CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE
    1.
    发明公开
    CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE 审中-公开
    用微带电路和介质波导芯片与芯片的接口

    公开(公告)号:EP3267528A1

    公开(公告)日:2018-01-10

    申请号:EP15884067.8

    申请日:2015-06-02

    CPC classification number: H01P5/087 H01P1/20309 H01P3/082 H01P3/16 H01P5/1007

    Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

    Abstract translation: 公开了使用微带电路和电介质波导的芯片到芯片接口。 根据本发明的一个实施例的板间连接装置包括:具有金属包层并将信号从发送器侧板传送到接收器侧板的波导管; 以及连接到所述波导并且具有微带到波导转换(MWT)的微带电路,其中所述微带电路匹配微带线和所述波导,调节所述微带线到所述波导中的预定第一频带的带宽 信号,并将其提供给接收器。

    CONNECTOR FOR COUPLING WAVEGUIDE WITH BOARD
    7.
    发明公开

    公开(公告)号:EP3764460A1

    公开(公告)日:2021-01-13

    申请号:EP19781520.2

    申请日:2019-04-05

    Abstract: According to one aspect of the invention, there is provided a connector for connecting a waveguide and a board, comprising: a first opening part formed in a direction perpendicular to one side of a board and coupled to the one side of the board; a second opening part formed in a direction parallel to a longitudinal direction of a waveguide for signal transmission, wherein the waveguide is capable of being coupled to the second opening part; and a signal guide part connecting the first and second opening parts and including a hollowness surrounded by a conductive layer therein.

Patent Agency Ranking