公开(公告)号：EP0446522B2

公开(公告)日：1997-08-27

申请号：EP90313187.8

申请日：1990-12-05

Applicant: MACDERMID INCORPORATED

Inventor： Kukanskis, Peter E. ,  Donlon, Edward T.

IPC: C23C18/16

CPC classification number: H05K3/422 ,  C23C18/163 ,  C23C18/1669 ,  H05K3/0088 ,  H05K3/187 ,  H05K3/42 ,  H05K2203/0292

公开(公告)号：EP0446522A1

公开(公告)日：1991-09-18

申请号：EP90313187.8

申请日：1990-12-05

Applicant: MACDERMID INCORPORATED

Inventor： Kukanskis, Peter E. ,  Donlon, Edward T.

IPC: C23C18/16

CPC classification number: H05K3/422 ,  C23C18/163 ,  C23C18/1669 ,  H05K3/0088 ,  H05K3/187 ,  H05K3/42 ,  H05K2203/0292

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

Abstract translation: 一种无电金属电镀工艺，特别是用于印刷电路基板中的通孔（14），更具体地说，用于在通孔表面上附加地沉积铜金属，其中基板至少间断地经受接触的振动运动 使用无电沉积槽（12）和用于进行该工艺的无电金属沉积设备。

公开(公告)号：EP0446522B1

公开(公告)日：1994-06-15

申请号：EP90313187.8

申请日：1990-12-05

Applicant: MACDERMID INCORPORATED

Inventor： Kukanskis, Peter E. ,  Donlon, Edward T.

IPC: C23C18/16

CPC classification number: H05K3/422 ,  C23C18/163 ,  C23C18/1669 ,  H05K3/0088 ,  H05K3/187 ,  H05K3/42 ,  H05K2203/0292

公开(公告)号：EP0469703A2

公开(公告)日：1992-02-05

申请号：EP91304565.4

申请日：1991-05-21

Applicant: MACDERMID INCORPORATED

Inventor： Donlon, Edward T.

IPC: H05K3/46

CPC classification number: H05K3/244 ,  H05K3/108 ,  H05K3/384 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2203/072

Abstract: Multilayer printed circuits, and methods for their fabrication, are provided, characterized in that the conductive circuitry of the circuitry innerlayers is built up from electroless copper, and the surfaces of the electroless copper which confront the sandwiching pre-preg resin layers are provided with a tin coating to promote adhesion of the electroless copper to the pre-preg resin layers. The invention is particularly suitable for preparing multilayer circuits having buried through-holes.

Abstract translation: 提供了多层印刷电路及其制造方法，其特征在于电路内层的导电电路由无电解铜构成，并且面对夹层预浸树脂层的化学镀铜的表面设置有 锡涂层以促进化学镀铜与预浸树脂层的粘附。 本发明特别适用于制备具有掩埋通孔的多层电路。