公开(公告)号：EP4360877A2

公开(公告)日：2024-05-01

申请号：EP23218338.4

申请日：2017-01-12

申请人： Kulicke & Soffa Netherlands B.V.

发明人： MARINOV, Val ,  ATANASOV, Yuriy

IPC分类号： B32B37/00

CPC分类号： B32B37/26 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2224/8300520130101 ,  H01L2224/7526120130101 ,  H01L2224/2930120130101 ,  B32B37/025 ,  B32B38/0004 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  B32B2038/189120130101 ,  B32B2307/41220130101 ,  B32B2309/10520130101 ,  B32B2310/083120130101 ,  H01L2224/292920130101 ,  H01L2224/2933920130101 ,  H01L2224/3222520130101 ,  H01L2224/7525220130101 ,  H01L2224/7574520130101 ,  H01L2224/8319220130101 ,  H01L2224/8320320130101 ,  H01L2224/8385120130101 ,  H01L2224/8385520130101 ,  H01L2224/8386220130101 ,  H01L2224/8387420130101 ,  H01L2924/1420130101 ,  H01L2224/29420130101 ,  H01L2221/6832720130101 ,  H01L2221/6836820130101 ,  H01L2221/6838120130101 ,  H01L21/6835 ,  H01L2221/6832220130101 ,  H01L2221/6835420130101

摘要： A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.

公开(公告)号：EP3924999A1

公开(公告)日：2021-12-22

申请号：EP20755894.1

申请日：2020-02-14

申请人： Kulicke & Soffa Netherlands B.V.

发明人： MARINOV, Val ,  ATANASOV, Yuriy

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01L21/78 ,  H01L21/52