公开(公告)号：EP2165373B1

公开(公告)日：2018-09-05

申请号：EP08763334.3

申请日：2008-06-13

申请人： Lumileds Holding B.V.

发明人： SHCHEKIN, Oleg B. ,  EPLER, John ,  ENG, Gregory ,  BIERHUIZEN, Serge ,  HARBERS, Gerard

IPC分类号： H01L33/46 ,  G02B6/00 ,  F21V8/00

CPC分类号： G02B6/0073 ,  H01L33/405 ,  H01L33/46 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Very thin flash modules for cameras are described that do not appear as a point source of light to the illuminated subject. Therefore, the flash is less objectionable to the subject. In one embodiment, the light emitting surface area is about 5 mm×10 mm. Low profile, side-emitting LEDs optically coupled to solid light guides enable the flash module to be thinner than 2 mm. The flash module may also be continuously energized for video recording. The module is particularly useful for cell phone cameras and other thin cameras.

公开(公告)号：EP3325208A1

公开(公告)日：2018-05-30

申请号：EP16747855.1

申请日：2016-07-19

申请人： Northeastern University ,  University Of North Florida

发明人： STAGON, Stephen, Peter ,  HUANG, Hanchen ,  ELLIOTT, Paul, Robert

IPC分类号： B23K35/26 ,  B23K35/02 ,  H01L23/00

CPC分类号： B23K35/264 ,  B23K35/02 ,  B23K35/0227 ,  B23K35/0261 ,  B23K35/26 ,  B23K2101/40 ,  B23K2101/42 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05583 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/27418 ,  H01L2224/27444 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/2782 ,  H01L2224/29005 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29205 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/3201 ,  H01L2224/32012 ,  H01L2224/32501 ,  H01L2224/32506 ,  H01L2224/83099 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2924/01014 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2924/0102

摘要： Bonded surfaces are formed by adhering first nanorods and second nanorods to respective first and second surfaces. The first shell is formed on the first nanorods and the second shell is formed on the second nanorods, wherein at least one of the first nanorods and second nanorods, and the first shell and the second shell are formed of distinct metals. The surfaces are then exposed to at least one condition that causes the distinct metals to form an alloy, such as eutectic alloy having a melting point below the temperature at which the alloy is formed, thereby bonding the surfaces upon which solidification of the alloy.

公开(公告)号：EP3154729A4

公开(公告)日：2018-02-28

申请号：EP15806611

申请日：2015-06-12

申请人： ALPHA METALS

发明人： GHOSHAL SHAMIK ,  KUMAR V SATHISH ,  VISHWANATH PAVAN ,  PANDHER RANJIT S ,  CHANDRAN REMYA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  BHATKAL RAVINDRA MOHAN

IPC分类号： B22F1/02 ,  B22F3/10 ,  B22F5/00 ,  B22F7/02 ,  B22F7/04 ,  B23K35/02 ,  B23K35/30 ,  C22C1/04 ,  H01L23/00 ,  H05K1/09

CPC分类号： B22F1/0044 ,  B22F1/02 ,  B22F3/1017 ,  B22F3/22 ,  B22F5/006 ,  B22F7/04 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2999/00 ,  B23K1/0016 ,  B23K3/0607 ,  B23K35/0244 ,  B23K35/3006 ,  B23K2201/40 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2221/68368 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/11003 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/11438 ,  H01L2224/1144 ,  H01L2224/11505 ,  H01L2224/11848 ,  H01L2224/13139 ,  H01L2224/13294 ,  H01L2224/13295 ,  H01L2224/13311 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13363 ,  H01L2224/1338 ,  H01L2224/13384 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13393 ,  H01L2224/13411 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13455 ,  H01L2224/13464 ,  H01L2224/13469 ,  H01L2224/1349 ,  H01L2224/16227 ,  H01L2224/27002 ,  H01L2224/27003 ,  H01L2224/27009 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27332 ,  H01L2224/27334 ,  H01L2224/27438 ,  H01L2224/2744 ,  H01L2224/27505 ,  H01L2224/2782 ,  H01L2224/27821 ,  H01L2224/27848 ,  H01L2224/29139 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29363 ,  H01L2224/29364 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/2949 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/75251 ,  H01L2224/75316 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83002 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0463 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/2064 ,  H05K3/32 ,  H05K2203/1131 ,  B22F1/0018 ,  B22F1/025 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01005 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

公开(公告)号：EP3281218A1

公开(公告)日：2018-02-14

申请号：EP16726297.1

申请日：2016-05-23

申请人： Siemens Aktiengesellschaft

发明人： STEGMEIER, Stefan ,  BAUEREGGER, Hubert ,  SOMMER, Volkmar

IPC分类号： H01L21/60 ,  H01L23/492 ,  H01L23/495 ,  H01L23/367

CPC分类号： H01L23/49 ,  C25D3/38 ,  C25D5/18 ,  C25D21/14 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/4922 ,  H01L23/49513 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49811 ,  H01L23/50 ,  H01L24/05 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/75 ,  H01L24/77 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/24245 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/3207 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37005 ,  H01L2224/37111 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/37166 ,  H01L2224/3719 ,  H01L2224/37211 ,  H01L2224/37224 ,  H01L2224/37239 ,  H01L2224/37244 ,  H01L2224/37247 ,  H01L2224/37255 ,  H01L2224/37266 ,  H01L2224/3729 ,  H01L2224/373 ,  H01L2224/37395 ,  H01L2224/376 ,  H01L2224/4007 ,  H01L2224/40227 ,  H01L2224/40499 ,  H01L2224/756 ,  H01L2224/75703 ,  H01L2224/776 ,  H01L2224/77703 ,  H01L2224/821 ,  H01L2224/82101 ,  H01L2224/83007 ,  H01L2224/831 ,  H01L2224/834 ,  H01L2224/83411 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/8349 ,  H01L2224/83511 ,  H01L2224/83524 ,  H01L2224/83539 ,  H01L2224/83544 ,  H01L2224/83547 ,  H01L2224/83555 ,  H01L2224/83566 ,  H01L2224/8359 ,  H01L2224/836 ,  H01L2224/83695 ,  H01L2224/8385 ,  H01L2224/83907 ,  H01L2224/84007 ,  H01L2224/841 ,  H01L2224/8485 ,  H01L2224/8492 ,  H01L2224/84951 ,  H01L2224/9201 ,  H01L2224/9205 ,  H01L2224/9221 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/424 ,  H01L2924/00012 ,  H05K3/4661 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/82 ,  H01L2924/01014

摘要： The invention relates to a method for electrically contacting a component (10) (for example a power component and/or a (semiconductor) component having at least one transistor, preferably an IGBT (insulated-gate bipolar transistor)) having at least one contact (40, 50), at least one open-pored contact piece (60, 70) is galvanically (electrochemically or free of external current) connected to at least one contact (40, 50). In this way, a component module is achieved. The contact (40, 50) is preferably a flat part or has a contact surface, the largest planar extent thereof being greater than an extension of the contact (40, 50) perpendicular to said contact surface. The temperature of the galvanic connection is at most 100 °C, preferably at most 60 °C, advantageously at most 20 °C and ideally at most 5 °C and/or deviates from the operating temperature of the component by at most 50 °C, preferably by at most 20 °C, in particular by at most 10 °C and ideally by at most 5 °C, preferably by at most 2 °C. The component (10) can be contacted by means of the contact piece (60, 70) with a further component, a current conductor and/or a substrate (90). Preferably, a component (10) having two contacts (40, 50) on opposite sides of the component (10) is used, wherein at least one open-pored contact piece (60, 70) is galvanically connected to each contact (40, 50).

公开(公告)号：EP3255685A1

公开(公告)日：2017-12-13

申请号：EP17175137.3

申请日：2017-06-09

申请人： LG Electronics Inc.

发明人： HONG, Daewoon ,  CHOI, Jeongsik ,  PARK, Sangtae ,  YOON, Dongjin

IPC分类号： H01L33/44 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/56

CPC分类号： H01L33/42 ,  H01L24/05 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/05639

摘要： A display device is provided. A transparent light emitting diode film includes: a base; an electrode layer located on the base and in which at least one pattern is formed; a pad formed in at least one portion on the electrode layer; a light emitting diode located on the pad; and an adhesive layer formed in at least another portion on the electrode layer, wherein in the adhesive layer, an opening portion is formed in a portion corresponding to the light emitting diode. Therefore, when forming the transparent light emitting diode film by including a material having strong heat resistance, a state change by a temperature may not occur.

摘要翻译： 提供了一种显示装置。 一种透明发光二极管薄膜包括：基座; 位于基底上并且其中形成至少一个图案的电极层; 形成在电极层上的至少一部分中的焊盘; 位于所述垫上的发光二极管; 以及形成在所述电极层上的至少另一部分中的粘合剂层，其中在所述粘合剂层中，在对应于所述发光二极管的部分中形成开口部分。 因此，当通过包含具有高耐热性的材料来形成透明发光二极管膜时，可能不会发生由温度引起的状态变化。

公开(公告)号：EP2754181B1

公开(公告)日：2017-07-12

申请号：EP12769789.4

申请日：2012-09-07

申请人： Cree, Inc.

发明人： HENNING, Jason, Patrick ,  ZHANG, Qingchun ,  RYU, Sei-Hyung ,  AGARWAL, Anant, Kumar ,  PALMOUR, John, Williams ,  ALLEN, Scott

IPC分类号： H01L29/872 ,  H01L29/06 ,  H01L29/861

CPC分类号： H01L29/872 ,  H01L29/0619 ,  H01L29/0661 ,  H01L29/1608 ,  H01L29/8611 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor device (10) comprises a drift layer (22) having a first surface with an active region (14) and a plurality of junction barrier element recesses (40), the drift layer being doped with a doping material of a first conductivity type and associated with an edge termination region (16) that is substantially laterally adjacent the active region. A Schottky layer (24) is over the active region of the first surface to form a Schottky junction. A plurality of first doped regions (30) extend into the drift layer about corresponding ones of the plurality of junction barrier element recesses (40) wherein the plurality of first doped regions are doped with a doping material of a second conductivity type, which is opposite the first conductivity type, and form an array of junction barrier elements in the drift layer below the Schottky junction. A well (34) ia formed in the drift layer in the edge termination region, the well having guard rings (36) and being doped with the doping material of the second conductivity type where the plurality of guard rings are formed in the well, wherein the guard rings are coplanar with the junction barrier element recesses.

摘要翻译： 本公开总体上涉及一种肖特基二极管，其具有衬底，设置在衬底上的漂移层以及设置在漂移层的有源区上的肖特基层。 选择用于肖特基层的金属和用于漂移层的半导体材料以在漂移层和肖特基层之间提供低势垒高度肖特基结。

公开(公告)号：EP3121843A3

公开(公告)日：2017-04-05

申请号：EP16179960.6

申请日：2016-07-18

申请人： Semiconductor Components Industries, LLC

发明人： Seddon, Michael J. ,  Carney, Francis J.

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/98 ,  H01L25/065

CPC分类号： H01L24/17 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/16503 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81211 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81447 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/81825 ,  H01L2224/97 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2224/81

摘要： A method of flip-chip bonding a plurality of die (10) having at least one metal layer (12) on a die surface to a board (16) comprises placing a first die (10) onto a board (16, 40) comprising one of a ceramic or substrate board or metal lead frame having a solderable surface and placing the first die (10) and the board (16, 40) into a reflow oven. The method includes reflowing at a first reflow temperature for a first period until the first metal board layer (18) and at least one of metal die layers (12) of the first die form an alloy (26) to adhere the first die (10) to the board (16, 40). The newly formed alloy (26) has a higher melting temperature than the first reflow temperature. Accordingly, additional die may be reflowed and flip-chip attached to the board (16, 40) without causing the bonding of the first die (10) to the board (16) to fail if the same reflow temperature is used and without any metals or alloys connecting (bridging) bond pads of a die (10) or of adjacent die (10).

摘要翻译： 一种将在管芯表面上具有至少一个金属层（12）的多个管芯（10）倒装结合到板（16）的方法，包括：将第一管芯（10）放置到板（16,40）上， 具有可焊表面的陶瓷或基板或金属引线框之一，并将第一管芯（10）和基板（16,40）放入回流炉中。 该方法包括在第一回流温度下回流第一时间段，直到第一管芯的第一金属板层（18）和至少一个金属管芯层（12）形成合金（26）以粘合第一管芯（10 ）到板（16,40）。 新形成的合金（26）具有比第一回流温度更高的熔化温度。 因此，如果使用相同的回流温度并且没有任何金属，则额外的管芯可以回流且倒装连接到板（16,40），而不会导致第一管芯（10）与板（16）的接合失败 或合金连接（桥接）管芯（10）或相邻管芯（10）的接合焊盘。

公开(公告)号：EP3054480A3

公开(公告)日：2016-10-26

申请号：EP15200325.7

申请日：2015-12-16

申请人： ROBERT BOSCH GMBH

发明人： Jerg, Juergen ,  Schaible, Dietmar ,  Turki, Jamel-Eddine ,  Orso, Steffen ,  Baer, Alexander ,  Adam, Boris ,  Keil, Manuela

IPC分类号： H01L23/49 ,  H01L23/34 ,  H01L25/07

CPC分类号： H01L23/49575 ,  H01L23/34 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/84 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/37032 ,  H01L2224/37147 ,  H01L2224/37186 ,  H01L2224/3719 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48491 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14252 ,  H01L2924/181 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Die Erfindung betrifft eine Kontaktanordnung umfassend mindestens ein elektrisches und/oder elektronisches Bauelement (20), wobei das elektrische und/oder elektronische Bauelement (20) zumindest einen ersten und einen zweiten elektrischen Anschluss aufweist und diese jeweils eine Kontaktoberfläche zum mittelbaren oder unmittelbaren elektrischen Kontaktieren des elektrischen und/oder elektronischen Bauelementes (20) mit einer Schaltung umfassen.
Mindestens einer der Kontaktoberflächen ist mit zumindest einem Verbindungselement (60) verbunden, welches das mindestens eine elektrische und/oder elektronische Bauelement (20) mit der Schaltung verbindet. Ferner sind die zumindest eine der Kontaktoberflächen und das jeweilige zumindest eine Verbindungselement (60) oder eine Beschichtung des jeweiligen zumindest einen Verbindungselementes (60) jeweils aus einem Material gebildet, welche zusammen eine Materialpaarung aus Ag oder einer Ag-Legierung mit Al oder einer Al-legierung oder eine Materialpaarung aus Au oder einer Au-Legierung mit Al oder einer Al-Legierung ergeben. Zur Vermeidung einer Kontaktkorrosion ist die zumindest eine Kontaktoberfläche mit einer ersten Seite eines Kontaktplättchen (50) kontaktiert, während eine zweite Seite des Kontaktplättchen mit dem jeweiligen zumindest einen Verbindungselement (60) kontaktiert ist. Das Kontaktplättchen (50) ist dabei aus Cu, einer Cu-Legierung, Ni oder einer Ni-Legierung, aus Wolfram oder Molybdän gebildet oder die erste und/oder die zweite Seite des Kontaktplättchens weist eine Beschichtung auf, welche aus Cu, einer Cu-Legierung, Ni oder einer Ni-Legierung gebildet ist.

公开(公告)号：EP3057123A1

公开(公告)日：2016-08-17

申请号：EP14851457.3

申请日：2014-10-03

申请人： Furukawa Electric Co., Ltd.

发明人： KOJIMA Naoyuki ,  HIKASA Kazuhito ,  SATO Shunichiro ,  FUJIWARA Hidemichi ,  WATANABE Masato

IPC分类号： H01L21/603 ,  B22F7/00 ,  B22F7/04 ,  H01L21/52

CPC分类号： H01L24/83 ,  B22F7/004 ,  H01L21/4846 ,  H01L21/4871 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29387 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75986 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2924/0544 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0541 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/05432 ,  H01L2924/054 ,  H01L2924/01028 ,  H01L2924/01069 ,  H01L2924/0105 ,  H01L2924/053 ,  H01L2924/01051 ,  H01L2924/01046 ,  H01L2924/01022 ,  H01L2924/00012

摘要： Provided is a joining structure that prevents occurrence of a crack at a joining portion between a metal member and a metal porous body, and can achieve a highly reliable joining. The joining structure of the present invention has a metal member 1 and a metal porous body 2 formed on the metal member 1. The metal member 1 includes an outer layer 1b and an inner layer 1c, the outer layer 1b including one of main surfaces 1a and being formed on the metal porous body 2 side, the inner layer 1c being formed at a position farther from the metal porous body 2 than the outer layer 1b in a thickness direction, the outer layer 1b has an average crystal grain size ds that is smaller than an average crystal grain size di of the inner layer 1c, and the metal porous body 2 has an average crystal grain size dp that is smaller than or equal to the average crystal grain size ds of the outer layer 1b.

摘要翻译： 提供一种防止在金属构件和金属多孔体之间的接合部发生裂纹的接合结构，并且可以实现高可靠性的接合。 本发明的接合结构具有形成在金属构件1上的金属构件1和金属多孔体2.金属构件1包括外层1b和内层1c，外层1b包括主表面1a 并且形成在金属多孔体2侧，内层1c形成在厚度方向上比外层1b更远离金属多孔体2的位置，外层1b的平均晶粒尺寸ds为 小于内层1c的平均晶粒尺寸di，并且金属多孔体2的平均晶粒尺寸dp小于或等于外层1b的平均晶粒尺寸ds。

公开(公告)号：EP3054480A2

公开(公告)日：2016-08-10

申请号：EP15200325.7

申请日：2015-12-16

申请人： ROBERT BOSCH GMBH

发明人： Jerg, Juergen ,  Schaible, Dietmar ,  Turki, Jamel-Eddine ,  Orso, Steffen ,  Baer, Alexander ,  Adam, Boris ,  Keil, Manuela

IPC分类号： H01L23/49 ,  H01L23/34 ,  H01L25/07

CPC分类号： H01L23/49575 ,  H01L23/34 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/84 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/37032 ,  H01L2224/37147 ,  H01L2224/37186 ,  H01L2224/3719 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48491 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14252 ,  H01L2924/181 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Die Erfindung betrifft eine Kontaktanordnung umfassend mindestens ein elektrisches und/oder elektronisches Bauelement (20), wobei das elektrische und/oder elektronische Bauelement (20) zumindest einen ersten und einen zweiten elektrischen Anschluss aufweist und diese jeweils eine Kontaktoberfläche zum mittelbaren oder unmittelbaren elektrischen Kontaktieren des elektrischen und/oder elektronischen Bauelementes (20) mit einer Schaltung umfassen.
Mindestens einer der Kontaktoberflächen ist mit zumindest einem Verbindungselement (60) verbunden, welches das mindestens eine elektrische und/oder elektronische Bauelement (20) mit der Schaltung verbindet. Ferner sind die zumindest eine der Kontaktoberflächen und das jeweilige zumindest eine Verbindungselement (60) oder eine Beschichtung des jeweiligen zumindest einen Verbindungselementes (60) jeweils aus einem Material gebildet, welche zusammen eine Materialpaarung aus Ag oder einer Ag-Legierung mit Al oder einer Al-legierung oder eine Materialpaarung aus Au oder einer Au-Legierung mit Al oder einer Al-Legierung ergeben. Zur Vermeidung einer Kontaktkorrosion ist die zumindest eine Kontaktoberfläche mit einer ersten Seite eines Kontaktplättchen (50) kontaktiert, während eine zweite Seite des Kontaktplättchen mit dem jeweiligen zumindest einen Verbindungselement (60) kontaktiert ist. Das Kontaktplättchen (50) ist dabei aus Cu, einer Cu-Legierung, Ni oder einer Ni-Legierung, aus Wolfram oder Molybdän gebildet oder die erste und/oder die zweite Seite des Kontaktplättchens weist eine Beschichtung auf, welche aus Cu, einer Cu-Legierung, Ni oder einer Ni-Legierung gebildet ist.

摘要翻译： 本发明涉及一种接触组件，其包括至少一个电气和/或电子元件（20），其中所述电气和/或电子元件（20）包括至少第一和第二电连接，并且这些各自具有间接或直接的电接触的接触表面 包括电气和/或电子元件（20）的电路。 至少在接触表面中的一个被连接到至少一个连接元件（60），其中至少一个电气和/或电子元件（20）连接到所述电路。 此外，接触表面的至少一个和所述相应的至少一个连接元件（60）或相应的所述至少一个连接元件（60）的涂层的每一个一起形成的Ag的材料配对或Ag合金与Al或Al的材料形成 合金或Au的材料配对或Au合金与Al或Al合金的产率。 为了避免接触腐蚀，所述至少一个接触表面与接触板（50）的第一侧接触，而接触焊盘与相应的所述至少一个连接元件（60）的第二侧接触。 接触板（50）由Cu制成，所形成的Cu合金，Ni或Ni合金制成，钨或钼的，或接触垫的第一和/或第二侧具有涂层，该涂层的Cu，在Cu的 合金，Ni或Ni合金形成。