公开(公告)号：EP3404675A1

公开(公告)日：2018-11-21

申请号：EP17171188.0

申请日：2017-05-15

Applicant: EBG Elektronische Bauelemente GmbH

Inventor： Lindner, Christian Rene ,  Praschk, Josef

IPC: H01C1/144 ,  H05K1/16 ,  H05K3/40 ,  H01C7/00

CPC classification number: H01C1/144 ,  H01C1/012 ,  H01C1/084 ,  H01C3/12 ,  H01C7/003 ,  H05K1/165 ,  H05K3/4015 ,  H05K2201/09263 ,  H05K2201/10318

Abstract: Es wird ein Leistungswiderstand (1) mit mindestens einem elektrischen Anschluss (2.1, 2.2, 2.3), mit einem Trägersubstrat (3), das mindestens ein Widerstandselement (4.1, 4.2) aus einem Dickschichtmaterial und mindestens eine Kontaktelektrode (5.1, 5.2, 5.3) aufweist, an die das Widerstandselement (4.1, 4.2) elektrisch anschließt, mit wenigstens einem elektrischen Leiter (7.1, 7.2, 7.3), der mit der Kontaktelektrode (5.1, 5.2, 5.3) verlötet ist und eine elektrische Verbindung zwischen der Kontaktelektrode (5.1, 5.2, 5.3) und dem elektrischen Anschluss (2.1, 2.2, 2.3) herstellt, und mit einem, zumindest teilweise mit mindestens einer Vergussmasse (17) gefüllten Gehäuse (8), das Widerstandselement (4.1, 4.2) und Kontaktelektrode (5.1, 5.2, 5.3) vergossen aufnimmt, wobei der elektrische Leiter (7.1, 7.2, 7.3) durch die Vergussmasse (17) ragt. Um einen konstruktiv einfachen und leicht handhabbaren Leistungswiderstand (1) zu schaffen, wird vorgeschlagen, dass ein Stift, insbesondere ein Löt- oder Einpressstift, den elektrischen Leiter (7.1, 7.2, 7.3) ausbildet, welcher Stift (9.1, 9.2, 9.3) auf die Kontaktelektrode (5.1, 5.2, 5.3) aufgesetzt und mit dieser verlötet ist sowie den elektrischen Anschluss (2.1, 2.2, 2.3) des Leistungswiderstands (1) ausbildet.

公开(公告)号：EP3383149A1

公开(公告)日：2018-10-03

申请号：EP18163961.8

申请日：2018-03-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： LEE, Chang-Joon ,  LEE, Yong-Won ,  JANG, Hyun-Tae

IPC: H05K3/34 ,  H05K9/00 ,  B32B15/01 ,  H05K1/02

CPC classification number: H05K9/0049 ,  B32B15/013 ,  H05K1/0216 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/303 ,  H05K3/341 ,  H05K9/0028 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10371 ,  Y02P70/613

Abstract: According to various embodiments of the present disclosure, a metal unit 100 may include: a core metal layer 110 that is mainly composed of iron (Fe); and an outer layer 120 formed on at least one face 111, 112 of the core metal layer, and bonded to solder 10 so as to be attached to a printed circuit board 21. The metal unit and an electronic device including the same may be variously implemented according to embodiments.

公开(公告)号：EP2937628B1

公开(公告)日：2018-05-23

申请号：EP13865211.0

申请日：2013-12-16

Applicant: Leeleds Lighting (Xiamen) Co., Ltd.

Inventor： WANG, Linhua ,  ZHU, Xiaolei ,  ZHOU, Lin ,  ZHAO, Han

IPC: F21V23/00 ,  F21V23/06 ,  F21K9/23 ,  F21Y115/10

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An electric connecting piece (30) and an LED lamp using the electric connecting piece (30) are provided. The electric connecting piece (30) is used for the electric connection between a light source substrate (20) and a driving board (40) of the LED lamp (100), and comprises an input terminal (32) and an output terminal (34). The LED lamp (100) comprises the driving board (40) and the light source substrate (20). The output terminal (34) is provided on the driving board (40) of the LED lamp (100), and the light source substrate (20) is provided with a fixing hole (22) corresponding to the input terminal (32). The input terminal (32) is fixed in the fixing hole (22) of the light source substrate (20) and is electrically connected with the light source substrate (20). The output terminal (34) comprises two contacts (342), and one end of each of the two contacts (342) is electrically connected with the driving board (40) respectively. The input terminal (32) comprises two connection heads which are respectively provided corresponding to the two contacts (342). One end of each of the two connection heads is electrically connected with the light source substrate (20) respectively. During assembling, the two contacts (342) of the output terminal (34) are respectively inserted into the two corresponding connection heads of the input terminal (32), and the two connection heads are elastically propped against the two contacts (342) respectively. The electric connecting piece (30) has the advantage of convenience in automatic assembling.

公开(公告)号：EP2937628A4

公开(公告)日：2015-11-18

申请号：EP13865211

申请日：2013-12-16

Applicant: LEELEDS LIGHTING XIAMEN CO LTD

Inventor： WANG LINHUA ,  ZHU XIAOLEI ,  ZHOU LIN ,  ZHAO HAN

IPC: F21V23/00 ,  F21K99/00 ,  F21V23/06 ,  F21Y101/02

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An electric connecting piece (30) and an LED lamp using the electric connecting piece (30) are provided. The electric connecting piece (30) is used for the electric connection between a light source substrate (20) and a driving board (40) of the LED lamp (100), and comprises an input terminal (32) and an output terminal (34). The LED lamp (100) comprises the driving board (40) and the light source substrate (20). The output terminal (34) is provided on the driving board (40) of the LED lamp (100), and the light source substrate (20) is provided with a fixing hole (22) corresponding to the input terminal (32). The input terminal (32) is fixed in the fixing hole (22) of the light source substrate (20) and is electrically connected with the light source substrate (20). The output terminal (34) comprises two contacts (342), and one end of each of the two contacts (342) is electrically connected with the driving board (40) respectively. The input terminal (32) comprises two connection heads which are respectively provided corresponding to the two contacts (342). One end of each of the two connection heads is electrically connected with the light source substrate (20) respectively. During assembling, the two contacts (342) of the output terminal (34) are respectively inserted into the two corresponding connection heads of the input terminal (32), and the two connection heads are elastically propped against the two contacts (342) respectively. The electric connecting piece (30) has the advantage of convenience in automatic assembling.

Abstract translation: 提供电连接件（30）和使用电连接件（30）的LED灯。 电连接片（30）用于光源基板（20）和LED灯（100）的驱动板（40）之间的电连接，并包括输入端子（32）和输出端子（34） ）。 LED灯（100）包括驱动板（40）和光源基板（20）。 输出端子（34）设置在LED灯（100）的驱动板（40）上，光源基板（20）具有与输入端子（32）对应的固定孔（22）。 输入端子（32）固定在光源基板（20）的固定孔（22）中，与光源基板（20）电连接。 输出端子（34）包括两个触点（342），两个触点（342）中的每一个的一端分别与驱动板（40）电连接。 输入端子（32）包括分别对应于两个触头（342）设置的两个连接头。 两个连接头中的每一个的一端分别与光源基板（20）电连接。 在组装期间，输出端子（34）的两个触点（342）分别插入到输入端子（32）的两个相应的连接头中，并且两个连接头分别弹性支撑在两个触头（342）上。 电连接件（30）具有自动组装方便的优点。

公开(公告)号：EP2887415A1

公开(公告)日：2015-06-24

申请号：EP13836856.8

申请日：2013-09-13

Applicant: LG Chem, Ltd.

Inventor： KANG, Minsoo ,  OH, Ducksu ,  LIM, Sung-Ryun ,  HEO, Dong-Hyuk

IPC: H01L51/50 ,  H05B33/06

CPC classification number: F21V19/0025 ,  F21K9/20 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/50 ,  H01L2251/5361 ,  H05B33/06 ,  H05B33/145 ,  H05B33/28 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09845 ,  H05K2201/10128 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611

Abstract: The present invention discloses a lighting module using an organic light emitting device (OLED) and particularly, a lighting module using the OLED which stably couples a power supply terminal to an electrode pad which is formed on a glass substrate of an OLED illumination plate.

Abstract translation: 本发明公开了一种使用有机发光器件（OLED）的照明模块，特别地，使用OLED的照明模块，其将电源端子稳定地耦合到形成在OLED照明板的玻璃基板上的电极焊盘。

公开(公告)号：EP1868242B1

公开(公告)日：2014-10-08

申请号：EP07011562.1

申请日：2007-06-13

Applicant: Hitachi, Ltd.

Inventor： Oyama, Kazuhiro ,  Mori, Mutsuhiro ,  Saito, Katsuaki ,  Koike, Yoshihiko

IPC: H01L23/24 ,  H05K1/14 ,  H01L25/16 ,  H01L25/18 ,  H01L25/07

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L25/072 ,  H01L25/16 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/10287 ,  H05K2201/10318 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2709430A1

公开(公告)日：2014-03-19

申请号：EP13178338.3

申请日：2013-07-29

Applicant: OMRON CORPORATION

Inventor： Hara, Shintaro ,  Konagata, Shoichi ,  Iwasaki, Yuzo ,  Shiraishi, Tomonori

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H01L23/492 ,  H01L23/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/29007 ,  H01L2224/29036 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/13033 ,  H01L2924/15747 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10053 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/37099

Abstract: This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. The substrate structure comprises a substrate (3), a groove portion (8) on said substrate (3) for surrounding a solder paste (11), said groove portion (8) and solder paste (11) for mounting a semiconductor device.

Abstract translation: 本发明提供一种能够有效地防止在回流焊接期间由于焊剂蒸发引起的爆炸而产生的焊球的散射以及熔融焊料向周围扩散的衬底结构。 基板结构包括基板（3），用于包围焊膏（11）的所述基板（3）上的槽部（8），所述槽部（8）和用于安装半导体器件的焊膏（11）。

公开(公告)号：EP2517247A1

公开(公告)日：2012-10-31

申请号：EP10796386.0

申请日：2010-12-21

Applicant: Pyreos Ltd.

Inventor： LAIRD, Ron ,  FREEBORN, Scott ,  STEWART, Archie, Shaw

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/1465 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/18 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/15312 ,  H05K3/34 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/10318 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for producing an infrared light detector (1) has the steps of: providing a plurality of connection pins (11, 12), which are kept parallel to one another and arranged with one of the longitudinal ends (17, 18) thereof in a horizontal plane, and a printed circuit board (6) with a planar underside (8), in which a recess (15, 16) of the same form in each case is provided for each of the connection pins (11, 12); filling the recesses (15, 16) with a solder paste, so that in each of the recesses (15, 16) there is a solder paste body (21) with the same amount of solder paste; positioning the printed circuit board (6) over the connection pins (11, 12), so that each of the connection pins (11, 12) extends with its longitudinal end (17, 18) in the recess (15, 16) assigned to it and dips in the solder paste body (21) located in the respective recess (15, 16); liquefying the solder paste bodies (21), so that electrically conducting connections are formed between the connection pins (11, 12) and the solder paste bodies (21) and, on account of the surface tension in the solder paste bodies (21) and the dead weight of the printed circuit board (6), the underside (8) of the printed circuit board (6) is aligned parallel to the horizontal plane; solidifying the solder paste bodies (21), so that mechanically secure connections are formed by the solder paste bodies (21) between the printed circuit board (6) and the connection pins (11, 12) and the alignment of the underside (8) of the printed circuit board (6) parallel to the horizontal plane is fixed.

公开(公告)号：EP2516321A2

公开(公告)日：2012-10-31

申请号：EP11817213.9

申请日：2011-10-10

Applicant: Micro-Epsilon Messtechnik GmbH & Co. KG

Inventor： SCHMIDEDER, Sabine ,  THELEMANN, Torsten ,  NAGL, Josef ,  ASCHENBRENNER, Heinrich ,  HOENICKA, Reinhold

IPC: B81B7/00

CPC classification number: H05K1/181 ,  B81B7/0006 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/32 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4629 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10356 ,  Y10T29/49128 ,  H01L2924/00

Abstract: A sensor comprises a preferably multilayered ceramic substrate (2) and at least one sensor element (1) arranged in, at or on the ceramic substrate (2). Contact can be made with the sensor element (1) via a metallic contact (6), wherein the metallic contact (6) is produced by means of a soldering connection that electrically connects the contact (6) to the sensor element (1) and in the process produces a fixed mechanical connection of the contact (6) relative to the ceramic substrate (2). A method for producing the sensor according to the invention is furthermore claimed.

公开(公告)号：EP2040528A1

公开(公告)日：2009-03-25

申请号：EP08104959.5

申请日：2008-08-05

Applicant: Continental Automotive GmbH

Inventor： Loibl, Josef ,  Preuschl, Thomas ,  Schingale, Angelika ,  Smirra, Karl

IPC: H05K7/14 ,  H05K3/36

CPC classification number: H05K7/142 ,  H05K1/141 ,  H05K3/308 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/1059

Abstract: Die Erfindung betrifft ein Gehäusekonzept (1) für eine integrierte Steuerungselektronik mit einem Gehäuseboden (2), einer zentralen Steuerungselektronik (12) mit elektronischen Bauteilen, einem Verbindungsträger (4) und einer Signal- und Stromverteilungskomponente (5) als elektrischer Verbindung zwischen der zentralen Steuerungselektronik (12) und peripheren Komponenten, wobei der Gehäuseboden (2) wannenförmig ausgestaltet ist, darin der Verbindungsträger (4) mit Kontaktstiften (6) und die zentrale Steuerungselektronik (12) derart angeordnet sind, dass die Steuerungselektronik (12) durch die Kontaktstifte (6) elektrisch mit der darüber angeordneten Signal- und Stromverteilungskomponente (5) verbunden werden kann, und wobei der Gehäuseboden (2) umlaufend mit der Signal- und Stromverteilungskomponente (5) verbunden ist.

Abstract translation: 壳体（1）设置为中央控制电子器件（12）和外围部件之间的电连接的信号和电流分配部件（5）。 壳体基座（2）形成为桶状，并且连接托架（4）布置有接触销（6）和控制电子器件，使得控制电子器件与分配部件电连接。 外壳基座与分配部件循环连接。 接触销布置在连接托架的限定的保持器中。