公开(公告)号：EP4513547A1

公开(公告)日：2025-02-26

申请号：EP23791703.4

申请日：2023-04-07

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

Inventor： UENO, Toshihide

IPC: H01L23/13 ,  H01L23/12 ,  H01L23/36 ,  H05K1/02

Abstract: A ceramic circuit substrate according to an embodiment includes a ceramic substrate, a metal circuit, and a metal member. The metal circuit is located at one surface of the ceramic substrate. The thickness of the metal circuit is not less than 1 mm. The metal member is located at another surface of the ceramic substrate. The thickness of the metal member is not less than 1 mm. A ratio Vf / Vb of a total volume Vf of the metal circuit to a total volume Vb of the metal member is not less than 0.80 and not more than 1.20.

公开(公告)号：EP4513546A1

公开(公告)日：2025-02-26

申请号：EP23791815.6

申请日：2023-04-17

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

Inventor： UENO, Toshihide

IPC: H01L23/12 ,  H01L23/13 ,  H01L23/36 ,  H05K1/02 ,  H05K7/20

Abstract: A ceramic circuit board according to an embodiment comprises a ceramic substrate and metal sheets joined to either surface of the ceramic substrate. At least one of the metal sheets joined to either surface of the ceramic substrate is a cooling path metal sheet having a cooling path part. The thickness of the ceramic substrate is preferably less than the thickness of the cooling path metal sheet. It is preferable that the ceramic substrate comprises a first ceramic substrate and a second ceramic substrate which is joined to a metal sheet joined to the first ceramic substrate, wherein one surface of the second ceramic substrate is joined to a cooling path metal sheet joined to the first ceramic substrate, and a metal sheet is joined to the other surface of the second ceramic substrate.