Composite plating coatings
    1.
    发明公开
    Composite plating coatings 失效
    Dispersionsüberzüge。

    公开(公告)号:EP0573918A1

    公开(公告)日:1993-12-15

    申请号:EP93109035.1

    申请日:1993-06-04

    IPC分类号: C25D15/02 C23C18/52

    CPC分类号: C23C18/52 C25D15/02

    摘要: A composite plating coating including a metal plating coating which is dispersed with an antibacterial and antifungal composition and/or a fragrant composition. Particularly, by dispersing carriers absorbed with an antibacterial and antifungal composition and a fragrant composition in a metal plating coating, a composite plating coating with an antibacterial and antifungal effect and a fragrance effect can be obtained.

    摘要翻译: 一种复合电镀涂层,包括用抗菌和抗真菌组合物和/或芳香组合物分散的金属镀覆层。 特别是通过将抗菌,抗真菌剂,芳香剂组合物吸收的载体分散在金属镀覆层中,可以获得具有抗菌,抗真菌效果和香味效果的复合镀覆层。

    Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method
    2.
    发明公开
    Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method 失效
    含有Schädlingsabstossendes剂的电子部件内置材料,其在电子元件使用,并且用于制备过程

    公开(公告)号:EP0856556A2

    公开(公告)日:1998-08-05

    申请号:EP98101452.5

    申请日:1998-01-28

    IPC分类号: C08L63/00 A01N53/00

    摘要: To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow.
    A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.

    摘要翻译: 为了呈现印刷线路板和具有甚至焊料回流或焊锡流动后具有优异的驱除蟑螂的性能的其它电子元件。 提供了一种绝缘层作为底物上具有安装用接合区的导电层,阻焊剂被施加到覆盖不包括安装焊盘的导电层,以及含有蟑螂驱除剂的电子部件材料被施加在阻焊剂。 该电子部件材料为含有树脂通过交联,蟑螂驱除剂,和填料的可固化的糊剂:如二氧化硅或滑石,和通过交联和固化通过化学反应的树脂,干燥的驱除蟑螂的层被暴露并且在表面上形成 的印刷布线板。

    Antiviral composition
    5.
    发明公开
    Antiviral composition 失效
    Antivirale Zusammensetzung。

    公开(公告)号:EP0593042A1

    公开(公告)日:1994-04-20

    申请号:EP93116576.5

    申请日:1993-10-13

    IPC分类号: A01N59/16 A01N59/20

    摘要: An antiviral composition comprising: a thiosulfate salt and at least one of thiosulfate complex salt of a metal and a porous particulate carrier; said metal being at least one selected from the group consisting of silver, copper and zinc; said salts being carried on said porous particulate carrier. It is applicable to a wide range of living environment such as medical instruments and appliances, hygienic implements as well as kitchen utensils, and also demonstrates an antibacterial activity in addition to the antiviral activity. The composition releases its salts slowly to the environment and the antiviral and antibacterial activities of said composition lasts for a long period of time. A method for preparing said composition as well as an antiviral disinfection method and a virucidal disinfection fluid using said composition are also disclosed.

    摘要翻译: 一种抗病毒组合物,其包含:硫代硫酸盐和金属和多孔颗粒载体的硫代硫酸盐配盐中的至少一种; 所述金属为选自银,铜和锌的至少一种; 所述盐被承载在所述多孔颗粒载体上。 它适用于各种生活环境,如医疗仪器和电器,卫生用具以及厨房用具,除抗病毒活性外,还具有抗菌活性。 该组合物缓慢地将其盐释放到环境中,并且所述组合物的抗病毒和抗菌活性持续很长时间。 还公开了使用所述组合物制备所述组合物的方法以及抗病毒消毒方法和杀病毒消毒液。

    Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method
    7.
    发明公开
    Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method 失效
    含有驱虫剂的电子部件材料,使用其的电子部件及其制造方法

    公开(公告)号:EP0856556A3

    公开(公告)日:1998-09-09

    申请号:EP98101452.5

    申请日:1998-01-28

    IPC分类号: C08L63/00 A01N53/00

    摘要: To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow. A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.

    摘要翻译: 即使在焊料回流或焊料流动之后,也能呈现具有优异蟑螂排斥性能的印刷线路板和其它电子元件。 在作为基板的绝缘层上设置具有安装焊盘的导电层,涂布阻焊剂以覆盖除安装焊盘以外的导电层,并且将包含蟑螂驱除剂的电子部件材料涂覆在阻焊剂上。 该电子部件材料是含有通过交联固化的树脂,蟑螂驱除剂和填充剂如二氧化硅或滑石的膏体,并且通过化学反应使树脂交联和固化,干燥的蟑螂驱除层暴露并在表面上形成 的印刷线路板。

    An antibacterial and antifungal composition
    8.
    发明公开
    An antibacterial and antifungal composition 失效
    Bakterizide和Fungizide Zusammensetzung。

    公开(公告)号:EP0488269A1

    公开(公告)日:1992-06-03

    申请号:EP91120360.2

    申请日:1991-11-28

    摘要: An antibacterial and antifungal composition which comprises an antibacterial and antifungal material carried on a porous particle carrier is provided. Preferably, the porous particle carrier is a silica gel particle.
    For the antibacterial and antifungal material used in this invention, at least one substance selected from the group consisting of metal complex salts, plant extracts, quarternary ammonium salts and chlorhexidine or its derivatives is used.
    At least a portion of the surface of the above-mentioned carrier having the antibacterial and antifungal composition can be coated with a coating material.
    It is possible to use the antibacterial and antifungal composition obtained as described above by being contained in a resin, and also, in a caulking base material.

    摘要翻译: 提供了一种抗菌和抗真菌组合物,其包含携带在多孔颗粒载体上的抗细菌和抗真菌物质。 优选地,多孔颗粒载体是硅胶颗粒。 对于本发明中使用的抗细菌和抗真菌材料,使用至少一种选自金属络合物盐,植物提取物,季铵盐和氯己定或其衍生物的物质。 具有抗细菌和抗真菌组合物的上述载体的表面的至少一部分可涂覆有涂层材料。 可以使用通过包含在树脂中以及在填缝基材中使用如上所述获得的抗菌和抗真菌组合物。