公开(公告)号：EP2874315B1

公开(公告)日：2017-10-11

申请号：EP14193629.4

申请日：2014-11-18

申请人： Skyworks Solutions, Inc.

发明人： Roy, Ambarish ,  Zhu, Yu ,  Masse, Christophe

IPC分类号： H03K17/687 ,  H01L23/552 ,  H03K17/10

CPC分类号： H01L24/17 ,  H01L23/5386 ,  H01L23/552 ,  H01L23/66 ,  H01L25/074 ,  H01L29/41758 ,  H01L29/66 ,  H01L2224/1701 ,  H01L2224/171 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/30105 ,  H01Q1/00 ,  H03K17/102 ,  H03K17/6871 ,  H01L2924/00

摘要： Various implementations enable management of parasitic capacitance and voltage handling of stacked integrated electronic devices. Some implementations include a radio frequency switch arrangement having a ground plane, a stack and a first solder bump. The stack is arranged in relation to the ground plane, and includes switching elements coupled in series with one another, and a first end of the stack includes a respective terminal of a first one of the plurality of switching elements. The first solder bump is coupled to the respective terminal of the first one of the plurality of switching elements such that at least a portion of the first solder bump overlaps with one or more of the plurality of switching elements, an overlap dimension set in relation to a first threshold value in order to set a respective contribution to a parasitic capacitance of the radio frequency switch arrangement.

公开(公告)号：EP3140860A1

公开(公告)日：2017-03-15

申请号：EP15719392.1

申请日：2015-04-17

申请人： Qualcomm Incorporated

发明人： GU, Shiqun ,  RADOJCIC, Ratibor ,  KIM, Dong Wook ,  LEE, Jae Sik

IPC分类号： H01L23/498 ,  H01L21/48 ,  H05K3/46 ,  H01L21/56 ,  H01L23/14 ,  H01L25/065 ,  H01L25/10 ,  H01L21/60

CPC分类号： H01L21/568 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/023 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/171 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81895 ,  H01L2224/81896 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/1434 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/18161 ,  H05K3/4688 ,  H01L2924/014

摘要： An integrated device (e.g., integrated package) that includes a base portion for the integrated device, a first die (206) (e.g., first wafer level die), and a second die (208) (e.g., second wafer level die). The base portion includes a first inorganic dielectric layer (203), a first set of interconnects (280) located in the first inorganic dielectric layer, a second dielectric layer (202) different from the first inorganic dielectric layer, and a set of redistribution metal layers (230,240,250,260) in the second dielectric layer. The first die is coupled to a first surface of the base portion. The second die is coupled to the first surface of the base portion, the second die is electrically coupled to the first die through the first set of interconnects (280).

摘要翻译： 一些新颖的特征涉及在集成的装置（例如，集成的封装）那样包括用于集成装置，第一对（例如，第一晶片级模）的基部，和一个第二即（E. G.，第二晶片级模）。 基座部分包括第一无机介电层，第一组位于所述第一无机介电层中的互连，第二介电层从所述第一无机介电层不同，并且所述第二介电层中的一组再分布金属层。 第一个是连接到所述底座部分的第一表面上。 第二，其耦合到所述底座部分的第一表面，第二个是电通过所述第一组互连耦合到所述第一。

公开(公告)号：EP3042395A1

公开(公告)日：2016-07-13

申请号：EP14761338.4

申请日：2014-09-04

申请人： Koninklijke Philips N.V.

发明人： VAN VEEN, Nicolaas, Johannes, Anthonius ,  GOSHEN, Rafael ,  YOGEV, David ,  LIVNE, Amir

IPC分类号： H01L25/04 ,  H01L27/146

CPC分类号： H01L27/14634 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L25/042 ,  H01L25/043 ,  H01L27/14623 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/1469 ,  H01L2224/091 ,  H01L2224/09165 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16148 ,  H01L2224/16505 ,  H01L2224/16506 ,  H01L2224/171 ,  H01L2224/81047 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/12043 ,  H01L2924/00

摘要： The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

公开(公告)号：EP2840872A1

公开(公告)日：2015-02-25

申请号：EP14180520.0

申请日：2014-08-11

申请人： FUJITSU LIMITED

发明人： Okamoto, Keishiro ,  Sakuyama, Seiki

IPC分类号： H05K3/30 ,  H01L23/00 ,  H05K3/34 ,  H05K1/02 ,  H01L23/40

CPC分类号： H05K1/181 ,  B23K1/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/171 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/81007 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/92 ,  H01L2224/9221 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0271 ,  H05K3/303 ,  H05K3/305 ,  H05K3/34 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： An electronic device includes: a first electronic component 10; first members 13 that are provided on a first surface of the first electronic component and that include outside surfaces 13a configured to face diagonally upward with respect to the first surface; a second electronic component 20 provided above the first surface; second members 23 that are provided corresponding to the first members on a second surface of the second electronic component which faces the first surface and that include inside surfaces 23a configured to face diagonally downward with respect to the second surface and configured to face the outside surfaces; and solder 30 that is provided between the first surface and the second surface and that electrically connects the first electronic component and the second electronic component.

摘要翻译： 电子设备包括：第一电子部件10; 第一构件13设置在第一电子部件的第一表面上，并且包括相对于第一表面对角地面对的外表面13a; 设置在第一表面上方的第二电子部件20; 第二构件23，其对应于第二电子部件的面对第一表面的第二表面上的第一构件，并且包括被构造成相对于第二表面对角地向下面并且被配置为面向外表面的内表面23a; 以及设置在第一表面和第二表面之间并且电连接第一电子部件和第二电子部件的焊料30。

公开(公告)号：EP3042395B1

公开(公告)日：2017-03-08

申请号：EP14761338.4

申请日：2014-09-04

申请人： Koninklijke Philips N.V.

发明人： VAN VEEN, Nicolaas, Johannes, Anthonius ,  GOSHEN, Rafael ,  YOGEV, David ,  LIVNE, Amir

IPC分类号： H01L25/04 ,  H01L27/146

CPC分类号： H01L27/14634 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L25/042 ,  H01L25/043 ,  H01L27/14623 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/1469 ,  H01L2224/091 ,  H01L2224/09165 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16148 ,  H01L2224/16505 ,  H01L2224/16506 ,  H01L2224/171 ,  H01L2224/81047 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/12043 ,  H01L2924/00

公开(公告)号：EP2840872B1

公开(公告)日：2016-04-27

申请号：EP14180520.0

申请日：2014-08-11

申请人： FUJITSU LIMITED

发明人： Okamoto, Keishiro ,  Sakuyama, Seiki

IPC分类号： H05K3/30 ,  H01L23/00 ,  H01L23/04 ,  H01L21/50 ,  H05K3/34 ,  H05K1/02 ,  H01L23/367 ,  H01L23/40 ,  H01L23/498

CPC分类号： H05K1/181 ,  B23K1/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/171 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/81007 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/92 ,  H01L2224/9221 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0271 ,  H05K3/303 ,  H05K3/305 ,  H05K3/34 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

公开(公告)号：EP2874315A1

公开(公告)日：2015-05-20

申请号：EP14193629.4

申请日：2014-11-18

申请人： Skyworks Solutions, Inc.

发明人： Roy, Ambarish ,  Zhu, Yu ,  Masse, Christophe

IPC分类号： H03K17/687 ,  H01L23/552 ,  H03K17/10

CPC分类号： H01L24/17 ,  H01L23/5386 ,  H01L23/552 ,  H01L23/66 ,  H01L25/074 ,  H01L29/41758 ,  H01L29/66 ,  H01L2224/1701 ,  H01L2224/171 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/30105 ,  H01Q1/00 ,  H03K17/102 ,  H03K17/6871 ,  H01L2924/00

摘要： Various implementations enable management of parasitic capacitance and voltage handling of stacked integrated electronic devices. Some implementations include a radio frequency switch arrangement having a ground plane, a stack and a first solder bump. The stack is arranged in relation to the ground plane, and includes switching elements coupled in series with one another, and a first end of the stack includes a respective terminal of a first one of the plurality of switching elements. The first solder bump is coupled to the respective terminal of the first one of the plurality of switching elements such that at least a portion of the first solder bump overlaps with one or more of the plurality of switching elements, an overlap dimension set in relation to a first threshold value in order to set a respective contribution to a parasitic capacitance of the radio frequency switch arrangement.

摘要翻译： 各种实现使得能够管理堆叠的集成电子设备的寄生电容和电压处理。 一些实现方式包括具有接地平面，堆叠和第一焊料凸块的射频开关装置。 堆叠相对于接地平面布置，并且包括彼此串联耦合的开关元件，并且堆叠的第一端包括多个开关元件中的第一个的相应端子。 第一焊料凸点耦合到多个开关元件中的第一个的相应端子，使得第一焊料凸块的至少一部分与多个开关元件中的一个或多个重叠，相对于 第一阈值，以便设置对射频开关装置的寄生电容的相应贡献。