公开(公告)号：EP1966832B1

公开(公告)日：2019-02-20

申请号：EP06832140.5

申请日：2006-12-07

申请人： Lumileds Holding B.V.

发明人： PUGH, Mark ,  HARBERS, Gerard ,  WEST, Robert, S.

IPC分类号： H01L33/46 ,  H01L33/60 ,  F21V8/00 ,  G02B6/42 ,  H01L33/50

公开(公告)号：EP2057491B1

公开(公告)日：2019-05-01

申请号：EP07826128.6

申请日：2007-08-24

申请人： Lumileds Holding B.V.

发明人： HARBERS, Gerard ,  PUGH, Mark ,  BIERHUIZEN, Serge

IPC分类号： F21V8/00 ,  G02B6/00

公开(公告)号：EP2165373B1

公开(公告)日：2018-09-05

申请号：EP08763334.3

申请日：2008-06-13

申请人： Lumileds Holding B.V.

发明人： SHCHEKIN, Oleg B. ,  EPLER, John ,  ENG, Gregory ,  BIERHUIZEN, Serge ,  HARBERS, Gerard

IPC分类号： H01L33/46 ,  G02B6/00 ,  F21V8/00

CPC分类号： G02B6/0073 ,  H01L33/405 ,  H01L33/46 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Very thin flash modules for cameras are described that do not appear as a point source of light to the illuminated subject. Therefore, the flash is less objectionable to the subject. In one embodiment, the light emitting surface area is about 5 mm×10 mm. Low profile, side-emitting LEDs optically coupled to solid light guides enable the flash module to be thinner than 2 mm. The flash module may also be continuously energized for video recording. The module is particularly useful for cell phone cameras and other thin cameras.

公开(公告)号：EP2033233B1

公开(公告)日：2018-10-24

申请号：EP07766687.3

申请日：2007-06-07

申请人： Lumileds Holding B.V.

发明人： SHCHEKIN, Oleg, B. ,  PUGH, Mark ,  HARBERS, Gerard ,  KRAMES, Michael, R. ,  EPLER, John, E.

IPC分类号： H01L33/46 ,  G02F1/13357 ,  G02B6/00 ,  H01L33/50 ,  H01L33/60

CPC分类号： H01L33/50 ,  H01L33/22 ,  H01L33/38 ,  H01L33/46 ,  H01L33/60 ,  H01L2224/13

摘要： Low profile, side-emitting LEDs are described, where all light is efficiently emitted within a relatively narrow angle generally parallel to the surface of the light-generating active layer. The LEDs enable the creation of very thin backlights for backlighting an LCD. In one embodiment, the LED is a flip chip with the n and p electrodes on the same side of the LED, and the LED is mounted electrode-side down on a submount. A reflector is provided on the top surface of the LED so that light impinging on the reflector is reflected back toward the active layer and eventually exits through a side surface of the LED. A waveguide layer and/or one or more phosphors layers are deposed between the semiconductor layers and the reflector for increasing the side emission area for increased efficiency. Side-emitting LEDs with a thickness of between 0.2-0.4 mm can be created.