公开(公告)号：EP1766424B1

公开(公告)日：2018-11-21

申请号：EP05759537.3

申请日：2005-06-15

申请人： Power Measurement Ltd

发明人： LIGHTBODY, Simon H. ,  TEACHMAN, Michael E. ,  GUNN, Colin N. ,  HUBER, Benedikt T.

IPC分类号： G01R21/133 ,  G01R21/06 ,  G01R21/10 ,  G01R19/00 ,  G01R15/14 ,  G01R15/16 ,  G01R15/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16

CPC分类号： G01R15/142 ,  G01R15/16 ,  G01R15/181 ,  G01R21/06 ,  H05K1/0268 ,  H05K1/0393 ,  H05K1/165 ,  H05K2201/051

摘要： Systems and methods for monitoring power in a conductor. A flex circuit may include multiple layers including a voltage sensing layer, a coil layer, and a ground layer. The coil layer includes traces that form a coil structure around a conductor when the flex circuit is wrapped around the conductor. The coil layer generates a voltage that may be integrated to determine a current in the conductor. When the flex circuit is wrapped around the conductor, the voltage sensing layer is closest to the conductor. The voltage sensing layer forms a capacitor with the conductor. Using an adjustable capacitive voltage divider, the voltage of the conductor may be determined from a voltage signal received from the voltage sensing layer.

公开(公告)号：EP2991459B1

公开(公告)日：2018-02-14

申请号：EP14182073.8

申请日：2014-08-25

申请人： Home Control Singapore Pte. Ltd.

发明人： KIM, Teo Eng

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  G08C17/02

CPC分类号： H05K1/116 ,  G08C17/02 ,  H05K1/0268 ,  H05K3/365 ,  H05K2201/0394 ,  H05K2201/09063

摘要： A device comprising a single-sided printed circuit board (PCB) having a non-metallized hole, and a connection area (CA) close to the non-metallized hole on a metallized side of the single-sided printed circuit board. The present invention provides a conducting bridge (CP) from the connection area (CA) and at least partially covering the non-metallized hole, for allowing the connection area (CA) to be contacted, e.g. by a probe (P), from a non-metallized side of the single-sided printed circuit board (PCB) through the non-metallized hole.

公开(公告)号：EP3241413A1

公开(公告)日：2017-11-08

申请号：EP16703974.2

申请日：2016-02-11

申请人： Siemens Aktiengesellschaft

发明人： MÜLLER, Bernd ,  NIEDERMAYER, Michael ,  WITTREICH, Ulrich

IPC分类号： H05K1/02

CPC分类号： H05K1/0268 ,  B23K1/0016 ,  B23K2201/42 ,  G01K13/00 ,  H05K1/0269 ,  H05K3/341 ,  H05K2203/163 ,  H05K2203/176

摘要： The invention relates to a method for producing an electronic circuit (19) in a production system (23) (for example, a soldering furnace comprising a wave soldering system (32)). The invention also relates to an assembly comprising a circuit carrier (13) and an electronic circuit (19). Lastly, the invention relates to a production system (23) for producing an electronic circuit (19) on a circuit carrier (13). According to the invention, a measurement module (14) is used on the circuit carrier, which is already functional during the performed process step and can send measurement data to an external controller (25), for example. Said measurement module can be removed again after performance of the process step or after completion of the circuit carrier (13). Therefore the circuit carrier can advantageously be cost effectively produced, even if the measurement procedure carried out in the measurement module (14) is performed using high-value components. Since the measurement module (14) can be reused, the costs of the components of the measurement module places only a slight burden on the unit costs of the circuit carriers to be produced.

公开(公告)号：EP3216326A1

公开(公告)日：2017-09-13

申请号：EP15793704.6

申请日：2015-10-30

申请人： Häusermann GmbH

发明人： HACKL, Johann ,  HÖRTH, Stefan ,  REDL, Norbert

IPC分类号： H05K1/02 ,  H05K1/16 ,  H05K3/10

CPC分类号： H05K1/0265 ,  H05K1/0268 ,  H05K1/167 ,  H05K3/103

摘要： Disclosed is a circuit board (1) comprising at least one (quadrupole) current measuring element (20) consisting of at least one high-current conductor that is connected to two spaced-apart current terminals (6, 7) between which two spaced-apart measuring terminals (3, 4) are arranged; the (quadrupole) current measuring element (20) is designed as a shunt and is integrated into the structure of the circuit board (1).

摘要翻译： 公开了包括至少一个（四极）电流测量元件（20）的电路板（1），所述电流测量元件由至少一个高电流导体组成，所述高电流导体连接到两个间隔开的电流端子（6,7） 分开布置的测量端子（3,4） （四极）电流测量元件（20）被设计为分流器并被集成到电路板（1）的结构中。

公开(公告)号：EP3171678A1

公开(公告)日：2017-05-24

申请号：EP16198932.2

申请日：2016-11-15

申请人： Hamilton Sundstrand Corporation

发明人： LIN, Tran

IPC分类号： H05K1/02 ,  H05K3/34

CPC分类号： H05K1/0268 ,  G01R31/026 ,  G01R31/046 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/50 ,  H05K1/0206 ,  H05K1/0215 ,  H05K1/111 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2203/16 ,  H05K2203/162 ,  Y02P70/613

摘要： A printed circuit board includes a body and a belly pad seated within with the body. The belly pad (108) is electrically separated into a first pad (110) and a second pad (112). The first pad and the second pad are arranged to be electrically connected to one another by an interconnect (106) electrically connecting the belly pad to a conductive plane (126) of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.

摘要翻译： 印刷电路板包括主体和坐在主体内的腹垫。 腹垫（108）电分离成第一垫（110）和第二垫（112）。 第一衬垫和第二衬垫布置成通过将腹部衬垫电连接到电部件的导电平面（126）的互连件（106）彼此电连接，从而允许穿过第一衬垫之间的界面的连续性测试 和互连。

公开(公告)号：EP3153359A1

公开(公告)日：2017-04-12

申请号：EP16190744.9

申请日：2016-09-27

申请人： KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO

发明人： SENZAKI, Daisuke ,  KAWAMURA, Masayuki ,  KOJIMA, Hiroaki

IPC分类号： B60R25/01 ,  B60R25/04 ,  H05K1/02 ,  H05K1/14 ,  G01R31/28

CPC分类号： H05K1/0268 ,  G01R31/2801 ,  G01R31/2818 ,  G01R31/44 ,  H05K1/029 ,  H05K1/111 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K2203/162

摘要： A circuit board structure includes a test terminal. The circuit board structure includes and interface circuit board and a functional circuit board (1 or 2). The interface circuit board includes common test terminals (12 and 13) shared by different functional circuit boards (1 and 2). The functional circuit board (1 or 2) realizes a product function. The functional circuit board (1 or 2) is selected from a plurality of functional circuit boards (1 and 2) respectively realizing different product functions. Circuit components (5 and 21-23) required for each product function are mounted on the corresponding functional circuit board (1 or 2).

摘要翻译： 电路板结构包括测试端子。 电路板结构包括接口电路板和功能电路板（1或2）。 接口电路板包括由不同功能电路板（1和2）共享的公共测试端子（12和13）。 功能电路板（1或2）实现产品功能。 功能电路板（1或2）从分别实现不同产品功能的多个功能电路板（1和2）中选择。 每个产品功能所需的电路元件（5和21-23）安装在相应的功能电路板（1或2）上。

公开(公告)号：EP3053425A1

公开(公告)日：2016-08-10

申请号：EP14850377.4

申请日：2014-09-30

申请人： Sierra Wireless, Inc.

发明人： SYAL, Ashish ,  NEWMAN, Paul David

IPC分类号： H05K13/04 ,  G01R31/30

CPC分类号： H05K3/303 ,  G01R31/043 ,  H01R13/641 ,  H05K1/0268 ,  H05K13/08 ,  H05K2201/10151 ,  H05K2201/10325 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T307/826

摘要： A method and apparatus for adjusting circuit operation in response to physical orientation of an integrated circuit (IC) coupled to a host site via direct soldering or a socket. The IC can be installed in a correct orientation or rotated and installed in an incorrect orientation. The IC may have a square, substantially symmetric footprint and the incorrect orientation may correspond to 90 or 180 degree rotation of the IC from the correct orientation. The orientations may be discerned by sensing electrical characteristics of the installed IC. For example, the IC may ground a detection line when installed in the correct orientation, while the detection line may be floating when the IC is installed in an incorrect orientation. The IC may be switchably connected to other components such as a power supply only when it is detected as being installed in the correct orientation.

摘要翻译： 一种用于响应于耦合到通过直接焊接或插座主机站点的集成电路（IC）的物理方位调整电路操作方法和装置。 该IC可安装在一个正确的方向或旋转，并以不正确的方向安装英寸 IC可具有方形，基本上对称的覆盖区和不正确的取向可以从正确的取向对应于所述IC的90或180度的旋转。 取向可通过感测安装IC的电特性来辨别。 例如，IC可以接地检测线当安装在正确的方向，而检测线可以是浮动当不正确的方向被安装在IC。 IC可以可切换地连接到其他组件：如，只有当它被检测为被安装在正确的方位的电源。

公开(公告)号：EP1703780B1

公开(公告)日：2015-05-06

申请号：EP06251457.5

申请日：2006-03-17

申请人： Ricoh Company, Ltd.

发明人： Nakahira, Toshiaki

IPC分类号： H05K1/14

CPC分类号： H05K1/147 ,  H05K1/0268 ,  H05K2201/10189 ,  H05K2201/10689

公开(公告)号：EP2490033A4

公开(公告)日：2014-12-24

申请号：EP10823009

申请日：2010-06-25

申请人： HUIZHOU TCL MOBILE COMM CO LTD

发明人： SU HAIBO

IPC分类号： G01R31/28 ,  H01R31/06 ,  H05K1/02

CPC分类号： G01R31/2808 ,  G01R31/2815 ,  G01R31/2818 ,  H01R31/065 ,  H01R2201/20 ,  H05K1/0268 ,  H05K2201/10189

公开(公告)号：EP2659749A1

公开(公告)日：2013-11-06

申请号：EP11802080.9

申请日：2011-12-20

申请人： Robert Bosch GmbH

发明人： NOWOTNICK, Jens ,  WAGENBRENNER, Walter ,  WARMBOLD, Ulrich ,  HEINEMANN, Sven ,  LAUSMANN, Matthias ,  GEBHARDT, Holger ,  KLANTE, Bernhard

IPC分类号： H05K1/02 ,  H05K3/40

CPC分类号： H05K1/0268 ,  H05K3/10 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/099 ,  H05K2203/0415 ,  Y10T29/49155

摘要： The invention relates to a printed circuit board (10), with conductor tracks (11, 11a), which are arranged at least on a surface of the printed circuit board (10) and serve for the electrical contacting of components, and with at least one testing zone (12), which is formed by a portion of the conductor track (11) and serves for the electrical contacting of a testing element (20), in particular a testing head, wherein the surface of the printed circuit board (10) is provided with a protective layer (14), which is formed in the testing zone (12) such that it is interrupted in the region of a contact zone (15), and wherein the contact zone (15) is provided with a layer (18), which establishes an electrical contacting of the testing element (20) with the layer (18). According to the invention, it is provided that the contact zone (15) is arranged at least partially at a lateral distance from the edges of the conductor track (11) in the region of the testing zone (12).