公开(公告)号：EP1981316A3

公开(公告)日：2009-11-04

申请号：EP08251323.5

申请日：2008-04-04

申请人： Kabushiki Kaisha Toshiba

发明人： Suzuki, Ryota c/o Toshiba Corporation ,  Tanabe, Masahiro c/o Toshiba Corporation ,  Nakada, Taihei c/o Toshiba Corporation ,  Kumamoto, Tsuyoshi c/o Toshiba Corporation ,  Yamashita, Yuusuke c/o Toshiba Corporation

IPC分类号： H05K1/02

CPC分类号： H05K1/0251 ,  H05K1/0222 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

摘要： A multilayer high-frequency circuit board includes a signal line layer (102) in which a high-frequency signal line (11) is formed, ground layers (101, 103) which are laminated on both sides of the signal line layer, and an interlayer circuit which is provided in the signal line layer and which includes a ground connecting portion (13) connected to the ground layers and a signal line connecting portion (12) connected to the signal line. The interlayer circuit is characterized in that one of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other concentrically with the one being separated from the outer periphery of the other along the signal line layer, and an inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

公开(公告)号：EP1981316A2

公开(公告)日：2008-10-15

申请号：EP08251323.5

申请日：2008-04-04

申请人： Kabushiki Kaisha Toshiba

发明人： Suzuki, Ryota c/o Toshiba Corporation ,  Tanabe, Masahiro c/o Toshiba Corporation ,  Nakada, Taihei c/o Toshiba Corporation ,  Kumamoto, Tsuyoshi c/o Toshiba Corporation ,  Yamashita, Yuusuke c/o Toshiba Corporation

IPC分类号： H05K1/02

CPC分类号： H05K1/0251 ,  H05K1/0222 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

摘要： A multilayer high-frequency circuit board includes a signal line layer (102) in which a high-frequency signal line (11) is formed, ground layers (101, 103) which are laminated on both sides of the signal line layer, and an interlayer circuit which is provided in the signal line layer and which includes a ground connecting portion (13) connected to the ground layers and a signal line connecting portion (12) connected to the signal line. The interlayer circuit is characterized in that one of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other concentrically with the one being separated from the outer periphery of the other along the signal line layer, and an inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

摘要翻译： 多层高频电路板包括其中形成有高频信号线（11）的信号线层（102），层叠在信号线层的两侧的接地层（101,103）和 层间电路，其设置在信号线层中，并且包括连接到接地层的接地连接部分（13）和连接到信号线的信号线连接部分（12）。 所述层间电路的特征在于，所述信号线连接部和所述接地连接部中的一个与所述信号线连接部和所述接地连接部中的一个沿着所述信号线层与所述另一方的外周同心地包围， 一个和另一个的外围具有除了完整圆之外的类似形状。