公开(公告)号：EP0955795A3

公开(公告)日：2001-03-14

申请号：EP99108590.3

申请日：1999-05-07

申请人： Matsushita Electric Industrial Co., Ltd.

发明人： Omoya, Kazunori ,  Suzuki, Takeshi ,  Ogawa, Tatsuo ,  Oobayashi, Takashi

IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/462 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  Y10S428/901

摘要： A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20µm and whose specific surface area ranges from 0.05 to 1.5m 2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol% of the epoxy group, and the epoxy equivalent ranges from 100 to 350g/eq. The conductive paste for filling via-holes and a printed circuit board (104) comprising thereof can be used to provide an inner-via-hole connection (103) between electrode layers (102) without using a through-hole plating technique.

公开(公告)号：EP1154470A3

公开(公告)日：2001-12-19

申请号：EP01114366.6

申请日：1996-01-30

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Omoya, Kazunori ,  Oobayashi, Takashi ,  Sakurai, Wataru ,  Harada, Mitsuru ,  Bessho, Yoshihiro

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/485

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： An improved semiconductor unit package method is disclosed. This method is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa · s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

摘要翻译： 公开了一种改进的半导体单元封装方法。 该方法通过具有电极焊盘，具有端子电极的基板，形成在电极焊盘上的凸块电极，具有柔性的导电粘合层以及通过固化组合物形成的封装层的半导体器件实现，所述组合物的粘度和触变指数 其中分别低于100Pa·s和低于1.1。 这种组合物基本上由（A）含有例如聚环氧化物，酸酐和流变改性剂的树脂粘合剂和（B）填料组成。 流变改性剂是能够阻止酸酐中所含的游离酸与填料表面上的极性基团之间的相互作用的流变改性剂。 使用具有改善的流动性的密封剂，使得密封剂容易流动并扩散以填充半导体器件和基板之间的无气泡的间隙。 这实现了具有高可靠性和生产率的半导体单元封装。

公开(公告)号：EP0724289A3

公开(公告)日：1996-12-04

申请号：EP96101286.1

申请日：1996-01-30

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Omoya, Kazunori ,  Oobayashi, Takashi ,  Sakurai, Wataru ,  Harada, Mitsuru ,  Bessho, Yoshihiro

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/485

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa·s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

摘要翻译： 一种改进的半导体单元的封装方法是游离缺失盘。 此方法由具有电极焊盘的半导体器件实现，具有端子电极的衬底，凸块电极形成在所述电极焊盘，导电粘附层具有柔性，并且通过固化组合物的粘度和触变性指数FORMED包封层 这些都低于100帕。 秒和1.1以下，分别。 这样的组合物基本上由（A）的树脂粘合剂含有那样，对于实施例besteht，一个聚环氧化合物，以酸酐，和流变改性剂和（B）的填料。 所述流变改性剂是一种能在填充物的表面阻碍包含在酸酐中的游离酸和极性基团之间的相互作用。 具有改进的流动性的密封剂被使用，所以没有密封剂容易流动并扩散以填充半导体装置和无气泡的基板之间的间隙。 这实现了半导体单元封装具有高可靠性和生产率。

公开(公告)号：EP0955795B1

公开(公告)日：2003-08-06

申请号：EP99108590.3

申请日：1999-05-07

申请人： Matsushita Electric Industrial Co., Ltd.

发明人： Omoya, Kazunori ,  Suzuki, Takeshi ,  Ogawa, Tatsuo ,  Oobayashi, Takashi

IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/462 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  Y10S428/901

公开(公告)号：EP0878839A1

公开(公告)日：1998-11-18

申请号：EP98113704.5

申请日：1996-01-30

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Omoya, Kazunori ,  Oobayashi, Takashi ,  Sakurai, Wataru ,  Harada, Mitsuru ,  Bessho, Yoshihiro

IPC分类号： H01L21/56 ,  H01L23/29

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： An improved semiconductor unit package is implemented by a semiconductor device having an electrode pad (2), a substrate (6) having a terminal electrode (5), a bump electrode (3) formed on the electrode pad (2), a conductive adhesion layer (4) with flexibility, and an encapsulating layer (7) formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa·s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant (7) with improved flowability is used, so that the encapsulant (7) readily flows and spreads to fill a gap between the semiconductor device (1) and the substrate (6) with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

摘要翻译： 基材的改进的半导体单元的封装通过具有在电极焊盘的半导体装置（2），（6），其具有端子电极（5）上，凸块电极（3）上形成的电极垫（2），导电粘合实现 层（4）具有柔性，并封装通过固化组合物的粘度，并且其触变指数形成的层（7）分别为低于100 Pa和1.1以下。 这样的组合物基本上由（A）的树脂粘合剂含有那样，对于实施例besteht，一个聚环氧化合物，以酸酐，和流变改性剂和（B）的填料。 所述流变改性剂是一种能在填充物的表面阻碍包含在酸酐中的游离酸和极性基团之间的相互作用。 密封剂（7）具有改进的流动性，使用，如此做了密封剂（7）容易流动并扩散到填充半导体装置（1）和基片（6）与没有气泡之间的间隙。 这实现了半导体单元封装具有高可靠性和生产率。

公开(公告)号：EP0878839B1

公开(公告)日：2003-06-18

申请号：EP98113704.5

申请日：1996-01-30

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Omoya, Kazunori ,  Oobayashi, Takashi ,  Sakurai, Wataru ,  Harada, Mitsuru ,  Bessho, Yoshihiro

IPC分类号： H01L21/56 ,  H01L23/29

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： An improved semiconductor unit package method is disclosed. This method is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa . s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

公开(公告)号：EP1154470A2

公开(公告)日：2001-11-14

申请号：EP01114366.6

申请日：1996-01-30

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Omoya, Kazunori ,  Oobayashi, Takashi ,  Sakurai, Wataru ,  Harada, Mitsuru ,  Bessho, Yoshihiro

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/485

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： An improved semiconductor unit package method is disclosed. This method is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa · s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

摘要翻译： 公开了一种改进的半导体单元封装方法。 该方法由具有电极焊盘，具有端子电极的基板，在电极焊盘上形成的突起电极，具有柔软性的导电性粘合层，以及通过使组合物固化的粘度和触变性指数形成的封装层的半导体装置 其中100Pa以下。 分别为1.1以下。 这种组合物基本上由（A）含有例如聚环氧化物，酸酐和流变改性剂的树脂粘合剂组成，（B）填料。 流变改性剂是能够阻碍酸酐中所含的游离酸与填料表面的极性基团之间相互作用的改性剂。 使用具有改善的流动性的密封剂，使得密封剂容易流动和扩散以填充半导体器件和衬底之间的间隙，而没有气泡。 这实现了具有高可靠性和生产率的半导体单元封装。

公开(公告)号：EP0955795A2

公开(公告)日：1999-11-10

申请号：EP99108590.3

申请日：1999-05-07

申请人： Matsushita Electric Industrial Co., Ltd.

发明人： Omoya, Kazunori ,  Suzuki, Takeshi ,  Ogawa, Tatsuo ,  Oobayashi, Takashi

IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/462 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  Y10S428/901

摘要： A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 µm and whose specific surface area ranges from 0.05 to 1.5m 2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol% of the epoxy group, and the epoxy equivalent ranges from 100 to 350g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique.

摘要翻译： 一种用于通孔填充糊被提供，并且包含导电性颗粒，其平均直径为0.5〜20微米和比表面积从0点05的范围中的至少（一个）30〜70体积％至1.5M <2 > / g，并且其包含环氧树脂的至少10％（重量）每分子包含至少一个环氧基团，其中羟基基团的总量成氨基树脂（b）的70-30％（体积）和羧基 不是环氧基团的大于5摩尔％，环氧当量为100〜350克/升范围当量。 用导电性糊剂的通孔和在印刷电路板，其包括填充，可以使用通孔中的电极层之间内通孔连接，而无需使用电镀技术来提供。

公开(公告)号：EP0724289A2

公开(公告)日：1996-07-31

申请号：EP96101286.1

申请日：1996-01-30

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Omoya, Kazunori ,  Oobayashi, Takashi ,  Sakurai, Wataru ,  Harada, Mitsuru ,  Bessho, Yoshihiro

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/485

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa·s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

摘要翻译： 一种改进的半导体单元的封装是游离缺失盘。 此包由具有电极焊盘的半导体器件实现，具有端子电极的衬底，凸块电极形成在所述电极焊盘，导电粘附层具有柔性，并且通过固化组合物的粘度和触变性指数FORMED包封层 这些都低于100 Pa和1.1以下，分别。 这样的组合物基本上由（A）的树脂粘合剂含有那样，对于实施例besteht，一个聚环氧化合物，以酸酐，和流变改性剂和（B）的填料。 所述流变改性剂是一种能在填充物的表面阻碍包含在酸酐中的游离酸和极性基团之间的相互作用。 具有改进的流动性的密封剂被使用，所以没有密封剂容易流动并扩散以填充半导体装置和无气泡的基板之间的间隙。 这实现了半导体单元封装具有高可靠性和生产率。