公开(公告)号：EP1034325B1

公开(公告)日：2005-08-31

申请号：EP98950142.4

申请日：1998-10-15

申请人： Lumilog

发明人： BEAUMONT, Bernard ,  GIBART, Pierre ,  GUILLAUME, Jean-Claude ,  NATAF, Gilles ,  VAILLE, Michel ,  HAFFOUZ, Soufien

IPC分类号： C30B25/02 ,  H01L33/00 ,  C30B29/40

CPC分类号： C30B25/02 ,  C30B29/406 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/0254 ,  H01L21/02573 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/02647 ,  H01L33/007 ,  H01S5/32341

摘要： The invention concerns a method for producing a gallium nitride (GaN) epitaxial layer characterised in that it consists in depositing on a substrate a dielectric layer acting as a mask and depositing on the masked gallium nitride, by epitaxial deposit, so as to induce the deposit of gallium nitride patterns and the anisotropic lateral growth of said patterns, the lateral growth being pursued until the different patterns coalesce. The deposit of the gallium nitride patterns can be carried out ex-situ by dielectric etching or in-situ by treating the substrate for coating it with a dielectric film whereof the thickness is of the order of one angstrom. The invention also concerns the gallium nitride layers obtained by said method.

公开(公告)号：EP1034325B9

公开(公告)日：2006-01-04

申请号：EP98950142.4

申请日：1998-10-15

申请人： Lumilog

发明人： BEAUMONT, Bernard ,  GIBART, Pierre ,  GUILLAUME, Jean-Claude ,  NATAF, Gilles ,  VAILLE, Michel ,  HAFFOUZ, Soufien

IPC分类号： C30B25/02 ,  H01L33/00 ,  C30B29/40

CPC分类号： C30B25/02 ,  C30B29/406 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/0254 ,  H01L21/02573 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/02647 ,  H01L33/007 ,  H01S5/32341

摘要： The invention concerns a method for producing a gallium nitride (GaN) epitaxial layer characterised in that it consists in depositing on a substrate a dielectric layer acting as a mask and depositing on the masked gallium nitride, by epitaxial deposit, so as to induce the deposit of gallium nitride patterns and the anisotropic lateral growth of said patterns, the lateral growth being pursued until the different patterns coalesce. The deposit of the gallium nitride patterns can be carried out ex-situ by dielectric etching or in-situ by treating the substrate for coating it with a dielectric film whereof the thickness is of the order of one angstrom. The invention also concerns the gallium nitride layers obtained by said method.