公开(公告)号：EP0794572A2

公开(公告)日：1997-09-10

申请号：EP97103756.9

申请日：1997-03-06

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： Takata, Hirofumi ,  Tanida, Tadashi

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3426 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lead has a thick part having a thickness of 0. 2 mm and a thin part having a thickness of 0. 1 mm. The thin part is formed having a greater width than the thick part for preventing the lead from slipping from a resin. A semiconductor chip is fixed on the thin part using a conductive adhesive. A lateral surface of the thick part and a lateral surface of the resin are simultaneously formed by a single cut so that the thick part's lateral surface is located at a lower end area of the resin's lateral surface and these surfaces are exposed forming the same plane. A bottom surface of the thick part projects by from 0. 03 mm to 0. 05 mm from the resin bottom surface to meet lead stand-off specifications. Thick parts of other leads electrically connected with electrodes on the semiconductor chip with Au wires, are likewise exposed at the resin lateral surface and project from the resin bottom surface. Such arrangements realize high density mounting of electronic components onto a printed board.

摘要翻译： 引线具有厚度为0.2mm的厚部分和厚度为0.1mm的薄部分。 薄部形成为具有比厚部更宽的宽度，以防止铅从树脂上滑落。 使用导电粘合剂将半导体芯片固定在薄部分上。 厚的部分的侧表面和树脂的侧表面同时由单个切口形成，使得厚部的侧表面位于树脂的侧表面的下端区域，并且这些表面暴露形成同一平面。 较厚部分的底面从树脂底面突出0.03-0.05mm，以符合导线限位规格。 在半导体芯片上与Au线电连接的其它引线的厚部同样在树脂侧表面露出并从树脂底表面突出。 这样的布置实现了电子部件在印刷电路板上的高密度安装。