摘要:
When a piezoelectric thin film device (D), composed of a piezoelectric thin film (1), 1st and 2nd electrode films (2 and 3) formed on both the surfaces in the thickness direction of the piezoelectric thin film (1) and a support film (5) supporting the piezoelectric thin film (1), is manufactured by forming the respective films (1, 2, 3 and 5) on a film forming substrate (11) and then removing the film forming substrate (11) by etching, and even if the support film (5) is made of resin, etc. and an adhesion force between the support film and other films is relatively low, damages to a piezoelectric thin film (1) by an etchant can be securely prevented. For that purpose, the 1st electrode film (2), in contact with the film forming substrate (11), is formed so as to have its whole circumferential edge protrude sidewise beyond the side surface of the piezoelectric thin film (1) for tight adhering to the support film (5).