Light emitting device
    4.
    发明公开
    Light emitting device 有权
    发光装置

    公开(公告)号:EP2544248A1

    公开(公告)日:2013-01-09

    申请号:EP12156087.4

    申请日:2012-02-17

    IPC分类号: H01L33/02 H01L33/22

    摘要: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a first conductive type first semiconductor layer, an active layer, a second conductive type second semiconductor layer, a reliability enhancement layer, and a second conductive type third semiconductor layer. The active layer is disposed on the first conductive type first semiconductor layer. The second conductive type second semiconductor layer is disposed on the active layer. The reliability enhancement layer is disposed on the second conductive type second semiconductor layer. The second conductive type third semiconductor layer is disposed on the reliability enhancement layer and comprises a light extraction pattern. The reliability enhancement layer and the active layer are spaced apart from each other by a distance of 0.3 µm to 5 µm.

    摘要翻译: 提供了发光器件,发光器件封装和照明系统。 该发光器件包括第一导电型第一半导体层,有源层,第二导电型第二半导体层,可靠性增强层和第二导电型第三半导体层。 有源层设置在第一导电型第一半导体层上。 第二导电型第二半导体层设置在有源层上。 可靠性增强层设置在第二导电型第二半导体层上。 第二导电型第三半导体层设置在可靠性增强层上并且包括光提取图案。 可靠性增强层和有源层彼此间隔0.3μm至5μm的距离。