公开(公告)号：EP2711399B1

公开(公告)日：2014-12-31

申请号：EP13764808.5

申请日：2013-03-15

Applicant: Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou

IPC: C08L101/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K7/14 ,  C08L77/00 ,  H05K1/03 ,  H05K3/10 ,  C08K9/02

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10°C/min, of 250°C or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

公开(公告)号：EP2424338A1

公开(公告)日：2012-02-29

申请号：EP11185635.7

申请日：2008-06-06

Applicant: Dynamic Details, Inc.

Inventor： Sidhu, Rajwant Singh

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/427 ,  H05K1/116 ,  H05K3/243 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

Abstract translation: 印刷电路板具有带铜箔的一个或多个通孔填充孔的电路层及其制造方法。 本发明的一个实施例提供了一种通过（需要）经由填充来增强印刷电路板的通孔通孔的环绕电镀的一致性的方法，以向印刷电路板提供额外的可靠性，并且使设计者和/ 印刷电路板设计和制造具有相对精细特征和/或紧密几何形状的电路板。

公开(公告)号：EP2367966A2

公开(公告)日：2011-09-28

申请号：EP09807487.5

申请日：2009-12-04

Applicant: Bundesdruckerei GmbH

Inventor： MUTH, Oliver ,  HAGEMANN, Michael ,  PAESCHKE, Manfred ,  FLEISCHER, Peter ,  WEFRINGHAUS, Eckhardt

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/08 ,  C23C18/12 ,  H05K3/18

CPC classification number: C23C18/208 ,  C23C18/08 ,  C23C18/1208 ,  C23C18/1644 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/30 ,  H05K3/246 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2203/0716 ,  H05K2203/072

Abstract: The invention relates to a method for producing a layer that is conductive for electric current on a substrate, comprising the following method steps: a) a coating composed of a first formulation, which contains an organic binder, an aqueous or organic solvent and electrically conductive particles, is applied to the substrate, b) the substrate with the coating is subjected to a drying method stage, wherein the solvent is removed, c) the substrate with the dried coating is treated with a second formulation for autocatalytic electroless metal coating. The invention furthermore relates to a conductive structure obtainable in this way, and to a security and/or valuable document comprising such a conductive structure.

公开(公告)号：EP1705973B1

公开(公告)日：2011-05-11

申请号：EP06014607.3

申请日：1996-10-23

Applicant: IBIDEN CO., LTD.

Inventor： Kawamura, Yoichiro ,  Murase, Hideki ,  Asai, Motoo

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

公开(公告)号：EP1286578B1

公开(公告)日：2010-12-22

申请号：EP02026472.7

申请日：1998-10-12

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo, Ibiden Co., Ldt ,  Shimada, Kenichi, Ibiden Co., Ldt ,  Noda, Kouta, Ibiden Co., Ldt ,  Kayriya, Takashi, Ibiden Co., Ldt ,  Segawa, Hiroshi, Ibiden Co., Ldt

IPC: H05K3/46

CPC classification number: B32B3/00 ,  H05K3/0094 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10S428/901 ,  Y10T428/24917

公开(公告)号：EP2048921A3

公开(公告)日：2010-11-24

申请号：EP08166117.5

申请日：2008-10-08

Applicant: Honeywell International Inc.

Inventor： Tullidge, Lee H. ,  De Oto, Leonard ,  Larson, Tim ,  O'Keefe, Patrick ,  Gertz, Herb

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/113 ,  H05K3/108 ,  H05K3/243 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/1492 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A device and method of heat sinking a surface mount device (SMD) component. The method includes: forming through holes in a printed circuit board (PCB), electroless plating a first copper layer in the holes, standard plating a second copper layer in the holes and surrounding surfaces of the PCB, masking and pulse plating a third copper layer in the holes, filling the holes with non-conductive material and sanding flush with the second copper layer, electroless plating a fourth copper layer on the PCB over the area of the holes, plating a fifth copper layer (or pad) on the PCB over the area of the holes, and attaching a surface mount device to the fifth copper layer.

公开(公告)号：EP2244541A1

公开(公告)日：2010-10-27

申请号：EP10172558.8

申请日：2008-02-19

Applicant: SIIX Corporation

Inventor： Matsushima, Yoshihiko

IPC: H05K3/34 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

Abstract: A surface mount circuit board includes: an insulating substrate having through holes each extending from front to rear surfaces of the insulating substrate; high thermal conductive members each filing a different one of the though holes; lands each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the front surface around the peripheral edge of the corresponding through hole; and heat receiving members each disposed to cover an end surface ofa different one of the high thermal conductive members and also cover part of the rear surface around the peripheral edge of the corresponding through hole. Each land may be made of solder cream filled into and flashed out of the through hole. Alternatively to the high thermal conductive members, wire rods may be fitted into the respective through holes.

Abstract translation: 表面安装电路板包括：绝缘基板，其具有从绝缘基板的前后表面延伸的通孔; 高导热构件，每个填充不同的通孔; 每个设置成覆盖不同的一个高导热构件的端表面并且还覆盖围绕相应通孔的周缘的前表面的一部分; 以及热接收构件，每个热接收构件设置成覆盖不同的一个高导热构件的端表面，并且还覆盖围绕相应通孔的周缘的后表面的一部分。 每个地面可以由填充并从通孔中闪出的焊膏制成。 作为高导热构件的替代方案，线棒可以装配到相应的通孔中。

公开(公告)号：EP1903842B1

公开(公告)日：2010-08-25

申请号：EP08000185.2

申请日：1999-06-23

Applicant: Ibiden Co., Ltd.

Inventor： Nishiwaki, Yoko ,  Noda, Kouta

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4626 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/0094 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  Y10T29/49155

公开(公告)号：EP2182787A1

公开(公告)日：2010-05-05

申请号：EP08275066.2

申请日：2008-10-30

Applicant: BAE Systems PLC

Inventor： The designation of the inventor has not yet been filed

IPC: H05K3/24 ,  C25D5/04

CPC classification number: C25D5/04 ,  C25D5/02 ,  H05K3/1241 ,  H05K3/188 ,  H05K3/241 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0195 ,  H05K2203/092 ,  H05K2203/101

Abstract: A method of and apparatus for forming components on a substrate.
The method comprise in a first step applying a surface treatment to said substrate to form a patterned area having at least some electrical conductivity; in a second step electroplating onto the patterned area by means of a tool comprising a first electrode and a source for in situ supply of electrolyte, by providing an anode current to the first electrode, causing the patterned area at least in the vicinity of the tool to function as a cathode, and passing electrolyte between said patterned area and said first electrode, thereby to deposit conductive material onto said patterned area. The apparatus implements the method.
Conductive material may be built up to an extent that the component so formed approximates to the bulk properties of the conductive material. The surface treatment itself therefore is not required to create good conduction properties.

Abstract translation: 一种在基板上形成部件的方法和装置。 该方法包括在第一步骤中对所述衬底施加表面处理以形成具有至少一些导电性的图案化区域; 在通过向第一电极提供阳极电流的工具中，通过包括第一电极和原位供应电解质的源的工具电镀到图案化区域上的第二步骤中，使至少在工具附近的图案化区域 用作阴极，并且在所述图案化区域和所述第一电极之间通过电解质，由此将导电材料沉积到所述图案化区域上。 该装置实现该方法。 导电材料可以构建成使得如此形成的部件接近于导电材料的整体性质的程度。 因此，表面处理本身不需要产生良好的导电性能。

公开(公告)号：EP2162566A1

公开(公告)日：2010-03-17

申请号：EP08768194.6

申请日：2008-06-06

Applicant: Dynamic Details, Inc.

Inventor： SIDHU, Rajwant, Singh

IPC: C23C18/16 ,  H05K3/18

CPC classification number: H05K3/427 ,  H05K1/116 ,  H05K3/243 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.