公开(公告)号：EP1613448B1

公开(公告)日：2011-06-29

申请号：EP04759029.4

申请日：2004-03-30

申请人： L-3 Communications Corporation

发明人： JACKSEN, Niels ,  IOSUE, Michael ,  SALDANA, Miguel ,  TUCKER, Jay

IPC分类号： B23K31/00 ,  B23K20/16 ,  C04B37/02 ,  H01J31/50

CPC分类号： B23K20/16 ,  B23K20/023 ,  C04B37/04 ,  C04B2237/124 ,  C04B2237/125 ,  H01J31/507 ,  H01J43/246 ,  H01J2231/5016

摘要： Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).

公开(公告)号：EP1617966B1

公开(公告)日：2011-06-29

申请号：EP04749506.4

申请日：2004-03-30

申请人： L-3 Communications Corporation

发明人： SALDANA, Miguel ,  TUCKER, Jay ,  IOSUE, Michael

IPC分类号： B23K31/00 ,  H04N5/74 ,  H04N5/225 ,  B23K20/02 ,  C04B37/00 ,  C04B37/02 ,  H01J31/50 ,  H01J43/24 ,  B23K20/16

CPC分类号： B23K20/023 ,  B23K20/16 ,  C04B37/006 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/368 ,  H01J31/507 ,  H01J43/246 ,  H01J2231/5016

摘要： A microchannel plate (MCP) (50) and a dielectric insulator (80) are deposited with a thin film (54, 84) using a suitable metal selected for optimum diffusion. The metallized MCP (50) and dielectric insulator (80) are then aligned and placed in a bonding fixture (36) that provides the necessary force applied to the components to initiate a diffusion bond. The bonding fixture (36) is then placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP (50) and the dielectric insulator (80).