公开(公告)号：EP0849795A3

公开(公告)日：1998-12-02

申请号：EP97119324.8

申请日：1997-11-05

Applicant: LSI LOGIC CORPORATION

Inventor： Eslamy, Mohammad ,  Raab, Kurt R. ,  McCormick, John

IPC: H01L23/498 ,  H01L23/538

CPC classification number: H01L23/4985 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/14 ,  H05K3/0061 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2201/10681 ,  H05K2203/0278 ,  H01L2924/00

Abstract: A method and apparatus for connecting a Tape Automated Bonding (TAB) film to a baseplate. The baseplate may be a heat spreader having a cavity for receiving a semiconductor chip disposed within the TAB film. A pressure-sensitive adhesive coupon may be positioned between the TAB film and the baseplate, thereby connecting the TAB film to the baseplate. An adhesion promoter containing an organofunctional group and a silicon-functional group may be disposed between the adhesive coupon and each of its mating surfaces (i.e., the TAB film and the baseplate) to increase adhesion between the adhesive coupon and the mating surfaces. The adhesion promoter preferably forms covalent bonds with the adhesive coupon and with each of the mating surfaces.

公开(公告)号：EP0849795A2

公开(公告)日：1998-06-24

申请号：EP97119324.8

申请日：1997-11-05

Applicant: LSI LOGIC CORPORATION

Inventor： Eslamy, Mohammad ,  Raab, Kurt R. ,  McCormick, John

IPC: H01L23/498 ,  H01L23/538

CPC classification number: H01L23/4985 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/14 ,  H05K3/0061 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2201/10681 ,  H05K2203/0278 ,  H01L2924/00

Abstract: A method and apparatus for connecting a Tape Automated Bonding (TAB) film to a baseplate. The baseplate may be a heat spreader having a cavity for receiving a semiconductor chip disposed within the TAB film. A pressure-sensitive adhesive coupon may be positioned between the TAB film and the baseplate, thereby connecting the TAB film to the baseplate. An adhesion promoter containing an organofunctional group and a silicon-functional group may be disposed between the adhesive coupon and each of its mating surfaces (i.e., the TAB film and the baseplate) to increase adhesion between the adhesive coupon and the mating surfaces. The adhesion promoter preferably forms covalent bonds with the adhesive coupon and with each of the mating surfaces.

Abstract translation: 用于将带式自动接合（TAB）膜连接到基板的方法和装置。 基板可以是散热器，其具有用于接收设置在TAB膜内的半导体芯片的空腔。 压敏粘合剂试片可以定位在TAB膜和基板之间，从而将TAB膜连接到基板。 含有有机官能团和硅官能团的粘合促进剂可以设置在粘合剂试片和其每个配合表面（即TAB薄膜和底片）之间，以增加粘合剂试片和配合表面之间的粘合性。 粘合促进剂优选与粘合剂试片和每个配合表面形成共价键。