MATERIALBEARBEITUNGSSYSTEM, MATERIALBEARBEITUNGSVERFAHREN UND GASZUFUEHRUNG HIERFUER
    1.
    发明公开
    MATERIALBEARBEITUNGSSYSTEM, MATERIALBEARBEITUNGSVERFAHREN UND GASZUFUEHRUNG HIERFUER 审中-公开
    材料科学与工程学院,材料学院,高分子材料学院

    公开(公告)号:EP1479091A2

    公开(公告)日:2004-11-24

    申请号:EP03742580.8

    申请日:2003-02-25

    IPC分类号: H01J37/305 H01J37/301

    摘要: The invention relates to a material treating system for treating a work piece (3). The material treatment is carried out by supplying a reaction gas and energetic radiation to induce the reaction gas in a surrounding of a section of the work piece to be treated. The radiation is preferably provided by an electron microscope (15). An objective lens (27) of the electron microscope is disposed preferably between a detector (41) thereof and the work piece. A gas supply system (53) of the material treating system is provided with a valve disposed at a distance from the treating section, and a gas volume between the valve and a location of emergence (59) of the reaction gas is small. The gas supply system is further provided with a temperature-adjusted, especially cooled reservoir for receiving a starting material for the reaction gas.

    摘要翻译: 前体气体供应由管(65)组成,每个管(65)包含在其出口端具有较小内径的可移动阀和端套管(57)。 通过套管界定的气体空间体积,出口端(59)处的套管内径和关闭位置的阀对应于关系V c * A * l。 A是插管内径在其出口端的表面,l是套管出口端和阀门在关闭位置之间的距离,c恒定小于5 pref。 小于1.5。 包括用于使用气体供应装置的材料处理系统和处理工件的程序的独立权利要求。