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公开(公告)号：EP3746412B1
公开(公告)日：2024-04-17
申请号：EP19707860.3
申请日：2019-01-29
CPC分类号： B32B17/10036 , C03B18/06 , B32B2309/10520130101 , G02B2027/01320130101 , B32B17/10082
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公开(公告)号：EP4360877A2
公开(公告)日：2024-05-01
申请号：EP23218338.4
申请日：2017-01-12
发明人： MARINOV, Val , ATANASOV, Yuriy
IPC分类号： B32B37/00
CPC分类号： B32B37/26 , H01L21/67132 , H01L21/67144 , H01L2224/8300520130101 , H01L2224/7526120130101 , H01L2224/2930120130101 , B32B37/025 , B32B38/0004 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , B32B2038/189120130101 , B32B2307/41220130101 , B32B2309/10520130101 , B32B2310/083120130101 , H01L2224/292920130101 , H01L2224/2933920130101 , H01L2224/3222520130101 , H01L2224/7525220130101 , H01L2224/7574520130101 , H01L2224/8319220130101 , H01L2224/8320320130101 , H01L2224/8385120130101 , H01L2224/8385520130101 , H01L2224/8386220130101 , H01L2224/8387420130101 , H01L2924/1420130101 , H01L2224/29420130101 , H01L2221/6832720130101 , H01L2221/6836820130101 , H01L2221/6838120130101 , H01L21/6835 , H01L2221/6832220130101 , H01L2221/6835420130101
摘要： A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.
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公开(公告)号：EP3381678B1
公开(公告)日：2024-08-14
申请号：EP18164741.3
申请日：2018-03-28
CPC分类号： B32B15/20 , H05K9/0084 , B32B2250/0320130101 , B32B2250/4020130101 , B32B2255/0620130101 , B32B2255/2620130101 , B32B2307/5020130101 , B32B2307/73220130101 , B32B2457/0020130101 , B32B2307/21220130101 , B32B38/12 , B32B15/09 , B32B2307/20220130101 , B32B2307/20420130101 , B32B2309/10520130101 , B32B2367/0020130101 , B32B25/14 , B32B27/40 , B32B15/085 , B32B2255/1020130101 , B32B2307/74820130101 , B32B27/281 , B32B15/088 , B32B2262/10620130101 , B32B2307/5420130101 , B32B2307/20820130101 , B32B27/36 , B32B27/304 , B32B2605/0020130101 , B32B2307/71220130101 , B32B27/283 , B32B15/095 , B32B27/365 , B32B25/04 , B32B2250/4220130101 , B32B2262/10120130101 , B32B2307/30620130101 , B32B27/16 , B32B7/12 , B32B27/308 , B32B25/20 , B32B27/32 , B32B27/34 , B32B27/306 , B32B15/08 , B32B2255/20520130101 , B32B15/06 , B32B27/302 , B32B15/082 , B32B27/38 , B32B25/16 , B32B2307/75220130101 , B32B27/06 , B32B27/42 , B32B2262/026920130101 , B32B15/092 , B32B15/098
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公开(公告)号：EP4219188B1
公开(公告)日：2024-08-28
申请号：EP23169540.4
申请日：2015-07-02
CPC分类号： B32B33/00 , B32B37/1027 , B32B37/153 , B32B37/223 , B32B37/24 , B32B38/06 , B32B38/145 , B32B2307/41220130101 , B32B2307/58420130101 , B32B2317/1620130101 , B32B5/18 , B32B27/065 , B32B27/22 , B32B27/365 , B32B2264/06720130101 , B32B2264/10120130101 , B32B2270/0020130101 , B29K2627/0620130101 , B29K2075/0020130101 , B32B2250/0220130101 , B32B2250/2420130101 , B32B2250/24620130101 , B32B2250/4020130101 , B32B2264/0220130101 , B32B2264/1020130101 , B32B2264/10720130101 , B32B2264/1220130101 , B32B27/08 , B32B27/304 , B32B27/40 , B32B27/20 , B32B27/32 , B32B27/36 , B32B2264/10220130101 , B32B2419/0020130101 , B29C48/15 , B32B37/12 , B32B2307/55420130101 , B32B2307/74420130101 , B32B2309/10520130101 , B32B2419/0420130101 , B32B2471/0020130101
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5.发明授权
公开(公告)号：EP2861808B1
公开(公告)日：2024-05-01
申请号：EP13737418.7
申请日：2013-05-30
CPC分类号： B27N3/06 , B32B27/12 , B29C43/305 , B32B27/304 , E04F15/105 , E04F2201/015320130101 , B32B37/0015 , B32B37/1027 , B32B37/24 , B32B38/145 , B32B2305/0820130101 , B32B2305/2220130101 , B32B2305/3020130101 , B32B2307/41220130101 , B32B2307/41420130101 , B32B2307/724220130101 , B32B2307/73420130101 , B32B2309/10520130101 , B32B2315/08520130101 , B32B2327/0620130101 , B32B2471/0020130101 , B29C70/081 , E04F2201/016120130101 , B29L2031/73220130101 , B29C43/30 , B29C43/48 , B29C2043/48320130101 , Y10T428/24868 , B29K2101/1220130101 , B29K2309/0820130101 , E04F15/02038 , B29C70/506 , E04F15/107
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搜索结果
5 条记录 (耗时 0.007 秒)
