公开(公告)号：EP2998968A1

公开(公告)日：2016-03-23

申请号：EP14798409.0

申请日：2014-01-31

Applicant: Ishihara Chemical Co., Ltd.

Inventor： KAWATO, Yuichi ,  ARIMURA, Hidetoshi ,  KUDO, Tomio

IPC: H01B1/22 ,  B22F7/04 ,  B22F9/00 ,  C09D5/24 ,  C09D7/12 ,  H01B1/02 ,  H01B5/14 ,  H01B13/00 ,  H05K1/09 ,  H05K3/10

CPC classification number: H05K1/092 ,  B22F3/008 ,  B22F7/04 ,  C09D5/24 ,  C09D7/40 ,  H01B1/22 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/1291 ,  H05K3/386 ,  H05K2201/0239 ,  H05K2203/072 ,  H05K2203/1131

Abstract: [Technical Problem]
To provide copper particulate dispersion capable of forming a conductive film having favorable adhesiveness on an inorganic substrate by photo-sintering.
[Solution to Problem]
The copper particulate dispersion 1 includes a dispersion vehicle and copper particulates 11. The copper particulates 11 are dispersed into the dispersion vehicle. The copper particulate dispersion 1 includes an adhesion improvement agent for improving adhesiveness between a conductive film 4 formed on a substrate by photo-sintering the copper particulate 11 and the substrate. The substrate is an inorganic substrate 3. The adhesion improvement agent is a compound containing a phosphorus atom. Thus, the adhesion improvement agent improves adhesiveness between the conductive film 4 and the inorganic substrate 3.

Abstract translation: [技术问题]为了提供铜能够形成通过光烧结上对无机基材的薄膜导电密合性优异的微粒分散体。 [解决问题的手段]该铜微粒分散液1包括分散媒介和铜微粒11铜微粒11分散到分散媒介。 的铜微粒分散体1包括上粘附改善剂底物通过光烧结铜微粒11和形成在基片的导电膜4之间的粘合性提高。 基板是无机的基材3的粘合改进剂是含有磷原子的化合物。 因此，粘附性改善剂改善导电膜4和无机基体之间的粘合性。3

公开(公告)号：EP2521638B1

公开(公告)日：2016-03-16

申请号：EP10809156.2

申请日：2010-12-22

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： BENWADIH, Mohamed ,  HEITZMANN, Marie

IPC: B26F1/26 ,  H01L21/768

CPC classification number: H05K3/0044 ,  H05K2201/0239 ,  H05K2203/0522 ,  H05K2203/0746

公开(公告)号：EP2460765A4

公开(公告)日：2013-04-17

申请号：EP10804247

申请日：2010-07-09

Applicant: MITSUBISHI GAS CHEMICAL CO

Inventor： MATSUMOTO TAKAHIRO ,  TSURUYA HIROTAKA ,  BAN HAJIME ,  AKITA REIKI

IPC: C01B31/02 ,  C01B31/04 ,  C04B35/628 ,  C08K9/04 ,  C08L101/00 ,  C09C1/00 ,  H01B3/00 ,  H01B17/00 ,  H05K1/03

CPC classification number: C09C1/56 ,  B82Y30/00 ,  C01B32/05 ,  C01P2004/03 ,  C01P2004/16 ,  C01P2004/32 ,  C01P2004/64 ,  C01P2006/40 ,  C08K7/04 ,  C08K9/04 ,  H01B3/004 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.

公开(公告)号：EP1681321B1

公开(公告)日：2011-08-10

申请号：EP04792849.4

申请日：2004-10-22

Applicant: Nippon Mining & Metals Co., Ltd.

Inventor： KAWAMURA, Toshifumi, c/o Isohara Plant ,  IMORI, Toru, c/o Isohara Plant

IPC: C09D11/00 ,  H05K1/09 ,  H05K3/10 ,  H05K3/18

CPC classification number: C09D11/38 ,  H05K1/097 ,  H05K3/125 ,  H05K3/182 ,  H05K2201/0239 ,  H05K2203/013 ,  H05K2203/124

Abstract: An inkjet ink composition for forming on a substrate a wiring pattern that is uniform and has excellent adherence; and a method of forming a wiring pattern with the use of the ink composition. There is provided an inkjet ink composition for drawing a wiring pattern on a substrate, characterized by containing an azole type silane coupling agent as the activator coupling agent.

公开(公告)号：EP1835512B1

公开(公告)日：2010-05-12

申请号：EP05790645.5

申请日：2005-10-07

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： KAMIKORIYAMA, Yoichi c/o MITSUI MINING & SMELTING ,  OGATA, Sumikazu c/o MITSUI MINING & SMELTING CO., ,  ANAI, Kei c/o MITSUI MINING & SMELTING CO., LTD. ,  SAWAMOTO, Hiroki c/o MITSUI MINING & SMELTING CO.,

IPC: H01B1/22 ,  H01B1/00 ,  H05K1/09 ,  C09D11/00

CPC classification number: H01B1/22 ,  C09D11/30 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0239 ,  H05K2203/013

Abstract: Disclosed is a conductive metal ink which has excellent adhesion to various bases such as glass substrates and enables formation of fine wiring or electrodes. Also disclosed is a conductive ink which can be used in inkjet systems. Specifically disclosed is a conductive ink containing a solvent, a metal powder and an adhesion improver which is characterized in that the adhesion improver is composed of one or more substances selected from the group consisting of silane coupling agents, titanium coupling agents, zirconia coupling agents and aluminum coupling agents. By adjusting the surface tension of the solvent to be within the range from 15 mN/m to 50 mN/m using a surface tension regulator, the conductive ink is formed into an ink which can be suitably used in inkjet systems or the like.

公开(公告)号：EP1667503A1

公开(公告)日：2006-06-07

申请号：EP05703506.5

申请日：2005-01-13

Applicant: Matsusita Electric Industrial Co., Ltd.

Inventor： NAKAGAWA, Tohru

IPC: H05K3/06 ,  B32B9/00 ,  B32B15/04

CPC classification number: C25D5/022 ,  C23F1/02 ,  C23F1/14 ,  C23F1/18 ,  C23F1/30 ,  C23F1/40 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/32139 ,  H01L51/0019 ,  H01L51/0022 ,  H05K3/061 ,  H05K2201/015 ,  H05K2201/0239 ,  H05K2203/013 ,  H05K2203/0582 ,  H05K2203/0585 ,  H05K2203/122

Abstract: A metal pattern of the present invention is a metal pattern (13') formed on a surface of a substrate by etching, and a monomolecular film containing fluorinated alkyl chains (CF 3 (CF 2 ) n -, where n represents a natural number) is formed on a surface of a metal film composing the metal pattern (13'), and a masking film (18) is formed by penetration of a molecule having a mercapto group (-SH) or a disulfide (-SS-) group into interstices between molecules composing the monomolecular film. The metal pattern is produced by: forming a monomolecular film containing fluorinated alkyl chains (CF 3 (CF 2 ) n -, where n represents a natural number) on a surface of a metal film; forming a masking film by applying a solution in which a molecule having a mercapto group (-SH) or a disulfide (-SS-) group is dissolved over a surface of the monomolecular film so that the molecule having a mercapto group (-SH) or a disulfide (-SS-) group penetrates in interstices between molecules composing the monomolecular film; and etching the metal film by exposing the surface of the metal film to an etching solution so that a portion of the metal film in a region not covered with the masking film is removed.

Abstract translation: 本发明的金属图案是通过蚀刻形成在基板的表面上的金属图案（13'）和含有氟化烷基链（CF 3（CF 2）n - ）的单分子膜，其中n表示自然数） 形成在构成金属图案（13'）的金属膜的表面上，并且通过将具有巯基（-SH）或二硫化物（-SS-）基团的分子穿透而形成掩蔽膜（18） 构成单分子膜的分子之间的间隙。 通过在金属膜的表面上形成含有氟化烷基链（CF 3（CF 2）n - ，其中n表示自然数）的单分子膜; 通过将分子中具有巯基（-SH）或二硫键（-SS-））的分子溶解在单分子膜的表面上形成掩蔽膜，使得具有巯基（-SH） 或二硫化物（-SS-）基团渗透在构成单分子膜的分子之间的间隙中; 并且通过将金属膜的表面暴露于蚀刻溶液来蚀刻金属膜，从而去除未被掩模膜覆盖的区域中的金属膜的一部分。

公开(公告)号：EP1626065A1

公开(公告)日：2006-02-15

申请号：EP05291679.8

申请日：2005-08-05

Applicant: NIPPON SHOKUBAI CO., LTD.

Inventor： Sugioka, Takuo ,  Tsujino, Yasunori

IPC: C08K5/13 ,  C08L71/10 ,  C08K3/36 ,  C08L61/00 ,  C08G59/62 ,  C08G65/38 ,  H01L23/31 ,  H05K1/03 ,  H01L23/29

CPC classification number: H05K1/0373 ,  C08K3/016 ,  C08L61/28 ,  C08L63/00 ,  C08L83/04 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  Y10T428/31511 ,  C08L2666/14 ,  C08L2666/28 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent appearance inwhich transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition. The present invention relates to a resin composition comprising a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a resin composition comprising three components of a phenolic compound, a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a flame retardant resin composition comprising a polyhydric phenol and an inorganic microfine particle, and a dispersing element containing an inorganic microfine particle obtained by a hydrolysis condensation reaction of alkoxide and/or metal carboxylate in a dispersion medium.

Abstract translation: 本发明的目的是提供一种树脂组合物，其可以形成具有绝缘性，耐热冲击性，成型性/成形性和强度等各种优异性能的固化剂，并且表现出优异的外观，透明性提高，树脂 其固化的薄膜具有优异的阻燃性，良好的机械性能和耐热性的组合物，含有可赋予无机微粒子的树脂阻燃性的无机微粒子的分散元件，并且可以降低吸湿性 尽可能地使用其制造方法和使用该树脂组合物得到的固化剂。 本发明涉及包含具有缩水甘油基和/或环氧基中的至少一种的化合物和无机微粒的树脂组合物，包含酚类化合物的三种组分的树脂组合物，具有至少一种 缩水甘油基和/或环氧基和无机微粒，包含多元酚和无机微粒的阻燃树脂组合物和含有通过醇盐和/或金属的水解缩合反应得到的无机微粒的分散体 羧酸酯在分散介质中。

公开(公告)号：EP1387367A1

公开(公告)日：2004-02-04

申请号：EP02710342.3

申请日：2002-01-24

Applicant: JSR Corporation

Inventor： ITO, Nobuyuki, c/o JSR CORPORATION ,  MASUKO, Hideaki, c/o JSR CORPORATION ,  HASEGAWA, Satomi, c/o JSR CORPORATION ,  YOSHIMURA, Nakaatsu, c/o JSR CORPORATION

IPC: H01B3/00 ,  H01B3/12 ,  C08K3/22 ,  C08K9/00 ,  H05K1/03 ,  H01G4/20

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of:

composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and
(B) a resin component constituted of at least one of a polymerizable compound and a polymer.

In addition, another dielectric-forming composition according to the invention is characterized by containing:

ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 µm or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and
inorganic particles with the average particle size of 0.1 to 2 µm and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

公开(公告)号：EP0695116B1

公开(公告)日：2004-01-28

申请号：EP95110620.2

申请日：1995-07-07

Applicant: WORLD PROPERTIES, INC.

Inventor： Horn II, Allen F. ,  Daigle, Robert C. ,  Kuszaj, Michael S.

IPC: H05K1/03 ,  C08K3/00

CPC classification number: H05K1/0373 ,  C08K3/013 ,  H05K1/034 ,  H05K1/162 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/068 ,  Y10T428/3154 ,  C08L27/12

Abstract: A dimensionally stable high K' microwave laminate comprises independent control of the K' and CTE (coefficient of thermal expansion) of the fluoropolymer microwave laminates. The laminate comprises a composite having at least two types of ceramic filler. At least one type of ceramic filler exhibits a K' of greater than 30. The two or more fillers are necessary to be able to independently control the K' and the CTE of the composite, thereby achieving a dimensional stability of absolute magnitude less than 0.1% change. The present invention allows the manufacture of microwave laminate with any specified K' (within the achievable range) and the XY CTE of the material nearly matched to that of copper, resulting in good dimensioned stability during circuit fabrication.

公开(公告)号：EP1377696A1

公开(公告)日：2004-01-07

申请号：EP02714381.7

申请日：2002-03-21

Applicant: Koninklijke Philips Electronics N.V.

Inventor： MEULENKAMP, Eric, A. ,  SCHROEVERS, Maria, J.

IPC: C25D5/10 ,  C25D7/04 ,  H05K3/18

CPC classification number: H01L21/76868 ,  C25D3/38 ,  C25D5/34 ,  C25D7/123 ,  H01L21/288 ,  H01L21/76873 ,  H01L21/76877 ,  H05K3/388 ,  H05K3/389 ,  H05K3/423 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09563

Abstract: The invention provides for a back-end metallisation process in which a recess is filled with copper and which includes the step of forming a plating base on the surfaces of the recess for the subsequent galvanic deposition of the said copper, and wherein subsequent to the formation of the plating base, but prior to the galvanic deposition of the copper, a modifying agent is introduced to the recess and which serves to absorb in the surface regions not covered by the plating base and to thereby modify the surface to promote copper growth thereon so as to effectively repair the initial plating base before the copper plating fill commences.

Abstract translation: 本发明提供了一种后端金属化工艺，其中凹槽填充有铜，并且该工艺包括在凹槽的表面上形成用于随后的所述铜的电沉积的电镀基底的步骤，并且其中在形成 ，但是在电沉积铜之前，将改性剂引入到凹槽中，并且该改性剂用于在未被电镀基底覆盖的表面区域中吸收并且由此修饰表面以促进其上的铜生长 以在铜镀层填充开始之前有效修复初始镀层基体。