二部分（2b），第二部分的外周位于第二部分的外周的内侧 第一部分。 连接焊盘的第二部分（2b）由铂构成，并且至少连接焊盘的第一部分（2a）的露出表面部分由含有陶瓷部件的铂组成。 由于当引线端子连接到连接焊盘时使用的钎焊材料不容易流入第二部分（2b），所以钎焊材料的外周和连接焊盘的外周位于不同的位置，并且断裂 在连接焊盘的外周上的热应力集中引起的连接焊盘等被抑制。 此外，连接焊盘的暴露表面由含有陶瓷组分的铂或铂组成，因此不容易氧化。 由此，可以获得优异的耐热布线板等。