公开(公告)号：EP0732040A1

公开(公告)日：1996-09-18

申请号：EP95904600.0

申请日：1994-12-02

申请人： Knopp, John Frederick David

发明人： Knopp, John Frederick David

IPC分类号： H05K3

CPC分类号： H05K3/428 ,  H05K2201/0344 ,  H05K2203/0565 ,  H05K2203/0723

摘要： A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements (10) on two opposed faces of a paper phenolic containing substrate (11); b) coating the substrate and circuit elements with a de-sensitising material (12); c) forming holes (13) through the substrate, each hole passing through a circuit element on each of the opposed faces of the board; d) treating the board to render the substrate exposed in the holes receptive to the action of a metallic plating solution; e) removing the de-sensitising material; f) printing an acid-resist mask (14) on to both faces of the board, the mask leaving exposed only a small area of the board surrounding each hole therethrough; and g) treating the board with an electroless nickel-plating solution to deposit nickel (15) in the holes to the desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements.