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公开(公告)号：EP3501828B1
公开(公告)日：2020-02-12
申请号：EP17210425.9
申请日：2017-12-22
发明人： NOH, Jeong Kyu , LEE, Jae Hwan , LEE, Duk Young
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公开(公告)号：EP3501829A1
公开(公告)日：2019-06-26
申请号：EP17210436.6
申请日：2017-12-22
发明人： KIM, Jae Hyung , NOH, Jeong Kyu , LEE, Jae Hwan , LEE, Duk Young
摘要： A printed circuit board inspection apparatus (100) generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.
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公开(公告)号：EP3501828A1
公开(公告)日：2019-06-26
申请号：EP17210425.9
申请日：2017-12-22
发明人： NOH, Jeong Kyu , LEE, Jae Hwan , LEE, Duk Young
CPC分类号： G01R31/28 , B41F15/26 , B41F33/0027 , B41F33/0036 , B41F33/0045 , G01N21/8806 , G06T7/0004 , G06T2207/20081 , G06T2207/30141 , G06T2207/30152 , H05K1/0268 , H05K1/0269 , H05K3/34 , H05K3/3484 , H05K13/08
摘要： A printed circuit board inspection apparatus (100) obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.
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