公开(公告)号：EP2847619B1

公开(公告)日：2018-09-12

申请号：EP13735065.8

申请日：2013-05-03

Applicant: Koninklijke Philips N.V.

Inventor： LEVENE, Simha ,  VAN VEEN, Nicolaas, Johannes, Anthonius ,  ALTMAN, Amiaz ,  UMAN, Igor ,  GOSHEN, Rafael

IPC: G01T1/20

CPC classification number: G01T1/2018 ,  A61B6/032 ,  A61B6/482 ,  G01T1/202 ,  G01T1/362

Abstract: An imaging system (100) includes a radiation sensitive detector array (110). The detector array includes at least two scintillator array layers (116). The detector array further includes at least two corresponding photosensor array layers (114). At least one of the at least two photosensor array layers is located between the at least two scintillator array layers in a direction of incoming radiation. The at least one of the at least two photosensor array layers has a thickness that is less than thirty microns.

公开(公告)号：EP3155663B1

公开(公告)日：2018-05-16

申请号：EP15730278.7

申请日：2015-05-19

Applicant: Koninklijke Philips N.V.

Inventor： CHAPPO, Marc Anthony ,  GOSHEN, Rafael

IPC: H01L27/146 ,  G01T1/20

CPC classification number: H01L27/14663 ,  G01T1/2018 ,  H01L27/146 ,  H01L27/14658 ,  H01L27/14661 ,  H01L27/14687 ,  H01L27/1469

Abstract: An imaging system detector array (112) includes a detector tile (116). The detector tile includes a photosensor array (202), including a plurality of photosensor pixels (204). The detector tile further includes a scintillator array (212) optically coupled to the photosensor array. The detector tile further includes an electronics layer or ASIC on a substrate (214) that is electrically coupled to the photosensor array. The electronics layer includes a plurality of individual and divisible processing regions (302). Each processing region including a predetermined number of channels corresponding to a sub-set of the plurality of photosensor pixels. The processing regions are in electrical communication with each other. Each processing region includes its own electrical reference and bias circuitry (802, 804).

公开(公告)号：EP2577351B1

公开(公告)日：2017-06-14

申请号：EP11723665.3

申请日：2011-04-25

Applicant: Koninklijke Philips N.V. ,  Philips Intellectual Property & Standards GmbH

Inventor： LEVENE, Simha ,  WAINER, Naor ,  ALTMAN, Amiaz ,  GOSHEN, Rafael ,  RONDA, Cornelis, Reinder

IPC: G01T1/20

CPC classification number: G01T1/2018 ,  G01T1/2985

公开(公告)号：EP3042395B1

公开(公告)日：2017-03-08

申请号：EP14761338.4

申请日：2014-09-04

Applicant: Koninklijke Philips N.V.

Inventor： VAN VEEN, Nicolaas, Johannes, Anthonius ,  GOSHEN, Rafael ,  YOGEV, David ,  LIVNE, Amir

IPC: H01L25/04 ,  H01L27/146

CPC classification number: H01L27/14634 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L25/042 ,  H01L25/043 ,  H01L27/14623 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/1469 ,  H01L2224/091 ,  H01L2224/09165 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16148 ,  H01L2224/16505 ,  H01L2224/16506 ,  H01L2224/171 ,  H01L2224/81047 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/12043 ,  H01L2924/00

公开(公告)号：EP3155663A1

公开(公告)日：2017-04-19

申请号：EP15730278.7

申请日：2015-05-19

Applicant: Koninklijke Philips N.V.

Inventor： CHAPPO, Marc Anthony ,  GOSHEN, Rafael

IPC: H01L27/146

CPC classification number: H01L27/14663 ,  G01T1/2018 ,  H01L27/146 ,  H01L27/14658 ,  H01L27/14661 ,  H01L27/14687 ,  H01L27/1469

Abstract: An imaging system detector array (112) includes a detector tile (116). The detector tile includes a photosensor array (202), including a plurality of photosensor pixels (204). The detector tile further includes a scintillator array (212) optically coupled to the photosensor array. The detector tile further includes an electronics layer or ASIC on a substrate (214) that is electrically coupled to the photosensor array. The electronics layer includes a plurality of individual and divisible processing regions (302). Each processing region including a predetermined number of channels corresponding to a sub-set of the plurality of photosensor pixels. The processing regions are in electrical communication with each other. Each processing region includes its own electrical reference and bias circuitry (802, 804).

Abstract translation: 成像系统检测器阵列（112）包括检测器瓦片（116）。 检测器瓦片包括包括多个光电传感器像素（204）的光电传感器阵列（202）。 检测器瓦片还包括光学耦合到光电传感器阵列的闪烁体阵列（212）。 检测器瓦片还包括电耦合到光电传感器阵列的衬底（214）上的电子层或ASIC。 电子层包括多个单独和可分割的处理区域（302）。 每个处理区域包括与多个光电传感器像素的子集相对应的预定数量的通道。 处理区域彼此电连通。 每个处理区域包括其自己的电参考和偏置电路（802,804）。

公开(公告)号：EP3042395A1

公开(公告)日：2016-07-13

申请号：EP14761338.4

申请日：2014-09-04

Applicant: Koninklijke Philips N.V.

Inventor： VAN VEEN, Nicolaas, Johannes, Anthonius ,  GOSHEN, Rafael ,  YOGEV, David ,  LIVNE, Amir

IPC: H01L25/04 ,  H01L27/146

CPC classification number: H01L27/14634 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L25/042 ,  H01L25/043 ,  H01L27/14623 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/1469 ,  H01L2224/091 ,  H01L2224/09165 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16148 ,  H01L2224/16505 ,  H01L2224/16506 ,  H01L2224/171 ,  H01L2224/81047 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/12043 ,  H01L2924/00

Abstract: The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

公开(公告)号：EP3657219A1

公开(公告)日：2020-05-27

申请号：EP18207183.7

申请日：2018-11-20

Applicant: Koninklijke Philips N.V.

Inventor： TOUSIGNANT, Olivier ,  SIMON, Matthias ,  ALVING, Peter Lex ,  JACOBS, Johannes Wilhelmus Maria ,  RUETTEN, Walter ,  GOSHEN, Rafael

IPC: G01T1/20 ,  G01T1/24

Abstract: A sensor array module (100) for sensing radiation is provided, comprising a flexible substrate (102) including a surface (112), a plurality of sensing elements (103) directly provided on a sensing area (104) of the surface of the flexible substrate, a plurality of conductive paths (113) comprised on the substrate, each conductive path (113) providing a direct electric connection between each sensing element (103) and one zone (126) of the substrate adapted for connecting one input of a readout unit (106). Further, a detector tile and a detector comprising such sensor array module is provided, as well as a method of manufacture.

公开(公告)号：EP2847619A2

公开(公告)日：2015-03-18

申请号：EP13735065.8

申请日：2013-05-03

Applicant: Koninklijke Philips N.V.

Inventor： LEVENE, Simha ,  VAN VEEN, Nicolaas, Johannes, Anthonius ,  ALTMAN, Amiaz ,  UMAN, Igor ,  GOSHEN, Rafael

IPC: G01T1/20

CPC classification number: G01T1/2018 ,  A61B6/032 ,  A61B6/482 ,  G01T1/202 ,  G01T1/362

Abstract: An imaging system (100) includes a radiation sensitive detector array (110). The detector array includes at least two scintillator array layers (116). The detector array further includes at least two corresponding photosensor array layers (114). At least one of the at least two photosensor array layers is located between the at least two scintillator array layers in a direction of incoming radiation. The at least one of the at least two photosensor array layers has a thickness that is less than thirty microns.

Abstract translation: 一种成像系统（100）包括一个辐射敏感探测器阵列（110）。 检测器阵列包括至少两个闪烁器阵列层（116）。 该检测器阵列包括至少两个另外的对应的光传感器阵列层（114）。 至少在所述至少两个光传感器阵列层中的一个位于所述至少两个闪烁体阵列层之间的入射辐射的方向。 所述至少两个光传感器阵列层的至少一个具有的厚度做是小于30微米。