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公开(公告)号：EP0656570A1
公开(公告)日：1995-06-07
申请号：EP93309648.9
申请日：1993-12-02
CPC分类号： H04N1/00525 , G03G15/00 , G03G15/04045 , G03G15/326 , G03G2215/00012
摘要： An image forming apparatus according to the present invention includes: a case (100) having at least six planes among which two (120,130) or more placement planes are usable as a bottom when placing the apparatus; a photosensitive body (1); an exposing device (400) for irradiating the photosensitive body with a light to form a latent image on the photosensitive body; a developing device (2) for developing the latent image formed on the photosensitive body to form a developer image; a transfer roller (500) for transferring the developer image on a recording paper; and a fixing device (600) for thermally fixing a transferred image on the recording paper after image transference. The fixing device is always above the photosensitive body, the developing device, and the exposing device, whichever plane is selected from the two or more placement planes as a bottom when placing the apparatus.
摘要翻译： 根据本发明的图像形成装置包括：具有至少六个平面的壳体（100），其中当放置所述装置时，其中两个（120,130）或更多个放置平面可用作底部; 感光体（1）; 曝光装置（400），用于用光照射感光体以在感光体上形成潜像; 显影装置（2），用于显影形成在感光体上的潜像以形成显影剂图像; 转印辊（500），用于将记录纸上的显影剂图像转印; 以及定影装置（600），用于在图像转印之后将转印的图像热定影在记录纸上。 当放置设备时，定影装置总是在感光体，显影装置和曝光装置的上方，无论哪个平面从两个或更多个放置平面中选择为底部。
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公开(公告)号：EP1553815A3
公开(公告)日：2007-11-21
申请号：EP05003553.4
申请日：2001-03-23
发明人： Ueno, Yasuharu , Minamitani, Shozo , Kanayama, Shinji , Shimizu, Takashi , Sida, Satoshi , Onobori, Shunji
CPC分类号： H01L21/67144 , H01L24/75 , H05K13/08 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187
摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at the component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted on a substrate such as circuit board. The component held by the placement head is recognized by an imaging device at or in the vicinity of the transfer station.
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3.发明公开Apparatus and method for mounting component 有权Einrichtung und vorrichtung zur montage von bauteilen
公开(公告)号：EP1553815A2
公开(公告)日：2005-07-13
申请号：EP05003553.4
申请日：2001-03-23
发明人： Ueno, Yasuharu , Minamitani, Shozo , Kanayama, Shinji , Shimizu, Takashi , Sida, Satoshi , Onobori, Shunji
CPC分类号： H01L21/67144 , H01L24/75 , H05K13/08 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187
摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at the component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted on a substrate such as circuit board. The component held by the placement head is recognized by an imaging device at or in the vicinity of the transfer station.
摘要翻译： 组件安装系统包括第一到第三（拾取，传输和放置）站。 在部件供应处提供的部件由拾取站处的运输头拾取，然后转移到转运站的放置头。 放置头将部件运送到放置部件，其中部件被放置并安装在诸如电路板的基板上。 由放置头保持的部件由成像装置识别在传送站处或其附近。
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