公开(公告)号：EP0794572A3

公开(公告)日：2003-09-03

申请号：EP97103756.9

申请日：1997-03-06

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Takata, Hirofumi ,  Tanida, Tadashi

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3426 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lead has a thick part having a thickness of 0. 2 mm and a thin part having a thickness of 0. 1 mm. The thin part is formed having a greater width than the thick part for preventing the lead from slipping from a resin. A semiconductor chip is fixed on the thin part using a conductive adhesive. A lateral surface of the thick part and a lateral surface of the resin are simultaneously formed by a single cut so that the thick part's lateral surface is located at a lower end area of the resin's lateral surface and these surfaces are exposed forming the same plane. A bottom surface of the thick part projects by from 0. 03 mm to 0. 05 mm from the resin bottom surface to meet lead stand-off specifications. Thick parts of other leads electrically connected with electrodes on the semiconductor chip with Au wires, are likewise exposed at the resin lateral surface and project from the resin bottom surface. Such arrangements realize high density mounting of electronic components onto a printed board.

公开(公告)号：EP1517371A3

公开(公告)日：2006-07-12

申请号：EP04030843.9

申请日：1997-03-06

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Takata, Hirofumi ,  Tanida, Tadashi

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3426 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of fabricating a plurality of electronic components of a resin molded package type, said method comprising: over a plate-like lead frame comprising a plurality of bridge parts which are formed into a lattice and a plurality of sets of lead parts which extend towards a plurality of lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said plurality of bridge parts, a step of fixing each of a plurality of electronic elements in a corresponding lattice open space of said plurality of lattice open spaces.

公开(公告)号：EP1517372A2

公开(公告)日：2005-03-23

申请号：EP04030844.7

申请日：1997-03-06

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

发明人： Takata, Hirofumi ,  Tanida, Tadashi

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3426 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A plate-like lead frame for use in fabrication of an electronic component of a resin molded package type, said lead frame comprising: (a) a rectangular exterior frame; (b) a plurality of bridge parts which are formed into a lattice so as to establish connections between a pair of opposite sides of said rectangular exterior frame as well as between another pair of opposite sides thereof; and (c) a plurality of sets of lead parts which extend towards respective lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said bridge parts, each said lead part comprising: (d) a base end having the same thickness as said exterior frame and said bridge part; and (e) a leading end which is formed, having a width greater than the width of said base end and having a thickness smaller than the thickness of said base end so as to form a step on the side of a bottom surface thereof and a mold assembly for use in fabrication of an electronic component of a resin molded package type.

摘要翻译： 为在树脂密封封装型的电子部件的制造中使用的板状引线架，所述引线框架包括：（a）一个矩形的外部框架; （B）的连接部分的多个形成为格子，以建立一对所述矩形的外部框架的相对侧之间，以及另一对它们的相对侧之间的连接; 和（c）的组引线部哪个朝向respectivement栅格空间哪些是水平地和垂直地延伸多个，并且二维地由所述桥部分，每个所述引线部件包括定义：具有相同厚度（d）的基端 作为所述外框架和所述桥部; 和（e）的前端的所有其上形成，具有宽度比所述基端部的宽度大，其厚度比所述基端部的厚度小，以便形成在其底表面侧的步骤体和一个 模具组件用于在树脂密封封装型的电子部件的制造中使用。

公开(公告)号：EP1517371A2

公开(公告)日：2005-03-23

申请号：EP04030843.9

申请日：1997-03-06

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

发明人： Takata, Hirofumi ,  Tanida, Tadashi

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3426 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of fabricating a plurality of electronic components of a resin molded package type, said method comprising: over a plate-like lead frame comprising a plurality of bridge parts which are formed into a lattice and a plurality of sets of lead parts which extend towards a plurality of lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said plurality of bridge parts, a step of fixing each of a plurality of electronic elements in a corresponding lattice open space of said plurality of lattice open spaces.

摘要翻译： 一种制造树脂密封封装型的电子组件的多个方法，所述方法包括：在板状的引线框架，其包括连接部分的多个形成为格子和的组引线部的多个朝向延伸 栅格空间哪些是水平地和垂直地，和二维地通过的桥部分，所述多个，在所述多个栅格空间中的对应的格子的开放空间的每个电子元件的多个固定的步骤中定义的复数。