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公开(公告)号:EP3345211A1
公开(公告)日:2018-07-11
申请号:EP16770815.5
申请日:2016-08-30
IPC分类号: H01L21/311 , C07C251/08 , C07C251/26 , C07C255/10
CPC分类号: H01L21/31144 , C07C251/08 , C07C251/26 , C07C255/10 , H01L21/0212 , H01L21/02274 , H01L21/0271 , H01L21/31116 , H01L21/31127 , H01L21/31133 , H01L21/31138 , H01L27/10855 , H01L27/115
摘要: A method for etching silicon-containing films is disclosed. The method includes the steps of introducing a vapor of a nitrogen containing etching compound into a reaction chamber containing a silicon-containing film on a substrate, wherein the nitrogen containing etching compound is an organofluorine compound containing at least one C≡N or C═N functional group; introducing an inert gas into the reaction chamber; and activating a plasma to produce an activated nitrogen containing etching compound capable of etching the silicon-containing film from the substrate.
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公开(公告)号:EP3563406A1
公开(公告)日:2019-11-06
申请号:EP17889218.8
申请日:2017-12-29
发明人: SURLA, Vijay , GUPTA, Rahul , SUN, Hui , PALLEM, Venkateswara R. , STAFFORD, Nathan , MARCHEGIANI, Fabrizio , OMARJEE, Vincent M. , ROYER, James
IPC分类号: H01L21/311 , H01L21/3065 , H01L21/308 , H01L27/115
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